公开(公告)号：US12130561B2

公开(公告)日：2024-10-29

申请号：US17892211

申请日：2022-08-22

Applicant: Applied Materials, Inc.

Inventor： Kartik Ramaswamy ,  Michael D. Willwerth ,  Yang Yang

IPC: G03F7/42 ,  G03F7/00 ,  H01J37/32

CPC classification number: G03F7/70808 ,  G03F7/42 ,  G03F7/427 ,  G03F7/70925 ,  H01J37/32633 ,  H01J2237/3342

Abstract: Apparatus for processing substrates can include a gas distribution plate that includes an upper plate and a lower plate and a solid disk between the upper plate and the lower plate. Each of the upper plate and the lower plate has a central region and an outer region surrounding the central region, the central region being solid and the outer region having a plurality of through holes. The upper plate and the lower plate are coaxially aligned along a central axis extending through a center of the central region of the upper plate and a center of the central region of the lower plate. The solid disk is coaxially aligned with the upper plate and the lower plate. The solid disk is configured to block transmission of ultraviolet radiation through the solid disk.

公开(公告)号：US12068135B2

公开(公告)日：2024-08-20

申请号：US17175216

申请日：2021-02-12

Applicant: Applied Materials, Inc.

Inventor： Ming Xu ,  Ashley Mutsuo Okada ,  Michael D. Willwerth ,  Duc Dang Buckius ,  Jeffrey Ludwig ,  Aditi Mithun ,  Benjamin Schwarz

IPC: H01J37/32 ,  H01L21/3065 ,  H01L21/67

CPC classification number: H01J37/32449 ,  H01L21/3065 ,  H01J2237/332 ,  H01J2237/334

Abstract: A gas distribution apparatus is provided having a first reservoir with a first upstream end and a first downstream end and a second reservoir with a second upstream end and a second downstream end. A reservoir switch valve is in fluid communication with the first downstream end of the first reservoir and the second downstream end of the second reservoir. The reservoir switch valve operable to selectively couple the first reservoir to an outlet of the reservoir switch valve when in a first state, and couple the second reservoir to the outlet of the reservoir switch valve when in a second state. A plurality of proportional flow control valves are provided having inlets coupled in parallel to the outlet of the reservoir switch valve The plurality of proportional flow control valves have outlets configured to provide gas to a processing chamber.

公开(公告)号：US20230103165A1

公开(公告)日：2023-03-30

申请号：US18071444

申请日：2022-11-29

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Michael D. Willwerth ,  Leonard Tedeschi ,  Kiyki-Shiy N. Shang ,  Mikhail V. Taraboukhine ,  Charles R. Hardy ,  Sivasankar Nagarajan

IPC: H01J37/32 ,  G01N27/22

Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.

公开(公告)号：US11545346B2

公开(公告)日：2023-01-03

申请号：US16812081

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Michael D. Willwerth ,  Leonard Tedeschi ,  Kiyki-Shiy N. Shang ,  Mikhail V. Taraboukhine ,  Charles R. Hardy ,  Sivasankar Nagarajan

IPC: H01J37/32 ,  G01N27/22

Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.

公开(公告)号：USD931240S1

公开(公告)日：2021-09-21

申请号：US29700012

申请日：2019-07-30

Applicant: APPLIED MATERIALS, INC.

Designer： Changhun Lee ,  Michael D. Willwerth ,  Jeffrey Ludwig

公开(公告)号：US20210280400A1

公开(公告)日：2021-09-09

申请号：US16812081

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Michael D. Willwerth ,  Leonard Tedeschi ,  Kiyki-Shiy N. Shang ,  Mikhail V. Taraboukhine ,  Charles R. Hardy ,  Sivasankar Nagarajan

IPC: H01J37/32 ,  G01N27/22

Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.

公开(公告)号：US10770329B2

公开(公告)日：2020-09-08

申请号：US16213594

申请日：2018-12-07

Applicant: Applied Materials, Inc.

Inventor： Hun Sang Kim ,  Michael D. Willwerth

IPC: H01L21/683 ,  H01J37/32 ,  C23C16/458 ,  H01L21/67

Abstract: A gas flow is described to reduce condensation with a substrate processing chuck. In one example, a workpiece holder in the chamber having a puck to carry the workpiece for fabrication processes, a top plate thermally coupled to the puck, a cooling plate fastened to and thermally coupled to the top plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate, a base plate fastened to the cooling plate opposite the puck, and a dry gas inlet of the base plate to supply a dry gas under pressure to a space between the base plate and the cooling plate to drive ambient air from between the base plate and the cooling plate.

公开(公告)号：US10770269B2

公开(公告)日：2020-09-08

申请号：US15677929

申请日：2017-08-15

Applicant: Applied Materials, Inc.

Inventor： Andrew Nguyen ,  Bradley Howard ,  Shahid Rauf ,  Ajit Balakrishna ,  Tom K. Choi ,  Kenneth S. Collins ,  Anand Kumar ,  Michael D. Willwerth ,  Yogananda Sarode Vishwanath

IPC: B29D22/00 ,  H01J37/32 ,  B01D45/08 ,  B32B1/02 ,  B29C65/00 ,  B32B1/08

Abstract: Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.

公开(公告)号：US10283397B2

公开(公告)日：2019-05-07

申请号：US15135496

申请日：2016-04-21

Applicant: Applied Materials, Inc.

Inventor： Michael D. Willwerth ,  Roberto Cesar Cotlear

IPC: H01L21/687 ,  B66F3/25 ,  H01L21/683 ,  B66F3/24

Abstract: Implementations described herein provide a lift pin actuator. The lift pin actuator has a housing. The housing has an interior volume. A track is disposed in the interior volume and coupled to the housing. A center shaft is at least partially disposed in the interior volume of the housing. A guide is movably coupled to the track. At least one internal bellows is disposed in the interior volume, the internal bellows form a seal between the center shaft and the housing. An elastic member is disposed in the interior volume and configured to apply a force that retracts the center shaft into the housing. An inlet port is configured to introduce fluid into the interior volume between the internal bellows and the housing. The fluid generates a force opposing the elastic member to extend the center shaft relative to the housing.

公开(公告)号：US10083816B2

公开(公告)日：2018-09-25

申请号：US15149923

申请日：2016-05-09

Applicant: Applied Materials, Inc.

Inventor： Michael D. Willwerth ,  David Palagashvili ,  Valentin N. Todorow ,  Stephen Yuen

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  H01J37/32 ,  H05B6/10 ,  H01L21/67 ,  C23C14/22 ,  C23C16/44 ,  H01F21/12 ,  H05B6/02

CPC classification number: H01J37/321 ,  C23C14/22 ,  C23C16/44 ,  H01F21/12 ,  H01J37/32321 ,  H01J37/32522 ,  H01J37/32623 ,  H01J37/32935 ,  H01J2237/327 ,  H01J2237/334 ,  H01L21/67017 ,  H01L21/67069 ,  H05B6/02 ,  H05B6/108

Abstract: A shielded lid heater lid heater suitable for use with a plasma processing chamber, a plasma processing chamber having a shielded lid heater and a method for plasma processing are provided. The method and apparatus enhances positional control of plasma location within a plasma processing chamber, and may be utilized in etch, deposition, implant, and thermal processing systems, among other applications where the control of plasma location is desirable. In one embodiment, a process for tuning a plasma processing chamber is provided that include determining a position of a plasma within the processing chamber, selecting an inductance and/or position of an inductor coil coupled to a lid heater that shifts the plasma location from the determined position to a target position, and plasma processing a substrate with the inductor coil having the selected inductance and/or position.