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公开(公告)号：US20080146052A1
公开(公告)日：2008-06-19
申请号：US12037890
申请日：2008-02-26
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
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公开(公告)号：US07356920B2
公开(公告)日：2008-04-15
申请号：US10986712
申请日：2004-11-12
IPC分类号： H05K3/30
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。
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公开(公告)号：US09961771B2
公开(公告)日：2018-05-01
申请号：US13571252
申请日：2012-08-09
申请人： JengPing Lu , Eugene M. Chow
发明人： JengPing Lu , Eugene M. Chow
CPC分类号： H05K1/142 , H05K1/0286 , H05K1/14 , H05K3/368 , H05K2201/09963 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern.
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公开(公告)号：US09111943B2
公开(公告)日：2015-08-18
申请号：US12725754
申请日：2010-03-17
IPC分类号： H01L23/48 , H01L23/52 , H01L23/544 , H01L23/00 , H01L25/065 , H01L25/00
CPC分类号： H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2223/54473 , H01L2224/11013 , H01L2224/11015 , H01L2224/11848 , H01L2224/1301 , H01L2224/13021 , H01L2224/13023 , H01L2224/13078 , H01L2224/1319 , H01L2224/14179 , H01L2224/1601 , H01L2224/16145 , H01L2224/16147 , H01L2224/8112 , H01L2224/81191 , H01L2224/81193 , H01L2224/81897 , H01L2224/81948 , H01L2225/06513 , H01L2225/06531 , H01L2225/06565 , H01L2225/06593 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/00
摘要： A multi-chip module (MCM) that includes alignment features is described. This MCM includes at least two substrates having facing surfaces with positive features disposed on them. Note that a given positive feature on either of the surfaces protrudes above the surface. Furthermore, the two substrates are mechanically coupled by these positive features. In particular, a given one of the positive features on one of the surfaces mates with a given subset of the positive features on the other of the surfaces. Additionally, the given subset of the positive features includes two or more of the positive features.
摘要翻译： 描述了包括对准特征的多芯片模块（MCM）。 该MCM包括具有设置在其上的具有正特征的面对表面的至少两个基板。 请注意，任一表面上的给定正面特征突出在表面上方。 此外，两个基板通过这些正特征机械耦合。 特别地，其中一个表面上的给定的一个正特征与另一个表面上的正特征的给定子集配合。 此外，正特征的给定子集包括两个或多个正特征。
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公开(公告)号：US08435612B2
公开(公告)日：2013-05-07
申请号：US13248660
申请日：2011-09-29
IPC分类号： B32B3/22
CPC分类号： B81C1/00666 , G01R1/06755 , G01R1/07357 , H01L2924/00013 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H05K3/4092 , Y10T29/49146 , Y10T29/49147 , Y10T29/49204 , Y10T428/13 , Y10T428/1317 , Y10T428/24174 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。
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公开(公告)号：US08355035B2
公开(公告)日：2013-01-15
申请号：US12697109
申请日：2010-01-29
申请人： Eugene M. Chow , JenPing Lu
发明人： Eugene M. Chow , JenPing Lu
IPC分类号： B41J2/385
CPC分类号： B41M1/10
摘要： A printing sub-system including same including a pixilated photoconductive member (such as a photobelt) is disclosed. Electrically isolated cells hold surface application material above the photoconductor. The surface application material is first charged. Charge on the surface application material in an individual cell may then be discharged by exposure of a region of the photoconductor proximate that cell to light from an optical addressing system. The surface application material is brought into proximity of an image receiving member such as paper, which is either charged or proximate a charge source. Charged surface application material in a cell may then be electrostatically transferred from the cell onto the image receiving member, while discharged surface application material remains in the cell. The subsystem may form a part of a complete printing system using many existing components. Among other advantages, viscous liquid surface application material may thereby be printed.
摘要翻译： 公开了包括像素化感光体（例如光带）的包括其的印刷子系统。 电隔离的电池在光电导体上方保持表面应用材料。 首先对表面施用材料进行充电。 然后可以通过将靠近该单元的光电导体的区域暴露于来自光寻址系统的光来对单个单元中的表面施加材料上的电荷进行放电。 表面施加材料被带入诸如纸的图像接收构件，其被充电或靠近电荷源。 然后可以将电池中的充电表面施用材料静电从细胞转移到图像接收部件上，同时放电的表面施用材料保留在电池中。 子系统可以使用许多现有组件形成完整打印系统的一部分。 除了其它优点之外，可以印刷粘性液体表面施加材料。
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公开(公告)号：US08330485B2
公开(公告)日：2012-12-11
申请号：US12845690
申请日：2010-07-28
申请人： Eugene M. Chow , Dirk DeBruyker
发明人： Eugene M. Chow , Dirk DeBruyker
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06744 , G01R1/06761
摘要： A curved spring structure includes a base (anchor) section extending parallel to a planar substrate surface, a cantilever section extending away from the substrate surface, and an optional elongated section extending from the base section along the substrate surface under the cantilevered section. The cantilever section includes a body portion integrally attached at a lower end to the anchor section and extending at an acute angle relative to the planar surface, and a curved portion integrally attached to an upper end of the body portion and including a downturned tip. A middle section of the curved portion is disposed a first distance away from the planar surface of the substrate, and the downturned tip is disposed a second distance away from the planar surface of the substrate, the first distance being greater than the second distance.
摘要翻译： 弯曲的弹簧结构包括平行于平面衬底表面延伸的基部（锚）部分，远离衬底表面延伸的悬臂部分，以及从底部部分沿悬臂部分下方的衬底表面延伸的可选的细长部分。 悬臂部分包括主体部分，其整体地附接到锚固部分的下端并相对于平坦表面以锐角延伸;以及弯曲部分，其整体地附接到主体部分的上端并且包括下降的尖端。 弯曲部分的中间部分设置成离开基板的平面表面的第一距离，并且下端尖端设置成离开基板的平面表面第二距离，第一距离大于第二距离。
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38.发明申请IMAGING MEMBERS FOR INK-BASED DIGITAL PRINTING COMPRISING STRUCTURED ORGANIC FILMS 有权用于包含结构有机膜的基于墨水的数字打印的成像成员公开(公告)号：US20120040283A1
公开(公告)日：2012-02-16
申请号：US12854962
申请日：2010-08-12
申请人： Matthew A. Heuft , Eugene M. Chow , Adrien P. Côté , Nan-Xing Hu
发明人： Matthew A. Heuft , Eugene M. Chow , Adrien P. Côté , Nan-Xing Hu
IPC分类号： G03G15/00
CPC分类号： G03G15/10 , G03G5/0589 , G03G5/0592 , G03G5/0596 , G03G5/071 , G03G5/075 , G03G5/076 , G03G5/14786 , G03G5/14791 , G03G5/14795 , G03G15/75
摘要： An imaging member for ink-based digital printing having an outermost layer including a structured organic film (SOF) having a plurality of segments and a plurality of linkers arranged as a covalent organic framework, wherein the structured organic film may be multi-segment thick.
摘要翻译： 一种用于油墨数字印刷的成像构件，其具有包括具有多个段的结构化有机膜（SOF）的最外层和布置为共价有机骨架的多个接头，其中所述结构化有机膜可以是多段厚度。
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公开(公告)号：US20110318880A1
公开(公告)日：2011-12-29
申请号：US13162473
申请日：2011-06-16
IPC分类号： H01L21/56
CPC分类号： H01L24/11 , G01R1/06727 , G01R1/06761 , G01R3/00 , H01L21/568 , H01L21/6835 , H01L23/49811 , H01L24/12 , H01L24/742 , H01L24/81 , H01L2221/68368 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01033 , H01L2924/01054 , H01L2924/01082 , H01L2924/14
摘要： A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact spring is adjacent to an upper surface of the removable encapsulating layer. The contact spring applicator may also include an applicator substrate, a release layer, a plurality of unreleased contact springs on the release layer and a bond pad at an anchor end of each contact spring. The contact spring applicators apply contact springs to an integrated circuit chip, die or package or to a probe card by aligning the bond pads with bond pad landings on the receiving device. The bond pads are adhered to the bond pad landings. The encapsulating or release layer is then removed to separate the contact springs from the contact spring applicator substrate.
摘要翻译： 提供接触弹簧施加器，其包括施加器基板，可移除的封装层和嵌入在可移除封装层中的多个接触弹簧。 接触弹簧被定位成使得每个接触弹簧上的接合焊盘与可移除的封装层的上表面相邻。 接触弹簧施加器还可以包括施加器基板，释放层，释放层上的多个未释放的接触弹簧和每个接触弹簧的锚固端处的接合垫。 接触弹簧施加器通过将接合垫与接收装置上的接合垫平台对准，将接触弹簧施加到集成电路芯片，管芯或封装或探针卡。 接合焊盘粘附到接合焊盘平台上。 然后去除包封或释放层以将接触弹簧与接触弹簧施加器基板分离。
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40.发明授权公开(公告)号：US08040364B2
公开(公告)日：2011-10-18
申请号：US12502949
申请日：2009-07-14
IPC分类号： B41J2/385
CPC分类号： B41J2/0057
摘要： An imaging system including an image receiving structure including a tunable-resistivity material; and an energy source to emit an energy beam at the image receiving structure to pattern-wise program the tunable-resistivity material. A resistivity can be pattern-wise changed. Marking material can be pattern-wise adhered in response to the pattern-wise changed resistivity.
摘要翻译： 一种成像系统，包括包括可调谐电阻率材料的图像接收结构; 以及在所述图像接收结构处发射能量束以对所述可调谐电阻率材料进行图案化编程的能量源。 电阻率可以以图案方式改变。 响应于图案形式的电阻率，标记材料可以以图案方式粘附。
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