公开(公告)号：US08390016B2

公开(公告)日：2013-03-05

申请号：US13237789

申请日：2011-09-20

申请人： Bernd Keller ,  Ban P. Loh

发明人： Bernd Keller ,  Ban P. Loh

IPC分类号： H01L33/00

CPC分类号： B41J3/407 ,  H01L21/6715 ,  H01L33/505 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2933/0041

摘要： Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.

公开(公告)号：US08378374B2

公开(公告)日：2013-02-19

申请号：US12685883

申请日：2010-01-12

申请人： Ban P. Loh ,  Nicholas Medendorp, Jr. ,  Bernd Keller

发明人： Ban P. Loh ,  Nicholas Medendorp, Jr. ,  Bernd Keller

IPC分类号： H01L33/62 ,  H01L33/64

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/19107 ,  H01L2924/00014

摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.

摘要翻译： 一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫， 接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域 并且延伸到所述支撑构件的第二侧表面的延伸区域。 第二电接合板的管芯安装区域可以被配置为接收电子设备。 底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

公开(公告)号：US20090152573A1

公开(公告)日：2009-06-18

申请号：US12002429

申请日：2007-12-14

申请人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

发明人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

IPC分类号： H01L33/00 ,  H01L21/56

CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.

摘要翻译： 一种封装的LED器件，其具有纹理化的密封剂，其与其上设置有至少一个LED芯片的安装表面保持一致。 可以在包装之前或期间将可以使用添加剂或减色过程进行纹理化的纹理密封剂施加到LED。 密封剂包括至少一个纹理表面，光从该表面发射。 纹理表面有助于减少密封剂内的全内反射，提高输出分布的提取效率和色温均匀性。 几个芯片可以安装在单个纹理密封剂下面。 可以使用具有不规则表面的模具同时在许多LED上形成多个密封剂。

公开(公告)号：US08043874B2

公开(公告)日：2011-10-25

申请号：US12491162

申请日：2009-06-24

申请人： Bernd Keller ,  Ban P. Loh

发明人： Bernd Keller ,  Ban P. Loh

IPC分类号： H01L21/00 ,  B05D5/06

CPC分类号： B41J3/407 ,  H01L21/6715 ,  H01L33/505 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2933/0041

摘要： Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.

摘要翻译： 在液体介质中使用波长转换或荧光体颗粒的液滴涂覆半导体器件的方法和系统。 多个喷嘴将受控量的基质材料输送到半导体器件的表面，其中每个所述喷嘴具有用于基质材料通过的开口。 开口具有其中荧光体颗粒的直径小于或近似等于开口直径的一半的直径。 荧光体颗粒也基本上是球形或圆形。 喷嘴通常布置在打印头上，该打印头利用喷墨打印技术来覆盖具有基质材料层的半导体器件。 该方法和系统特别适用于用一层磷光体材料覆盖LED。

公开(公告)号：US07569406B2

公开(公告)日：2009-08-04

申请号：US11328887

申请日：2006-01-09

申请人： Bernd Keller ,  Ban P. Loh

发明人： Bernd Keller ,  Ban P. Loh

IPC分类号： H01L21/00

CPC分类号： B41J3/407 ,  H01L21/6715 ,  H01L33/505 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2933/0041

摘要： Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.

摘要翻译： 在液体介质中使用波长转换或荧光体颗粒的液滴涂覆半导体器件的方法和系统。 多个喷嘴将受控量的基质材料输送到半导体器件的表面，其中每个所述喷嘴具有用于基质材料通过的开口。 开口具有其中荧光体颗粒的直径小于或近似等于开口直径的一半的直径。 荧光体颗粒也基本上是球形或圆形。 喷嘴通常布置在打印头上，该打印头利用喷墨打印技术来覆盖具有基质材料层的半导体器件。 该方法和系统特别适用于用一层磷光体材料覆盖LED。

公开(公告)号：US09431589B2

公开(公告)日：2016-08-30

申请号：US12002429

申请日：2007-12-14

申请人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

发明人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

IPC分类号： H01L33/54 ,  H01L25/075

CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.

公开(公告)号：US08608349B2

公开(公告)日：2013-12-17

申请号：US13023263

申请日：2011-02-08

申请人： Ban P. Loh

发明人： Ban P. Loh

IPC分类号： F21V3/00

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).

摘要翻译： 发光管芯封装包括基板，反射板和透镜。 衬底具有用于将外部电源连接到安装衬垫上的发光二极管（LED）的迹线。 反射板耦合到基板并且基本上围绕安装焊盘，并且包括反射表面以在期望的方向上引导来自LED的光。 透镜相对于反射板自由移动，并且能够被润湿并粘附到其上的密封剂升高或降低，并且被放置在距离LED芯片最佳距离处。 在操作期间由LED产生的热量通过基板（作为底部散热器）和反射板（作为顶部散热器）两者而被从LED引出。

公开(公告)号：US08446004B2

公开(公告)日：2013-05-21

申请号：US12215319

申请日：2008-06-26

申请人： Ban P. Loh ,  Gerald H. Negley

发明人： Ban P. Loh ,  Gerald H. Negley

IPC分类号： H01L23/34

CPC分类号： H01L33/644 ,  H01L33/486 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

公开(公告)号：US08123375B2

公开(公告)日：2012-02-28

申请号：US12093698

申请日：2006-11-17

申请人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

发明人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

IPC分类号： F21V23/00

CPC分类号： H05B33/0803 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133613 ,  G09F9/35 ,  H01L2224/49175 ,  H01L2224/8592 ,  H05B33/0821 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0058 ,  Y10S362/80

摘要： A solid state lighting tile (10) includes a substrate having a planar surface. A first plurality of solid state light emitting devices (LEDs) are on the substrate. The first plurality of LEDs (19) are connected in series to form a first string of LEDs of a first color having an anode contact (22) at a first end of the tile and a cathode contact (24) at a second end of the tile. A second plurality of LEDs are on the substrate. The second plurality of LEDs (21) are connected in series to form a second string of LEDs of the first color having a cathode contact (28) at the first end of the tile and an anode contact (26) at the second end of the tile.

摘要翻译： 固态照明瓦（10）包括具有平坦表面的基板。 第一多个固态发光器件（LED）在衬底上。 第一组多个LED（19）串联连接以形成第一颜色的第一串LED，在第一端具有阳极触点（22），在第二端的第二端处形成阴极触点（24） 瓦。 第二多个LED在基板上。 所述第二多个LED（21）串联连接以形成所述第一颜色的第二串LED，所述第一颜色的LED在所述瓷砖的第一端具有阴极接触（28），在所述第二颜色的第二端具有阳极接触（26） 瓦。

公开(公告)号：US20110186895A1

公开(公告)日：2011-08-04

申请号：US13023263

申请日：2011-02-08

申请人： Ban P. Loh

发明人： Ban P. Loh

IPC分类号： H01L33/60

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).