Abstract:
A light emitting diode includes an LED element, a fluorescent material provided so as to cover the LED element, a substrate on which the LED element is mounted and made of ceramics or silicon, and a pair of electrode pads which are electrically connected to the LED element on the substrate.
Abstract:
The control device acquires the archive deadline of archive target data and acquires, for storage devices of a plurality of types, a warranty deadline for the quality of data stored by the storage device and the unit cost which is the cost for each predetermined storage size of the storage device. The storage control device is a storage device which acquires a data migration cost and which obtains a storage destination for the archive target data from storage devices of a plurality of types on the basis of the archive deadline, warranty deadline, unit cost and data migration cost thus acquired. The storage control device selects a storage device for which the total cost is minimum when the archive target data is archived until the archive deadline.
Abstract:
A management computer includes a configuration information acquisition module that acquires a data volume configuration table indicative of a logical connection relationship between structural elements of the data storage apparatus from the data storage apparatus, a transmission path specification module that specifies the structural elements that exist on a transmission path of data which is required to be written by a host computer from the structural elements of the data storage apparatus on the basis of data volume configuration table that is acquired by the configuration information acquisition module, a performance data acquisition module that acquires the performance data of the structural elements that are specified by the transmission path specification module, and a screen transition control module that output the performance data that is acquired by the performance data acquisition module.
Abstract:
A heterogeneous network includes network related hardware and software products from a plurality of vendors. The network includes a storage system configured to store data, a server configured to process requests, a switch coupling the storage system and the server for data communication, and a network manager including an event dictionary to interpret an event message received from a device experiencing failure.
Abstract:
A printer, which prints by repeatedly reciprocating a rolled recording paper and ejects a printed recording paper, has therein a recording paper storage unit in which the recording paper is temporarily stored. The recording paper storage unit has a configuration formed by at least a part of the periphery of the rolled recording paper or a configuration provided in a space between the rolled paper holder and an ejection slot. This configuration eliminates the need for separately providing a configuration in which a recording paper is set aside when printing a long sheet of printed material and, at the same time, makes the printer smaller.
Abstract:
To prevent, when data is erased from a storage system that stores differential of updated data, a large amount of differential data from being created, a storage subsystem provides a first storage area which stores data, and includes a second storage area which stores a replication of data stored in the first storage area. When the data stored in the first storage area is updated, the data is replicated to the second storage area before the data is updated. When a request to erase the data stored in the first storage area is received, replication of unupdated data to the second storage area is suspended and the data stored in the first storage area is erased based on the request to erase the data.
Abstract:
In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the through electrode in the bottom surface side of the cavity has a connection part to a wiring that forms an electric circuit including the chip of the electronic device. The silicon substrate for a package is characterized in that (1) a thin film wiring is included as the wiring and the connection part is reinforced by a conductor connected to the thin film wiring and/or (2) a wire bonding part is included as the wiring and the connection part is formed by wire bonding the end part of the through electrode in the bottom surface side of the cavity.
Abstract:
For a storage system which holds backup data of a first data storage extent in one or more second data storage extents in use of a first backup method, a backup status in a first backup method in a prescribed period is acquired and a first backup performance in a first backup configuration is computed based on this backup status. Meanwhile, a second backup performance in a second backup configuration is estimated based on a prescribed assumption in a prescribed period. Information is outputted based on the computed first backup performance and the estimated second backup performance.
Abstract:
A computer system comprises a storage subsystem, a host computer and a management computer, and stores catalogue information containing correspondence between a first volume for data reading or writing and a second volume for storing a copy of the data stored in the first volume. The management computer requests the storage subsystem to erase the data stored in the first volume upon reception of an erasure request of the data stored in the first volume. The storage subsystem erases the data stored in the first volume. The management computer specifies a second volume for storing the copy of the data stored in the first volume based on the catalogue information. The storage subsystem erases data stored in the specified second volume. Thus, security risks are reduced by erasing data regarding the data when the data stored in the volume is erased.
Abstract:
A heat radiation package of the present invention includes a substrate in an upper surface side of which recess portion is provided, embedded wiring portion which is filled in the recess portion of the substrate and on which semiconductor element which generates a heat is mounted, and a heat sink connected to a lower surface side of the substrate. The substrate is made of silicon, ceramics, or insulating resin.