-
公开(公告)号:US09051141B2
公开(公告)日:2015-06-09
申请号:US14009386
申请日:2012-04-05
申请人: Shinobu Kato
发明人: Shinobu Kato
CPC分类号: B65H3/0676 , B65H1/022 , B65H3/0661 , B65H3/5261 , B65H3/56 , B65H5/06 , B65H2402/441 , B65H2402/46
摘要: A sheet conveying apparatus includes an intermediate plate (21b) as a sheet receiving member configured to stack a sheet, a feed roller (22) as a feed rotator configured to feed the sheet stacked on the intermediate plate (21b), and a separation roller (23) as a separation member configured to separate the sheet from a sheet bundle stacked on the intermediate plate (21b). The sheet conveying apparatus further includes a restrict member (60) as a restrict portion disposed so as to reach a position overlapped in a width direction orthogonal to a sheet conveying direction with the feed roller (22) as at least one member among the feed roller (22) and the separation roller (23) and offset in the width direction from the feed roller (22), and restricting a leading end position of the sheet stacked on the intermediate plate (21b). This arrangement enables to improve sheet conveying performance because the restrict member (60) can restrict the leading end position of the sheet stacked on the intermediate plate (21b).
摘要翻译: 片材输送装置包括:中间板(21b),作为被构造成堆叠片材的片材接收构件;馈送辊(22),其被配置为馈送堆叠在中间板(21b)上的片材的馈送旋转器;以及分离辊 (23),其被构造成将片材与堆叠在中间板(21b)上的片材束分离。 片材输送装置还包括作为限制部件的限制部件(60),该限制部件设置成在进给辊(22)中至少一个构件到达与纸张输送方向正交的宽度方向上重叠的位置 (22)和分离辊(23),并且在宽度方向上与进给辊(22)偏移,并且限制堆叠在中间板(21b)上的薄片的前端位置。 由于限制部件(60)可以限制堆叠在中间板(21b)上的片材的前端位置,所以能够提高片材输送性能。
-
公开(公告)号:US08415781B2
公开(公告)日:2013-04-09
申请号:US13205027
申请日:2011-08-08
申请人: Takashi Kariya , Toshiki Furutani , Shinobu Kato
发明人: Takashi Kariya , Toshiki Furutani , Shinobu Kato
CPC分类号: H01L24/19 , H01L21/568 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L24/06 , H01L24/17 , H01L24/20 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/0401 , H01L2224/04105 , H01L2224/06135 , H01L2224/06177 , H01L2224/12105 , H01L2224/13 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/73209 , H01L2224/73217 , H01L2224/81192 , H01L2224/9202 , H01L2224/92124 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/09701 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/351 , H01L2924/00
摘要: An electronic component including a wiring board having a power-source pattern and a signal pattern, a semiconductor element mounted on the wiring board and having a power-source electrode pad and a signal electrode pad, a first connection portion being made of a conductive material and connecting the signal pattern of the wiring board and the signal electrode pad of the semiconductor element, and a second connection portion being made of a conductive material and connecting the power-source pattern of the wiring board and the power-source electrode pad of the semiconductor element. The conductive material of the first connection portion and the conductive material of the second connection portion are selected such that the conductive material of the second connection portion has an electrical resistance which is lower than an electrical resistance of the conductive material of the first connection portion.
摘要翻译: 一种电子部件,包括具有电源图案和信号图案的布线板,安装在布线基板上并具有电源电极焊盘和信号电极焊盘的半导体元件,第一连接部分由导电材料制成 并且连接所述布线板的信号图案和所述半导体元件的信号电极焊盘;以及第二连接部,其由导电材料制成,并且将所述布线板的电源图案和所述电源电极焊盘 半导体元件。 选择第一连接部分的导电材料和第二连接部分的导电材料,使得第二连接部分的导电材料具有低于第一连接部分的导电材料的电阻的电阻。
-
公开(公告)号:US07956291B2
公开(公告)日:2011-06-07
申请号:US10551439
申请日:2004-04-06
申请人: Shinobu Kato
发明人: Shinobu Kato
IPC分类号: H05K1/16
摘要: In a core substrate 30, a ground through hole 36E and a power through hole 36P are disposed in the grid formation, so that electromotive force induced in X direction and Y direction cancel out each other. As a result, even if mutual inductance is reduced and a high frequency IC chip is loaded, electric characteristic and reliability can be improved without generating malfunction or error.
-
公开(公告)号:US20110102122A1
公开(公告)日:2011-05-05
申请号:US12985475
申请日:2011-01-06
申请人: Yasuhiko MANO , Takashi KARIYA , Shinobu KATO
发明人: Yasuhiko MANO , Takashi KARIYA , Shinobu KATO
CPC分类号: H05K3/4046 , H01F17/0006 , H01F17/06 , H01F41/046 , H01F2017/002 , H01F2017/065 , H01L23/645 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/3011 , H01L2924/3025 , H05K1/0233 , H05K1/115 , H05K1/185 , H05K3/42 , H05K3/4602 , H05K2201/086 , H05K2201/09581 , Y10T29/4902 , H01L2224/05599
摘要: A printed wiring board including a substrate having a first surface and a second surface on the opposite side of the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, a magnetic body embedded in the substrate and extending in a thickness direction of the substrate, the magnetic body having a through-hole formed through the magnetic body and extending in the thickness direction of the substrate, and a through-hole conductor formed on an inner surface of the through-hole of the magnetic body such that the first and second conductive circuits are electrically connected to each other through the through-hole conductor.
摘要翻译: 一种印刷电路板,包括具有在所述第二表面的相对侧上的第一表面和第二表面的基板,形成在所述基板的第一表面上的第一导电电路,形成在所述基板的第二表面上的第二导电电路, 磁性体,其嵌入到所述基板中并沿着所述基板的厚度方向延伸,所述磁性体具有通过所述磁性体形成并在所述基板的厚度方向上延伸的通孔,以及形成在所述基板的内部的通孔导体 磁体的通孔的表面,使得第一和第二导电电路通过通孔导体彼此电连接。
-
公开(公告)号:US07868728B2
公开(公告)日:2011-01-11
申请号:US12692907
申请日:2010-01-25
申请人: Yasuhiko Mano , Takashi Kariya , Shinobu Kato
发明人: Yasuhiko Mano , Takashi Kariya , Shinobu Kato
IPC分类号: H01F5/00
CPC分类号: H05K3/4046 , H01F17/0006 , H01F17/06 , H01F41/046 , H01F2017/002 , H01F2017/065 , H01L23/645 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/3011 , H01L2924/3025 , H05K1/0233 , H05K1/115 , H05K1/185 , H05K3/42 , H05K3/4602 , H05K2201/086 , H05K2201/09581 , Y10T29/4902 , H01L2224/05599
摘要: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
摘要翻译: 嵌入印刷电路板的电感器包括沿着印刷电路板的厚度方向延伸的导体和与导体接触而不间隙的磁体。 例如,磁性体由具有圆柱形管状的铁氧体构成。 导体由在圆筒形管状铁氧体的内周面上电镀形成的铜膜构成。 电感器沿印刷电路板的厚度方向插入。
-
公开(公告)号:US20100282502A1
公开(公告)日:2010-11-11
申请号:US12841626
申请日:2010-07-22
申请人: Shinobu KATO
发明人: Shinobu KATO
CPC分类号: H01L23/50 , H01L23/49822 , H01L23/49838 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/15312 , H01L2924/19106 , H01L2924/3011 , H05K1/0263 , H05K1/115 , H05K3/429 , H05K3/4602 , H05K3/4608 , H05K3/4641 , H05K2201/09309 , H05K2201/09536 , H05K2201/0959 , H05K2201/09609 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: In a core substrate 30, a ground through hole 36E and a power through hole 36P are disposed in the grid formation, so that electromotive force induced in X direction and Y direction cancel out each other. As a result, even if mutual inductance is reduced and a high frequency IC chip is loaded, electric characteristic and reliability can be improved without generating malfunction or error.
摘要翻译: 在芯基板30中,在栅格形成中设置有接地贯通孔36E和电力通孔36P,使得在X方向和Y方向上感应的电动势相互抵消。 结果,即使减小互感并且加载高频IC芯片,也可以提高电特性和可靠性而不产生故障或错误。
-
公开(公告)号:US07760062B2
公开(公告)日:2010-07-20
申请号:US11429157
申请日:2006-05-08
申请人: Yasuhiko Mano , Takashi Kariya , Shinobu Kato
发明人: Yasuhiko Mano , Takashi Kariya , Shinobu Kato
IPC分类号: H01F5/00
摘要: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
-
公开(公告)号:US06314785B1
公开(公告)日:2001-11-13
申请号:US09538096
申请日:2000-03-29
申请人: Kunio Ota , Hitoshi Rokutanda , Hiroaki Suzuki , Shinobu Kato , Seietsu Abe
发明人: Kunio Ota , Hitoshi Rokutanda , Hiroaki Suzuki , Shinobu Kato , Seietsu Abe
IPC分类号: B21D2800
CPC分类号: B23P11/00 , H05K3/381 , Y10T428/12201
摘要: An apparatus is provided for forming many recesses on the surface of a nonmetallic or metallic material for a plated product. The apparatus comprises a needle or a drawn wire material of a diameter of 3˜95 &mgr;m, a retainer means for retaining the base portion of the needle or the drawn wire material so that the needle or drawn wire material is inclined at angles of more than 45 degrees, but less than 90 degrees, to said surface of said material, a material-fixing means to fix the material, and a means for raising or lowering the retainer means. In another embodiment a cutting blade is provided.
摘要翻译: 提供了一种用于在用于电镀产品的非金属或金属材料的表面上形成许多凹部的装置。 该装置包括直径为3〜95μm的针或拉丝材料,用于保持针的基部或拉丝的材料的保持器装置,使得针或拉丝线材以大于 45度,但是小于90度,所述材料的所述表面,用于固定材料的材料固定装置,以及用于升高或降低保持装置的装置。 在另一个实施例中,提供了切割刀片。
-
公开(公告)号:US06254999B1
公开(公告)日:2001-07-03
申请号:US09537313
申请日:2000-03-29
申请人: Kunio Ota , Hitoshi Rokutanda , Hiroaki Suzuki , Shinobu Kato , Seietsu Abe
发明人: Kunio Ota , Hitoshi Rokutanda , Hiroaki Suzuki , Shinobu Kato , Seietsu Abe
IPC分类号: B21C3702
CPC分类号: B23P11/00 , H05K3/381 , Y10T428/12201
摘要: A plated product is provided which comprises a material of which the surface has many recesses, each having an opening of 5˜100 &mgr;m and a depth of 0.2 d˜d (d: the size of the opening of a recess, &mgr;m) and having an anchor portion. Further, a plurality of grooves are provided on the surface of the material. The width of the opening of each groove and the depth of each groove have specified values. The groove can be provided at each of both edges of its opening with a ridge portion. The angle of said groove to the surface of the material is within a range of specified values. A part of the thin film of metal enters the anchor portions of the recesses or grooves, so that the plated metal produced by this invention has a superior technical effect in that the thin film of metal hardly peels off the surface of the material.
摘要翻译: 提供了一种电镀产品,其包括表面具有许多凹陷的材料,每个凹部具有5〜100μm的开口和0.2d〜d的深度(d:凹部的开口的尺寸,母体),并具有 锚定部分。 此外,在材料的表面上设置多个凹槽。 每个槽的开口宽度和每个槽的深度都具有规定值。 凹槽可以设置在其开口的两个边缘的每个边缘处,并具有脊部分。 所述槽与材料表面的角度在规定值的范围内。 金属薄膜的一部分进入凹槽或凹槽的锚定部分,使得由本发明生产的电镀金属具有优异的技术效果,因为金属薄膜几乎不剥离材料的表面。
-
公开(公告)号:US06180171B2
公开(公告)日:2001-01-30
申请号:US09140085
申请日:1998-08-26
申请人: Kunio Ota , Hitoshi Rokutanda , Hiroaki Suzuki , Shinobu Kato , Seietsu Abe
发明人: Kunio Ota , Hitoshi Rokutanda , Hiroaki Suzuki , Shinobu Kato , Seietsu Abe
IPC分类号: B05D312
CPC分类号: B23P11/00 , H05K3/381 , Y10T428/12201
摘要: A plated product and apparatus for forming recesses or grooves on material to be plated to produce such a product. The product includes material having a surface having many recesses, each having an opening of size d, where d is in the range 5-100 microns, a depth in the range from 0.2 d to d, or many grooves. In preferred embodiments, each groove or recess has an anchor portion. In some embodiments, each groove has a ridge portion at each of both edges of its opening. The angle of each groove to the surface of the material and each groove's depth and opening width are preferably in specified ranges. When the material is plated, part of the thin metal film enters the anchor portions of its grooves or recesses, so that the plated metal has superior capacity to resist peeling off of the plated metal.
摘要翻译: 一种电镀产品和装置,用于在要镀覆的材料上形成凹槽或凹槽以制造这种产品。 该产品包括具有许多凹槽的表面的材料,每个凹槽具有尺寸为d的开口,其中d在5-100微米的范围内,深度在0.2d至d的范围内,或许多凹槽。 在优选实施例中,每个凹槽或凹槽具有锚固部分。 在一些实施例中,每个凹槽在其开口的两个边缘的每一个处具有脊部。 每个槽与材料表面和每个槽的深度和开口宽度的角度优选地在特定范围内。 当材料被镀覆时,金属薄膜的一部分进入其凹槽或凹槽的锚定部分,使得电镀金属具有优异的抵抗电镀金属剥离的能力。
-
-
-
-
-
-
-
-
-