公开(公告)号：US08363404B2

公开(公告)日：2013-01-29

申请号：US12967854

申请日：2010-12-14

Applicant: John L. Colbert ,  Jason R. Eagle ,  Roger D. Hamilton ,  Kenneth C. Marston ,  Steven P. Ostrander

Inventor： John L. Colbert ,  Jason R. Eagle ,  Roger D. Hamilton ,  Kenneth C. Marston ,  Steven P. Ostrander

IPC: H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.

Abstract translation: 提供了一种用于实现轮毂模块组件的加载和除热的方法和装置。 集线器模块组件包括集线器芯片和多个光学模块，其通过设置在驻留在轮毂陶瓷衬底上的顶表面冶金（TSM）LGA上的焊盘网阵列（LGA）组件连接。 陶瓷基板通过底表面冶金（BSM）LGA组件连接到电路板。 基座对准环包括用于接合电路板和定位BSM LGA组件的LGA插入器的多个对准特征。 一对顶部对准环中的每一个包括用于接合和定位TSM LGA组件的相应LGA位置的相应LGA插入器的协作对准特征。 TSM LGA组件的两个LGA插入器对齐，保持并使光学模块与集线器芯片之间的电连接。

公开(公告)号：US20120276375A1

公开(公告)日：2012-11-01

申请号：US13546151

申请日：2012-07-11

Applicant: Evan George Colgan ,  Paul W. Coteus ,  Michael Anthony Gaynes ,  Kenneth Charles Marston ,  Steven P. Ostrander

Inventor： Evan George Colgan ,  Paul W. Coteus ,  Michael Anthony Gaynes ,  Kenneth Charles Marston ,  Steven P. Ostrander

IPC: B32B7/12 ,  B32B15/08

CPC classification number: B32B37/1207 ,  B32B37/26 ,  B32B2037/243 ,  B32B2037/268 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2311/24 ,  B32B2457/08 ,  Y10T156/11 ,  Y10T156/1195 ,  Y10T428/2804 ,  Y10T428/2813 ,  Y10T428/2861

Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.

Abstract translation: 预制的可固化热界面粘合剂便于在其热界面处容易且可重复地分离和保留电子部件，以及用于通过使用这种粘合剂在组件的热界面处实现上述可重复分离和重新化的方法。

公开(公告)号：US20120241944A1

公开(公告)日：2012-09-27

申请号：US13491174

申请日：2012-06-07

Applicant: Martin M. BEAUMIER ,  Steven P. OSTRANDER ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Jeffrey A. ZITZ

Inventor： Martin M. BEAUMIER ,  Steven P. OSTRANDER ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Jeffrey A. ZITZ

IPC: H01L27/15

CPC classification number: H01L23/4338 ,  H01L23/10 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.

Abstract translation: 提供了一种多芯片电子封装及其制造方法。 该结构包括封装安装在芯片载体上的至少一个芯片的盖子; 固定在所述盖和所述芯片载体之间的至少一个密封垫片，所述至少一个密封垫片在所述盖子的活塞和所述芯片的相应的芯片之间形成间隙; 和间隙内的热界面材料，并与盖子的活塞和各个芯片接触。

公开(公告)号：US20120147563A1

公开(公告)日：2012-06-14

申请号：US12967854

申请日：2010-12-14

Applicant: John L. Colbert ,  Jason R. Eagle ,  Roger D. Hamilton ,  Kenneth C. Marston ,  Steven P. Ostrander

Inventor： John L. Colbert ,  Jason R. Eagle ,  Roger D. Hamilton ,  Kenneth C. Marston ,  Steven P. Ostrander

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.

Abstract translation: 提供了一种用于实现轮毂模块组件的加载和除热的方法和装置。 集线器模块组件包括集线器芯片和多个光学模块，其通过设置在驻留在轮毂陶瓷衬底上的顶表面冶金（TSM）LGA上的焊盘网阵列（LGA）组件连接。 陶瓷基板通过底表面冶金（BSM）LGA组件连接到电路板。 基座对准环包括用于接合电路板和定位BSM LGA组件的LGA插入器的多个对准特征。 一对顶部对准环中的每一个包括用于接合和定位TSM LGA组件的相应LGA位置的相应LGA插入器的协作对准特征。 TSM LGA组件的两个LGA插入器对齐，保持并使光学模块与集线器芯片之间的电连接。

公开(公告)号：US20080311381A1

公开(公告)日：2008-12-18

申请号：US12196443

申请日：2008-08-22

Applicant: Rajneesh Kumar ,  Steven P. Ostrander

Inventor： Rajneesh Kumar ,  Steven P. Ostrander

IPC: B32B5/16 ,  H01L23/34

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/25 ,  H01L2924/00

Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.

Abstract translation: 提供了一种导热混合物，其用于制备导热配方，例如具有高导热性和较低粘度的糊状物。 该糊料用于在电子部件和冷却装置之间提供热导体连接，以增加部件和冷却电子部件的装置之间的传热速率。 制剂含有各种粒度范围内的导热颗粒的混合物，通常分散在含有抗氧化剂和分散剂的非水电介质载体中，导热颗粒混合物在混合物中基于粒度范围以体积百分数特别相关， 通过颗粒尺寸比各个粒径范围。 该混合物可用于制造其他类似产品，例如热凝胶，粘合剂，浆料和复合材料，用于电子和化妆品，药​​品，汽车和类似产品。

公开(公告)号：US20080266809A1

公开(公告)日：2008-10-30

申请号：US11739701

申请日：2007-04-25

Applicant: Rajneesh Kumar ,  Steven P. Ostrander

Inventor： Rajneesh Kumar ,  Steven P. Ostrander

IPC: H05K7/20 ,  C08G63/48

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/25 ,  H01L2924/00

Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.

公开(公告)号：US20070290378A1

公开(公告)日：2007-12-20

申请号：US11425208

申请日：2006-06-20

Applicant: Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

Inventor： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

IPC: H01L23/29

CPC classification number: H01L23/293 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

Abstract translation: 本发明提供了包含电子器件的芯片，例如在衬底上包含多个芯片的多芯片陶瓷模块（MCM），其中芯片底部填充有可重复组合，其允许从器件中移除一个或多个芯片并被替换。 可再加工组合物含有不可交联的基础树脂，并且其形成具有线性可固化组分或优选可固化组分可交联的线性可固化组分的组合的基质，并且当固化形成基底中的交联结构域时 树脂基体。 使用合适的交联催化剂如Pt，任选的填料优选是硅烷表面处理的二氧化硅。 优选的基础树脂是直链聚二甲基硅氧烷，优选的可固化组分是乙烯基封端的直链聚二甲基硅氧烷和氢封端的直链聚二甲基硅氧烷。

公开(公告)号：US07079393B2

公开(公告)日：2006-07-18

申请号：US10904555

申请日：2004-11-16

Applicant: Evan G. Colgan ,  Frank L. Pompeo ,  Glenn G. Daves ,  Hilton T. Toy ,  Bruce K. Furman ,  David L. Edwards ,  Michael A. Gaynes ,  Mukta G. Farooq ,  Sung K. Kang ,  Steven P. Ostrander ,  Jaimal M. Williamson ,  Da-Yuan Shih ,  Donald W. Henderson

Inventor： Evan G. Colgan ,  Frank L. Pompeo ,  Glenn G. Daves ,  Hilton T. Toy ,  Bruce K. Furman ,  David L. Edwards ,  Michael A. Gaynes ,  Mukta G. Farooq ,  Sung K. Kang ,  Steven P. Ostrander ,  Jaimal M. Williamson ,  Da-Yuan Shih ,  Donald W. Henderson

IPC: H05K7/20

CPC classification number: H01L23/4735 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

Abstract: A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.

Abstract translation: 提供了一种用于组件载体上的电子部件的冷却系统。 该系统包括框架，喷雾歧管和密封构件。 框架具有开口并且可连接到部件载体，使得在开口和电子部件之间限定环形区域。 喷雾歧管被密封在开口上以限定电子部件的后表面上方的喷射区域。 喷雾歧管在后表面喷洒冷却液。 密封构件密封环形区域，使得部件载体上的输入/输出连接器与冷却流体隔离。

公开(公告)号：US5545429A

公开(公告)日：1996-08-13

申请号：US270086

申请日：1994-07-01

Applicant: Richard B. Booth ,  Emanuel I. Cooper ,  Edward A. Giess ,  Mark R. Kordus ,  Sol Krongelb ,  Steven P. Ostrander ,  Judith M. Roldan ,  Carlos J. Sambucetti ,  Ravi Saraf

Inventor： Richard B. Booth ,  Emanuel I. Cooper ,  Edward A. Giess ,  Mark R. Kordus ,  Sol Krongelb ,  Steven P. Ostrander ,  Judith M. Roldan ,  Carlos J. Sambucetti ,  Ravi Saraf

IPC: H05K3/20 ,  H05K3/32 ,  H05K3/42 ,  B05D5/12 ,  C25D5/02

CPC classification number: H05K3/423 ,  H05K2203/0152 ,  H05K2203/0733 ,  H05K2203/1509 ,  H05K3/205 ,  H05K3/321

Abstract: The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.

Abstract translation: 本发明涉及一种在聚合物结构中贯穿孔的全金属化方法的方法，包括以下步骤：向金属阴极施加成膜量的导电聚合物 - 金属复合浆料; 将图案化的聚合物结构键合到所述糊料; 使所述聚合物结构经受电解电镀浴足够的时间以完全金属化所述图案化的聚合物结构中的通孔表面，并从阴极组件中去除结构。 完全金属化的通孔聚合物结构然后可以被清洁和抛光以产生成品。