公开(公告)号：US20130130124A1

公开(公告)日：2013-05-23

申请号：US13812546

申请日：2011-07-25

申请人： Atsushi Fukunaga ,  Shinji Inazawa ,  Masatoshi Majima ,  Atsushi Yamaguchi ,  Koji Nitta ,  Shoichiro Sakai

发明人： Atsushi Fukunaga ,  Shinji Inazawa ,  Masatoshi Majima ,  Atsushi Yamaguchi ,  Koji Nitta ,  Shoichiro Sakai

IPC分类号： H01M4/66 ,  H01M4/04

CPC分类号： H01M4/661 ,  H01M4/0402 ,  H01M4/387 ,  H01M4/667 ,  H01M4/80 ,  H01M4/808 ,  H01M10/39

摘要： A main object is to produce a porous metal body that can be used as a battery electrode, in particular, that can be used as a negative electrode of a molten-salt battery using sodium. The porous metal body includes a hollow metal skeleton composed of a metal layer containing nickel or copper as a main component, and an aluminum covering layer that covers at least an outer surface of the metal skeleton. The porous metal body further includes a tin covering layer that covers the aluminum covering layer, and is used as a battery electrode. Preferably, the porous metal body has continuous pores due to a three-dimensional network structure thereof, and has a porosity of 90% or more.

摘要翻译： 主要的目的是制造可用作电池电极的多孔金属体，特别是可以用作使用钠的熔盐电池的负极。 多孔金属体包括由以镍或铜为主要成分的金属层构成的中空金属骨架以及覆盖金属骨架的至少外表面的铝覆盖层。 多孔金属体还包括覆盖铝覆盖层的锡覆盖层，并且用作电池电极。 优选地，多孔金属体由于其三维网状结构而具有连续的孔，并且具有90％以上的孔隙率。

公开(公告)号：US08410377B2

公开(公告)日：2013-04-02

申请号：US12260219

申请日：2008-10-29

申请人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Shigeaki Sakatani ,  Koso Matsuno

发明人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Shigeaki Sakatani ,  Koso Matsuno

IPC分类号： H01L23/28

CPC分类号： H05K3/3484 ,  B23K35/264 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3463 ,  H01L2924/3512 ,  H01L2924/00

摘要： A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.

摘要翻译： 多个半导体元件通过熔点为200℃以下的焊料相邻地安装在基板上，除了半导体元件之外的电子部件通过焊料与相邻安装的半导体元件之间的基板安装在基板上 熔点为200℃以下，多个半导体元件与基板之间的空间，电子部件与基板之间的空间以及多个半导体元件与电子部件之间的空间与成形树脂一体成型 。

公开(公告)号：US20120320539A1

公开(公告)日：2012-12-20

申请号：US13580856

申请日：2011-04-07

申请人： Hiroe Kowada ,  Atsushi Yamaguchi

发明人： Hiroe Kowada ,  Atsushi Yamaguchi

IPC分类号： H05K7/00 ,  B23K31/02 ,  H05K13/04

CPC分类号： H01L23/293 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/83951 ,  H05K3/284 ,  H05K3/288 ,  H05K3/3489 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/176 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029

摘要： A package structure including an electronic component 2 mounted on a circuit board 1 with a bonding metal 3, wherein a flux 4 contains a compound having a hydroxyl group and remains on the surface of the bonding metal 3, a coating resin 5 contains 10% to 50% by weight of isocyanate, and a reactant 8 of the coating resin 5 and the flux 4 is formed at an interface between the flux 4 and the coating resin 5. Water resistance and moisture resistance can be obtained without cleaning the flux 4. The coating resin 5 can be easily peeled off at a temperature not lower than the glass transition point temperature of the flux 4.

摘要翻译： 一种封装结构，其包括安装在具有接合金属3的电路板1上的电子部件2，其中焊剂4含有具有羟基的化合物并保留在接合金属3的表面上，涂布树脂5含有10％〜 50重量％的异氰酸酯，并且涂料树脂5和助熔剂4的反应物8形成在助熔剂4和涂料树脂5之间的界面处。可以在不清洗助焊剂4的情况下获得耐水性和耐湿性。 涂布树脂5可以在不低于焊剂4的玻璃化转变点温度的温度下容易地剥离。

公开(公告)号：US08217275B2

公开(公告)日：2012-07-10

申请号：US12517311

申请日：2007-12-03

申请人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Kousou Matsuno

发明人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Kousou Matsuno

IPC分类号： H05K1/00

CPC分类号： H01L21/563 ,  C08G59/4021 ,  C08L63/00 ,  C09K3/10 ,  C09K2200/0645 ,  C09K2200/0647 ,  C09K2200/065 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  Y02P20/582 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49726 ,  H01L2924/00

摘要： A sealing material is provided which has sealing characteristics with low stress and high reliability upon mounting electronic parts on a board, and good repairablity after the sealing. The sealing material contains a heat-curable resin component and is characterized by ΔE/ΔT in a range of from 0.5 MPa/° C. to 30 MPa/° C. wherein ΔE/ΔT represents a ratio of change (ΔE) in storage elastic modulus (E) relative to a temperature change (ΔT) when the storage elastic modulus (E) is determined as the temperature is raised within a temperature range including a glass transition point (Tg) of the cured sealing material.

摘要翻译： 提供了一种密封材料，其在将电子部件安装在基板上时具有低应力和高可靠性的密封特性，并且在密封之后具有良好的可维修性。 密封材料含有热固性树脂组分，其特征在于：在0.5MPa /℃至30MPa /℃的范围内，其中＆Dgr; E /＆Dgr; T表示比例 的变化（＆Dgr; E）相对于温度变化（＆Dgr; T）的储存弹性模量（E），当储存弹性模量（E）在包括玻璃化转变点（Tg） ）固化的密封材料。

公开(公告)号：US08205327B2

公开(公告)日：2012-06-26

申请号：US12094219

申请日：2006-11-13

申请人： Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Kazuhiro Nishikawa ,  Kunio Hibino

发明人： Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Kazuhiro Nishikawa ,  Kunio Hibino

IPC分类号： H05K3/30

CPC分类号： H05K3/323 ,  H05K3/321 ,  Y10T29/49114 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165

摘要： A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive.

摘要翻译： 一种制造其上安装有电子部件的电路板的方法至少包括以下步骤：（a）将包含分散在其中的导电粒子的液体光聚合性粘合剂供应到印刷电路板的表面上，以形成粘合剂层 板表面; （b）用紫外线照射光聚合性粘合剂变成凝胶，以提供粘合剂层的粘附性; 以及（c）从粘合剂层的上表面侧将电子部件压靠在印刷基板的部件安装部上，形成电子部件与部件安装部之间的电连接，在该方法中， 可聚合粘合剂是延迟的反应性粘合剂。

公开(公告)号：US20120066170A1

公开(公告)日：2012-03-15

申请号：US13213616

申请日：2011-08-19

申请人： Hiroyuki FURUYA ,  Atsushi Yamaguchi ,  Akihiro Otsuka ,  Akira Ueda

发明人： Hiroyuki FURUYA ,  Atsushi Yamaguchi ,  Akihiro Otsuka ,  Akira Ueda

IPC分类号： G06N5/02

CPC分类号： G10K11/16

摘要： A sound-volume prediction apparatus acquires model information on an electronic device and positional information on an air intake section and/or an air-exhaust section of the electronic device. Furthermore, by using the model information and the positional information, the sound-volume prediction apparatus extends a sound ray that indicates a transmission route of sound generated by a sound source inside the electronic device toward the air-intake section and/or the air-exhaust section from the position of the sound source until the sound ray reaches the outside of the electronic device. The sound-volume prediction apparatus predicts sound transmission characteristics inside the electronic device by using geometric information on the flow path of the extended sound ray.

摘要翻译： 音量预测装置获取关于电子装置的模型信息以及电子装置的进气部和排气部的位置信息。 此外，通过使用模型信息和位置信息，音量预测装置将指示由电子设备内部的声源产生的声音的传输路线朝向进气部分和/或空气 - 排气部分从声源的位置到声线到达电子设备的外部。 音量预测装置通过使用延伸声线的流路上的几何信息来预测电子装置内部的声音传输特性。

公开(公告)号：US08102622B2

公开(公告)日：2012-01-24

申请号：US12318645

申请日：2009-01-05

申请人： Atsushi Yamaguchi ,  Michitaka Nishiyama ,  Shin Narushima ,  Hiromichi Umehara ,  Makoto Sato ,  Tatsuhiro Nojima

发明人： Atsushi Yamaguchi ,  Michitaka Nishiyama ,  Shin Narushima ,  Hiromichi Umehara ,  Makoto Sato ,  Tatsuhiro Nojima

IPC分类号： G11B5/127

CPC分类号： G11B5/3116 ,  G11B5/1278 ,  G11B5/3163

摘要： In a perpendicular magnetic write head manufacturing method a magnetic layer is formed on a substrate. On the magnetic layer, first and second nonmagnetic layers are formed with different materials. A mask pattern is formed on the second nonmagnetic layer, and the second nonmagnetic layer in a region not covered with the mask pattern is removed. Thereby, the patterned second nonmagnetic layer is formed while leaving the first nonmagnetic layer. The mask pattern is removed and a milling process is selectively performed on the first nonmagnetic layer and the magnetic layer with the patterned second nonmagnetic layer as a mask to remove all of the first nonmagnetic layer in an exposed region and to dig down the magnetic layer in the exposed region, thereby forming a main magnetic pole layer having an inclined part whose thickness decreases with distance from an edge position of the patterned second nonmagnetic layer.

摘要翻译： 在垂直磁性写入头制造方法中，在衬底上形成磁性层。 在磁性层上，第一和第二非磁性层由不同的材料形成。 在第二非磁性层上形成掩模图案，并且去除未被掩模图案覆盖的区域中的第二非磁性层。 由此，形成图案化的第二非磁性层，同时离开第一非磁性层。 去除掩模图案，并且在第一非磁性层和具有图案化的第二非磁性层的磁性层上选择性地进行研磨工艺作为掩模，以去除暴露区域中的所有第一非磁性层，并将 从而形成具有倾斜部分的主磁极层，该倾斜部分的厚度随着距图案化的第二非磁性层的边缘位置的距离而减小。

公开(公告)号：US08004006B2

公开(公告)日：2011-08-23

申请号：US12084634

申请日：2006-11-07

申请人： Ken Nakahara ,  Atsushi Yamaguchi

发明人： Ken Nakahara ,  Atsushi Yamaguchi

IPC分类号： H01L33/00

CPC分类号： H01L33/20 ,  H01L21/78 ,  H01L33/0095 ,  H01L33/44

摘要： Provided are a nitride semiconductor light emitting element which does not suffer a damage on a light emitting region and has a high luminance without deterioration, even though the nitride semiconductor light emitting element is one in which electrodes are disposed opposite to each other and an isolation trench for chip separation and laser lift-off is formed by etching; and a manufacturing method thereof. An n-type nitride semiconductor layer 2 has a step, formed in a position beyond an active layer 3 when viewed from a p side. Up to the position of this step A, a protective insulating film 6 covers a part of the n-type nitride semiconductor layer 2, the active layer 3, a p-type nitride semiconductor layer 4, the side of a p electrode 5 and a part of the top side of the p electrode 5. The use of a structure having a chip side face covered with the protective insulating film 6 prevents the active layer or the like from being exposed to an etching gas for a long time when an isolation trench for chip separation or laser lift-off is formed by etching.

摘要翻译： 提供一种氮化物半导体发光元件，即使氮化物半导体发光元件是彼此相对设置的电极和隔离沟槽，也不会对发光区域造成损害并具有高亮度而不劣化 通过蚀刻形成芯片分离和激光剥离; 及其制造方法。 当从p侧观察时，n型氮化物半导体层2具有形成在超过有源层3的位置的台阶。 直到该步骤A的位置，保护绝缘膜6覆盖n型氮化物半导体层2，有源层3，p型氮化物半导体层4，p型电极5的一侧以及部分 使用由保护绝缘膜6覆盖的具有芯片侧面的结构使得有源层等长时间暴露于蚀刻气体时，当用于 通过蚀刻形成芯片分离或激光剥离。

公开(公告)号：US08000063B2

公开(公告)日：2011-08-16

申请号：US11623493

申请日：2007-01-16

申请人： Atsushi Yamaguchi ,  Kei Hirata ,  Satoshi Miura ,  Yoshihiro Tsuchiya ,  Kiyoshi Noguchi

发明人： Atsushi Yamaguchi ,  Kei Hirata ,  Satoshi Miura ,  Yoshihiro Tsuchiya ,  Kiyoshi Noguchi

IPC分类号： G11B5/39

CPC分类号： G11B5/3967 ,  G11B5/11 ,  G11B5/3912

摘要： A magneto-resistive element includes a lower magnetic shield film and a magneto-resistive film disposed above the lower magnetic shield film. The lower magnetic shield film includes a lower shield layer and an upper shield layer. The upper shield layer is amorphous or microcrystalline, made of a NiFe or CoFe composition containing B or P, and deposited on the lower shield layer. The lower shield layer is a magnetic conductive layer which is amorphous or microcrystalline with a crystal grain size equal to or less than 20 nm.

摘要翻译： 磁阻元件包括下磁屏蔽膜和设置在下磁屏蔽膜上方的磁阻膜。 下磁屏蔽膜包括下屏蔽层和上屏蔽层。 上屏蔽层是无定形或微晶的，由含有B或P的NiFe或CoFe组合物制成并沉积在下屏蔽层上。 下屏蔽层是晶体尺寸等于或小于20nm的非晶或微晶的导电层。

公开(公告)号：US20110142614A1

公开(公告)日：2011-06-16

申请号：US12967196

申请日：2010-12-14

申请人： Chisachi Kato ,  Atsushi Yamaguchi ,  Akira Ueda ,  Kazuhiro Nitta ,  Akihiro Otsuka ,  Tadashi Katsui ,  Masahiro Suzuki ,  Yoshihiko Aizawa ,  Honami Oosawa

发明人： Chisachi Kato ,  Atsushi Yamaguchi ,  Akira Ueda ,  Kazuhiro Nitta ,  Akihiro Otsuka ,  Tadashi Katsui ,  Masahiro Suzuki ,  Yoshihiko Aizawa ,  Honami Oosawa

IPC分类号： F04D29/52 ,  F04D19/02

CPC分类号： F04D29/663 ,  F04D19/002 ,  F04D19/007 ,  F04D19/024 ,  F04D29/526 ,  F04D29/542 ,  F04D29/547 ,  F04D29/667 ,  F04D29/681

摘要： A counter-rotating axial flow fan with reduced noise at the target operating point achieved without modifying a front impeller, a rear impeller, or a middle stationary portion is provided. An annular rib including a projecting surface for generating turbulent flow is formed on an inner wall portion of a casing at a position off from the middle stationary portion to a side of the rear impeller, the projecting surface extending radially inwardly of the inner wall portion and extending continuously in the circumferential direction of the inner wall portion. A fluid striking the projecting surface for generating turbulent flow is partially disturbed to form a turbulent flow before entering an area in which the rear impeller is provided. The turbulent flow suppresses flow separation of a fluid flowing along the surfaces of rear blades of the rear impeller from the surfaces of the rear blades.

摘要翻译： 提供了在不改变前叶轮，后叶轮或中间静止部分的情况下实现在目标操作点处具有降低的噪声的反向旋转轴流风扇。 在从中间静止部分到后部叶轮的一侧的位置处，在壳体的内壁部分上形成包括用于产生湍流的突出表面的环形肋，所述突出表面沿着内壁部分的径向向内延伸， 在内壁部的圆周方向上连续延伸。 撞击突出表面以产生湍流的流体在进入其中设置后叶轮的区域之前部分地被扰动以形成湍流。 湍流抑制沿着后叶片的后叶的表面流动的流体与后叶片的表面的流动分离。