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公开(公告)号：US11991838B2
公开(公告)日：2024-05-21
申请号：US17709852
申请日：2022-03-31
发明人： Cheng-Yi Yang , Hao-Wen Zhong , Biao Li , Ming-Jaan Ho , Ning Hou
CPC分类号： H05K3/4644 , H05K1/183 , H05K1/186
摘要： An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.
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公开(公告)号：US11665820B2
公开(公告)日：2023-05-30
申请号：US17536321
申请日：2021-11-29
发明人： Man-Zhi Peng , Rui-Wu Liu , Ming-Jaan Ho
CPC分类号： H05K1/112 , H05K3/0014 , H05K3/0052 , H05K1/119 , H05K3/0029 , H05K3/0038 , H05K2201/09118 , H05K2201/09445 , H05K2201/09609 , H05K2201/09672 , H05K2203/0169
摘要： Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.
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公开(公告)号：US12048084B2
公开(公告)日：2024-07-23
申请号：US17637133
申请日：2020-03-27
发明人： Hsiao-Ting Hsu , Ming-Jaan Ho , Katsumi Fujiwara , Fu-Yun Shen , Fu-Wei Zhong
CPC分类号： H05K1/0209 , H05K1/0353 , H05K1/028
摘要： A covering film (100) includes a first covering layer (10), a first adhesive layer (20), and a thermal conductive layer (30) sandwiched between the first covering layer (10) and the first adhesive layer (20). A thermal conductivity of the thermal conductive layer (30) is K1, K1 is in a range of 3 W/m.K to 65 W/m.K. A thermal conductivity of the first covering layer (10) is K2, K2 is in a range of 0.02 W/m.K to 3.0 W/m.K. A thermal conductivity of the first adhesive layer (20) is K3, K3 is in a range of 0.02 W/m.K to 1.0 W/m.K. A circuit board and its manufacturing method are also provided.
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公开(公告)号：US20240130050A1
公开(公告)日：2024-04-18
申请号：US18398552
申请日：2023-12-28
发明人： Cheng-Yi Yang , Hao-Wen Zhong , Biao Li , Ming-Jaan Ho , Ning Hou
CPC分类号： H05K3/4644 , H05K1/183 , H05K1/186
摘要： An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.
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公开(公告)号：US11297748B2
公开(公告)日：2022-04-05
申请号：US16021308
申请日：2018-06-28
发明人： Fu-Yun Shen , Ming-Jaan Ho , Hsiao-Ting Hsu
摘要： A film shielding against electromagnetic interference comprises an insulating layer, a silver layer, and a conductive adhesive layer. The insulating layer is made of polyimide. The metal layer is formed on the insulating layer. The conductive adhesive layer is coated on the metal layer and is very thin but renders the film less prone to bubbling and rupturing when in place.
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公开(公告)号：US11296444B2
公开(公告)日：2022-04-05
申请号：US17033842
申请日：2020-09-27
发明人： Ming-Jaan Ho , Man-Zhi Peng
摘要： A board-to-board connection structure includes a first circuit board, a second circuit board, and a connector. The first circuit board includes a first base layer and a first outer circuit layer. The second circuit board includes a second base layer and a second outer circuit layer. The connector electrically couples the first circuit board and the second circuit board. The connector includes a housing, a first electrical connection portion, and a second electrical connection portion. A side surface of the first circuit board includes a first conductive layer electrically coupled to the first outer circuit layer. The connector is coupled to the first conductive layer through the first electrical connection portion. The second circuit board is located in the housing, and the second electrical connection portion is electrically coupled to the second outer circuit layer.
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公开(公告)号：US11212922B2
公开(公告)日：2021-12-28
申请号：US16767870
申请日：2019-04-23
发明人： Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen , Hsiao-Ting Hsu , Yong-Chao Wei
摘要： The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.
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公开(公告)号：US11134564B1
公开(公告)日：2021-09-28
申请号：US17036544
申请日：2020-09-29
发明人： Hsiao-Ting Hsu , Ming-Jaan Ho , Fu-Yun Shen , Li-Kun Liu
IPC分类号： H01K1/02 , H05K1/02 , H05K1/09 , H05K1/11 , H05K3/46 , H05K3/06 , H05K1/18 , H05K3/40 , H05K3/28 , H05K3/32
摘要： A transparent PCB includes a transparent base film, a hardened layer, an electrode film, a first conductive paste, a second conductive paste, and an electronic component. The hardened layer is formed on a side of the transparent base film. The electrode film is formed on a side of the hardened layer. The electrode film includes a first transparent conductive oxide layer, a metal layer, and a second transparent conductive oxide layer. The first conductive paste is formed on the electrode film. The second conductive paste is formed on the electrode film and spaced from the first conductive paste. The electronic component is electrically connected to the electrode film through the first conductive paste and the second conductive paste. The present invention also needs to provide a method for manufacturing the transparent PCB.
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公开(公告)号：US12063752B2
公开(公告)日：2024-08-13
申请号：US17289035
申请日：2020-05-29
发明人： Wen-Zhu Wei , Ming-Jaan Ho , Fu-Yun Shen , Hong-Yan Guo
CPC分类号： H05K3/4614 , H05K1/0218 , H05K1/0298 , H05K3/06 , H05K3/4061 , H05K1/0237 , H05K1/0277 , H05K2203/0723 , H05K2203/1121
摘要： A circuit board includes first circuit substrate and second circuit substrate; first circuit substrate includes: a first base layer arranged on the first circuit layer and a plurality of first conductive bodies on the substrate layer; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; second circuit substrate includes: a second base layer, a second base layer arranged on the second circuit layer and a plurality of second conductive bodies; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer; The body is electrically connected to the second conductive body.
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公开(公告)号：US11672100B2
公开(公告)日：2023-06-06
申请号：US17112423
申请日：2020-12-04
发明人： Fu-Yun Shen , Hsiao-Ting Hsu , Ming-Jaan Ho
CPC分类号： H05K7/20336 , C25D7/0678 , F28D15/046 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2307/302 , B32B2311/12
摘要： A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber. The present invention also needs to provide a method for manufacturing the heat equalization plate.
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