公开(公告)号：US5979043A

公开(公告)日：1999-11-09

申请号：US892463

申请日：1997-07-14

申请人： Jay DeAvis Baker ,  Robert Edward Belke, Jr. ,  Daniel Phillip Dailey ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II

发明人： Jay DeAvis Baker ,  Robert Edward Belke, Jr. ,  Daniel Phillip Dailey ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II

IPC分类号： B29C45/14 ,  H05K1/00 ,  H05K3/00 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/4635 ,  B29C45/14467 ,  B29C45/14778 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/462 ,  B29K2995/0005 ,  B29L2031/3493 ,  H05K1/0393 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/1327 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49158

摘要： A method of manufacturing an electronic circuit assembly that includes a number of electrically interconnected flexible films, each flexible film having a flexible electrical wiring circuit. The electrical wiring circuits are interconnected between film layers and the film layers are adhered to a molded backing structure. A first flexible film is formed with a pattern of flexible electrical wiring circuits created on at least one surface thereof. The first flexible film has a passage that provides an electrical connection through the flexible film. A second flexible film is formed with a pattern of flexible electrical wiring circuits created on a least one surface thereof. The second flexible film has an electrical interconnect feature that connects with the electrical passage on the first film and electrically connects the first film with the second film. The first flexible film is overlaid juxtaposed the second flexible film so that the passage is aligned adjacent the electrical interconnect feature. The first and second flexible films are placed within an open mold. The mold is closed and a plastic material is injected within the mold adjacent at least one surface of the first and second flexible films. The molten plastic adheres to the first and second flexible films and forms an integral backing structure. The backing structure and first and second flexible films together form the circuit assembly.

摘要翻译： 一种制造包括多个电互连柔性膜的电子电路组件的方法，每个柔性膜具有柔性电布线电路。 电气布线电路在膜层之间相互连接，并且膜层粘附到模制背衬结构上。 第一柔性膜形成有在其至少一个表面上形成的柔性电布线的图案。 第一柔性膜具有通过柔性膜提供电连接的通路。 第二柔性膜形成有在其至少一个表面上形成的柔性电布线的图案。 第二柔性膜具有与第一膜上的电通路连接并将第一膜与第二膜电连接的电互连特征。 第一柔性膜叠置在第二柔性膜上，使得通道对准邻近电互连特征。 第一和第二柔性膜被放置在开放模具内。 模具关闭，并且塑料材料在模具内相邻于第一和第二柔性膜的至少一个表面注入。 熔融的塑料粘附到第一和第二柔性膜上并形成整体的背衬结构。 背衬结构和第一和第二柔性膜一起形成电路组件。

公开(公告)号：US5577657A

公开(公告)日：1996-11-26

申请号：US522890

申请日：1995-09-01

申请人： Andrew Z. Glovatsky

发明人： Andrew Z. Glovatsky

IPC分类号： B23K1/002 ,  B23K1/008 ,  H05K3/34

CPC分类号： B23K1/008 ,  H05K3/3494 ,  B23K2201/40 ,  H05K2203/087 ,  H05K3/3447

摘要： Method of efficiently refiow soldering one or more devices to a printed circuit board with a convective heating oven, each device having a plurality of plate supported electronic connecting pins that are to be soldered within respective mating openings of the printed circuit board for electronic connection, the method comprising: (i) placing a solder paste in each of the openings; (ii) assembling the device to the circuit board by positioning the plate of the device along, but spaced in relation to, the printed circuit board to define a planar space therebetween, with the pins extending into such openings and into the soldered paste to thereby form an assembly; and (iii) passing the assembly through the convective heating oven for a time period to melt the solder paste and form a solid connection upon removal of the convective heat, said passing being carried out by use of convective heat focusing features that guide the convective heat flow between the plate and board to enhance convective heating of the solder paste from both sides of the board.

摘要翻译： 使用对流加热炉将一个或多个装置有效地将一个或多个装置焊接到印刷电路板的方法，每个装置具有多个板支撑的电子连接销，其将被焊接在用于电子连接的印刷电路板的相应匹配开口内， 方法包括：（i）在每个开口中放置焊膏; （ii）通过将装置的板定位在印刷电路板上，但与印刷电路板间隔开来，将装置组装到电路板上，以限定它们之间的平面空间，其中销延伸到这种开口中并进入焊接的浆料 组成; 和（iii）使组件通过对流加热炉一段时间以熔化焊膏并在去除对流热量时形成固体连接，所述通过使用引导对流热的对流热聚焦特征 在板和板之间流动以增强焊膏从板的两侧的对流加热。

公开(公告)号：US5318855A

公开(公告)日：1994-06-07

申请号：US934604

申请日：1992-08-25

申请人： Andrew Z. Glovatsky ,  Michael A. Mele ,  Patrick M. Scott

发明人： Andrew Z. Glovatsky ,  Michael A. Mele ,  Patrick M. Scott

IPC分类号： B32B15/08 ,  H01L23/04 ,  B32B9/00

CPC分类号： B32B15/08 ,  H01L23/04 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T29/49146 ,  Y10T428/24826 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31699

摘要： A flexible metallized polymer film cover provides environmental protection of electronic assemblies such as circuit card assemblies which are susceptible to external environmental factors which can impede functional performance and reduce reliability. The fully integrated cover provides this protection and also allows for circuit repair and rework in such a manner as to make cover removal and reseal economically attractive. The use of a metallized polymer film in the form of a two layer film, with two intimately bonded layers one being electrically insulative and the other metallic, provides environmental and electrical protection of the enclosed assembly. The variables of film materials and thicknesses allow for specific cover designs to be fabricated to meet various requirements for assembly protection. The flexible film nature of the cover allows for strict conformance to underlying devices and less dimension and weight for the assembly. The cover can also be easily and quickly removed from the assembly to allow repair of underlying devices. The cost of these films also makes replacement of the film cover attractive.

摘要翻译： 柔性金属化聚合物膜盖为诸如可能妨碍功能性能并降低可靠性的外部环境因素的电路组件提供环境保护。 完全集成的盖子提供了这种保护，并且还允许电路修复和返工，以使得覆盖物移除和再密封具有经济吸引力。 使用两层膜形式的金属化聚合物膜，其中两个紧密接合的层，一个是电绝缘的，另一个是金属的，为封闭的组件提供环境和电气保护。 薄膜材料和厚度的变量允许制造特定的盖子设计以满足组装保护的各种要求。 盖的柔性膜性质允许严格符合下面的装置，并且具有较小的尺寸和重量。 盖子也可以容易地并且快速地从组件中移出，以便修理底层的装置。 这些电影的成本也使得更换电影片有吸引力。

公开(公告)号：US08322873B2

公开(公告)日：2012-12-04

申请号：US12938546

申请日：2010-11-03

申请人： Andrew Z. Glovatsky ,  Christopher W. Gattis

发明人： Andrew Z. Glovatsky ,  Christopher W. Gattis

IPC分类号： F21V33/00 ,  F21V7/04

CPC分类号： G02B6/0095 ,  F21V33/0044 ,  F21W2131/305 ,  F25D23/067 ,  F25D25/02 ,  F25D27/00 ,  F25D2400/40 ,  G02B6/0058 ,  G02B6/0068

摘要： A lighting system for an appliance is disclosed. In one embodiment, the lighting system includes a light shelf including a substantially planar light guide having a support member for releaseably coupling the light shelf to the appliance, a light injector coupled to a first end the light shelf, the light injector including a substrate having at least one light source disposed thereon and a housing for at least partially enclosing the at least one light source, wherein light emitted from the at least one light source is directed into the light guide, and an end piece coupled to a second end of the light shelf opposite the first end.

摘要翻译： 公开了一种用于器具的照明系统。 在一个实施例中，照明系统包括光架，其包括基本上平面的光导，其具有用于将灯架可释放地耦合到器具的支撑构件;耦合到第一端的灯架的光注射器，所述光注射器包括具有 设置在其上的至少一个光源和用于至少部分地包围所述至少一个光源的壳体，其中从所述至少一个光源发射的光被引导到所述光导中，以及端部件，其连接到所述至少一个光源的第二端 轻型货架与第一端相对。

公开(公告)号：US07621752B2

公开(公告)日：2009-11-24

申请号：US11778945

申请日：2007-07-17

申请人： Jeff C. Lin ,  Viren B. Merchant ,  Edwin Mitchell Sayers ,  Andrew Z. Glovatsky

发明人： Jeff C. Lin ,  Viren B. Merchant ,  Edwin Mitchell Sayers ,  Andrew Z. Glovatsky

IPC分类号： H01R12/00

CPC分类号： F21V19/0015 ,  F21S41/141 ,  F21S41/192 ,  F21Y2115/10

摘要： Disclosed is an LED package holder for retaining and electrically connecting an LED package. The LED package holder includes a housing configured to hold an LED package and has at least one center opening defined therein. A connector shroud is integrally formed with the housing and has a cavity for receiving a connector operable to supply power to the LED package. Two contact features are retained by the housing, and each contact feature has an inner contact and an outer contact. Each inner contact engages an LED electric terminal of the LED package. Each outer contact extends into the connector shroud so as to engage connector terminals when a connector is inserted into the connector shroud.

摘要翻译： 公开了一种用于保持和电连接LED封装的LED封装架。 所述LED封装架包括构造成保持LED封装并具有限定在其中的至少一个中心开口的壳体。 连接器护罩与壳体整体形成，并且具有用于接收可操作以向LED封装供电的连接器的空腔。 两个接触特征由壳体保持，并且每个接触特征具有内接触件和外接触件。 每个内部接触件接合LED封装的LED电气端子。 每个外部接触件延伸到连接器护罩中，以便当连接器插入连接器护罩中时接合连接器端子。

公开(公告)号：US20090207617A1

公开(公告)日：2009-08-20

申请号：US12034452

申请日：2008-02-20

申请人： Viren B. Merchant ,  Jeff C. Lin ,  Andrew Z. Glovatsky

发明人： Viren B. Merchant ,  Jeff C. Lin ,  Andrew Z. Glovatsky

IPC分类号： F21V19/00

CPC分类号： F21V15/01 ,  F21K9/00 ,  F21S41/141 ,  F21S41/192 ,  F21S45/47 ,  F21S45/49 ,  F21V3/062 ,  F21V5/04 ,  F21V17/005 ,  F21V17/101 ,  F21V17/12 ,  F21V17/16 ,  F21V19/0015 ,  F21V19/004 ,  F21V29/713 ,  F21V29/74 ,  F21Y2115/10

摘要： An LED package holder for holding and electrically connecting an LED package. The LED package holder includes a housing having an aperture defined therein and portions defining a recess. A plurality of contact features are retained by the housing and extend into the aperture. Each contact feature has an exposed portion configured to engage an LED electric terminal of an LED package that is received within the aperture. A heat sink, also retained by the housing, is at least partially located within the recess of the housing and configured to draw heat away from the LED package received within the aperture.

摘要翻译： 一个用于保持和电连接LED封装的LED封装架。 LED封装架包括具有限定在其中的孔的壳体和限定凹部的部分。 多个接触特征由壳体保持并延伸到孔中。 每个接触特征具有被配置为接合容纳在孔内的LED封装的LED电端子的暴露部分。 也由壳体保持的散热器至少部分地位于壳体的凹部内并且构造成将热量从容纳在孔内的LED封装件吸走。

公开(公告)号：US07215557B2

公开(公告)日：2007-05-08

申请号：US10648910

申请日：2003-08-27

申请人： Andrew Z. Glovatsky ,  Vladimir Stoica

发明人： Andrew Z. Glovatsky ,  Vladimir Stoica

IPC分类号： H05K1/11

CPC分类号： H05K7/1434 ,  H05K1/144 ,  H05K1/147 ,  H05K2201/2018

摘要： An assembly that includes two or more microelectronic modules in a self-sustaining structure that is adapted to be installed in a housing. The microelectronic modules are affixed to supports that are attached to ribs and arranged in parallel-spaced relationship. When the assembly is received in a housing, the ribs engage the inner wall of the housing to securely position the assembly. Also, the ribs space the microelectronic modules apart from the housing to facilitate coolant gas flow through the housing and thereby improve thermal dissipation during operation.

摘要翻译： 一种组件，其包括适于安装在壳体中的自维持结构中的两个或多个微电子模块。 微电子模块固定到附接到肋并以平行间隔的关系布置的支撑件。 当组件被容纳在壳体中时，肋接合壳体的内壁以牢固地定位组件。 此外，肋将微电子模块与壳体隔开，以便于冷却剂气体流过壳体，从而改善操作期间的散热。

公开(公告)号：US07023699B2

公开(公告)日：2006-04-04

申请号：US10458424

申请日：2003-06-10

申请人： Andrew Z. Glovatsky ,  Vivek Jairazbhoy

发明人： Andrew Z. Glovatsky ,  Vivek Jairazbhoy

IPC分类号： H05K7/20

CPC分类号： H05K7/2049 ,  H05K1/0206 ,  H05K7/20454

摘要： The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an electrical component. The system for conducting heat energy in an electronic assembly includes an electrical component, an elastically deformable member, and a housing. The elastically deformable member is placed in a compressed position between the electrical component and the housing such that the elastically deformable member is fixed into an assembled location. The elastically deformable member conducts heat energy away from the electrical component into the housing where it is dissipated into the environment. Since the compressed position fixes the location of the elastically deformable member, the system does not require a mechanical fastening to the electrical component thereby reducing thermo-mechanical fatigue. The elastically deformable member is made of a metal material allowing it to easily conduct the heat energy.

公开(公告)号：US06770813B1

公开(公告)日：2004-08-03

申请号：US10439542

申请日：2003-05-16

申请人： Prasanna Ramsagar ,  Andrew Z. Glovatsky

发明人： Prasanna Ramsagar ,  Andrew Z. Glovatsky

IPC分类号： H02G308

CPC分类号： H05K1/189 ,  B60R16/0207 ,  H05K2201/056 ,  H05K2201/10409 ,  H05K2201/2036

摘要： A microelectronic package includes a flexible substrate and is adapted to be installed onto a support structure, which is preferably a nonplanar support structure. The package includes a frame that is affixed to a perimeter of a first portion of the flexible substrate and forms the substrate into a shape corresponding to the support structure. The package is installed so that the obverse surface of the flexible substrate is intimately against the support structure, so that the support structure not only reinforces the package to prevent damage, but also extracts heat generated during operation of the electronics.

摘要翻译： 微电子封装包括柔性基板，并且适于安装在支撑结构上，支撑结构优选为非平面支撑结构。 该包装包括固定到柔性基底的第一部分的周边并将基底形成与支撑结构对应的形状的框架。 安装包装使得柔性基底的正面紧贴支撑结构，使得支撑结构不仅加强包装以防止损坏，而且还提取在电子器件的操作期间产生的热量。

公开(公告)号：US06186106B1

公开(公告)日：2001-02-13

申请号：US08999077

申请日：1997-12-29

申请人： Andrew Z. Glovatsky ,  Myron Lemecha ,  Mark Miller ,  Jay DeAvis Baker

发明人： Andrew Z. Glovatsky ,  Myron Lemecha ,  Mark Miller ,  Jay DeAvis Baker

IPC分类号： F02P2300

CPC分类号： F02M35/10249 ,  B60R16/0215 ,  F02D41/3005 ,  F02D2400/18 ,  F02D2400/21 ,  F02D2400/22 ,  F02M35/10216 ,  F02M35/10288 ,  F02M35/10301 ,  F02M35/10347 ,  F02M35/112 ,  F02M35/116 ,  F02M35/161 ,  F02M51/005 ,  H05K1/118

摘要： There is disclosed herein an apparatus for routing electrical signals in an engine having n cylinders and an intake manifold, one embodiment of which comprises: (1) a generally rigid housing generally conforming in shape with and being removably attachable to a top surface of the intake manifold; (2) at least n carrier members attached to the housing and extending outward therefrom, wherein each carrier member is arranged in general proximity with a respective cylinder; (3) a plurality of conductive circuit traces arranged on or within an underside or other surface of the housing and on or within each carrier member; and (4) at least one input/output connector for connection to at least one of an external signal source, an external power source, an external signal destination, and an external power destination, wherein each input/output connector is attached to the housing and is electrically connected to at least one of the circuit traces. Each circuit trace carried by each carrier member terminates in a termination electrically connectable with an electrical engine element, such as an ignition coil, an electronic fuel injector, a spark plug, and/or a glow plug.

摘要翻译： 本文公开了一种用于在具有n个气缸和进气歧管的发动机中布置电信号的装置，其一个实施例包括：（1）大体上刚性的壳体，其大致符合形状并且可移除地附接到进气口的顶表面 歧管 （2）至少n个承载构件，其附接到壳体并从其向外延伸，其中每个承载构件总体上布置在相应的气缸附近; （3）多个导电电路迹线布置在壳体的下侧或其他表面上或其内表面上，并位于每个载体构件上或内部; 和（4）至少一个用于连接至外部信号源，外部电源，外部信号目的地和外部电力目的地中的至少一个的输入/输出连接器，其中每个输入/输出连接器附接到壳体 并且电连接到至少一个电路迹线。 由每个载体构件承载的每个电路迹线终止于可与诸如点火线圈，电子燃料喷射器，火花塞和/或电热塞之类的电动发动机元件电连接的终端。