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88 条记录 (耗时 0.051 秒)

    Land grid array fabrication using elastomer core and conducting metal shell or mesh
    31.
    发明授权
    Land grid array fabrication using elastomer core and conducting metal shell or mesh 失效
    使用弹性体芯和导电金属壳或网的土地格栅阵列制造

    公开(公告)号：US07479014B2

    公开(公告)日：2009-01-20

    申请号：US10531494

    申请日：2003-05-13

    申请人： Gareth G. Hougham ,  Keith E. Fogel ,  Paul A. Lauro ,  Joseph Zinter, Jr.

    发明人： Gareth G. Hougham ,  Keith E. Fogel ,  Paul A. Lauro ,  Joseph Zinter, Jr.

    IPC分类号： H01R12/00

    CPC分类号： H01R13/2414 ,  H01R12/7082 ,  H01R12/714 ,  H01R43/007 ,  H05K3/4007 ,  H05K3/42 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0959 ,  H05K2201/10378 ,  Y10S439/931 ,  Y10T442/109 ,  Y10T442/172

    摘要： Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.

    摘要翻译： 制造导电和弹性的Land Grid Array（LGA）插入器触点的方法。 还提供了通过本发明的方法制造的LGA插入器触点。 提供了LGA型，其利用由从按钮结构的顶表面到底表面连续的导电材料覆盖的纯未填充弹性体按钮芯。 为了消除在使用导电插入器触点的地面栅格阵列的制造和结构的技术中目前遇到的缺点和缺点，提供了用于将弹性体按钮模制成预金属化的LGA载体片的方法和结构，以及 其中非导电弹性体按钮被表面金属化以便将它们转换为导电电触点。

    Low dielectric constant fluorinated polymers and methods of fabrication thereof
    35.
    发明授权
    Low dielectric constant fluorinated polymers and methods of fabrication thereof 失效
    低介电常数氟化聚合物及其制造方法

    公开(公告)号：US5324813A

    公开(公告)日：1994-06-28

    申请号：US918814

    申请日：1992-07-22

    申请人： Gareth G. Hougham ,  Jane M. Shaw ,  Alfred Viehbeck

    发明人： Gareth G. Hougham ,  Jane M. Shaw ,  Alfred Viehbeck

    IPC分类号： C08G73/10 ,  C08G69/26

    CPC分类号： C08G73/1039

    摘要： Low dielectric constant polyimides formed from an optionally fluorinated dianhydride and a fluorinated diamine are described. The fluorine containing constituents are sterically disposed so that the dipole moment of the constituents tend to cancel out. Since fluorine containing diamines are generally nonreactive, to achieve a polyimide of high enough molecular weight to be practically useful, a method of fabrication of a high molecular weight polymer from monomers of low reactivity is provided. The monomers, such as a diamine and dianhydride are provided in a solution within which a low molecular weight polyamic acid is formed. The solution is dried. The polyamic acid used is cured to a low molecular weight polyimide. The polyimide is redisolved, redryed and recured enough times to build up the molecular weight to a useful level. The method is applicable to fabricating other polymers of high molecular weight, such as polyamides, polyesters and polyurethanes.

    摘要翻译： 描述了由任选氟化二酐和氟化二胺形成的低介电常数聚酰亚胺。 含氟成分被空间排列，使得成分的偶极矩倾向于抵消。 由于含氟二胺通常是非反应性的，为了实现高分子量的聚酰亚胺实际上是有用的，提供了由低反应性单体制备高分子量聚合物的方法。 在形成低分子量聚酰胺酸的溶液中提供单体，例如二胺和二酐。 将溶液干燥。 使用的聚酰胺酸固化成低分子量聚酰亚胺。 将聚酰亚胺重新溶解，重新混合并再次回收足够的时间以将分子量建立到有用的水平。 该方法适用于制造其它高分子量聚合物，如聚酰胺，聚酯和聚氨酯。

    Compliant mold fill head with integrated cavity venting and solder cooling
    39.
    发明授权
    Compliant mold fill head with integrated cavity venting and solder cooling 有权
    具有集成腔体排气和焊锡冷却的合适的模具填充头

    公开(公告)号：US08011563B2

    公开(公告)日：2011-09-06

    申请号：US11696753

    申请日：2007-04-05

    申请人： Russell A. Budd ,  Evan G. Colgan ,  Peter A. Gruber ,  Gareth G. Hougham ,  John P. Karidis

    发明人： Russell A. Budd ,  Evan G. Colgan ,  Peter A. Gruber ,  Gareth G. Hougham ,  John P. Karidis

    IPC分类号： B23K31/02 ,  B23K37/00

    CPC分类号： B23K3/0607 ,  B23K2101/40

    摘要： A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.

    摘要翻译： 模具填充头包括焊料输送头和具有固定到焊料输送头的顺应部分和与柔顺部分相关联的分配区域的界面部分。 分配区域形成有至少一个孔，其被配置为与模板中的空腔相接触，所述至少一个孔与焊料输送头流体连通。 顺应部分的构造和尺寸被设计成当从其延伸预定距离时将分配区域推靠在模板上，并且基本上容许模板的平坦度变化，预定距离的变化和/或角度取向的变化 界面部分和模板。