公开(公告)号：US09111943B2

公开(公告)日：2015-08-18

申请号：US12725754

申请日：2010-03-17

申请人： Eugene M. Chow ,  Philipp H. Schmaelzle

发明人： Eugene M. Chow ,  Philipp H. Schmaelzle

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/544 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/11013 ,  H01L2224/11015 ,  H01L2224/11848 ,  H01L2224/1301 ,  H01L2224/13021 ,  H01L2224/13023 ,  H01L2224/13078 ,  H01L2224/1319 ,  H01L2224/14179 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/8112 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81897 ,  H01L2224/81948 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06565 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00

摘要： A multi-chip module (MCM) that includes alignment features is described. This MCM includes at least two substrates having facing surfaces with positive features disposed on them. Note that a given positive feature on either of the surfaces protrudes above the surface. Furthermore, the two substrates are mechanically coupled by these positive features. In particular, a given one of the positive features on one of the surfaces mates with a given subset of the positive features on the other of the surfaces. Additionally, the given subset of the positive features includes two or more of the positive features.

摘要翻译： 描述了包括对准特征的多芯片模块（MCM）。 该MCM包括具有设置在其上的具有正特征的面对表面的至少两个基板。 请注意，任一表面上的给定正面特征突出在表面上方。 此外，两个基板通过这些正特征机械耦合。 特别地，其中一个表面上的给定的一个正特征与另一个表面上的正特征的给定子集配合。 此外，正特征的给定子集包括两个或多个正特征。

公开(公告)号：US20110227200A1

公开(公告)日：2011-09-22

申请号：US12725754

申请日：2010-03-17

申请人： Eugene M. Chow ,  Philipp H. Schmaelzle

发明人： Eugene M. Chow ,  Philipp H. Schmaelzle

IPC分类号： H01L23/544 ,  H01L21/50

CPC分类号： H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/11013 ,  H01L2224/11015 ,  H01L2224/11848 ,  H01L2224/1301 ,  H01L2224/13021 ,  H01L2224/13023 ,  H01L2224/13078 ,  H01L2224/1319 ,  H01L2224/14179 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/8112 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81897 ,  H01L2224/81948 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06565 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00

摘要： A multi-chip module (MCM) that includes alignment features is described. This MCM includes at least two substrates having facing surfaces with positive features disposed on them. Note that a given positive feature on either of the surfaces protrudes above the surface. Furthermore, the two substrates are mechanically coupled by these positive features. In particular, a given one of the positive features on one of the surfaces mates with a given subset of the positive features on the other of the surfaces. Additionally, the given subset of the positive features includes two or more of the positive features.

摘要翻译： 描述了包括对准特征的多芯片模块（MCM）。 该MCM包括具有设置在其上的具有正特征的面对表面的至少两个基板。 请注意，任一表面上的给定正面特征突出在表面上方。 此外，两个基板通过这些正特征机械耦合。 特别地，其中一个表面上的给定的一个正特征与另一个表面上的正特征的给定子集配合。 此外，正特征的给定子集包括两个或多个正特征。

公开(公告)号：US09281268B2

公开(公告)日：2016-03-08

申请号：US13517591

申请日：2012-06-13

申请人： Eugene M. Chow ,  John E. Cunningham ,  James G. Mitchell ,  Ivan Shubin

发明人： Eugene M. Chow ,  John E. Cunningham ,  James G. Mitchell ,  Ivan Shubin

IPC分类号： H05K3/20 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/13 ,  H01L23/14 ,  H01L23/544 ,  H01L23/00 ,  H01L25/065 ,  H01L23/15

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L2221/68309 ,  H01L2221/68345 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/136 ,  H01L2224/16237 ,  H01L2224/81005 ,  H01L2224/81007 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/81901 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/15787 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49895 ,  Y10T29/49947 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2924/00

摘要： A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.

摘要翻译： 描述了包括多层插入板的多层插入板和多芯片模块（MCM）。 多层插入板的不同区域中的第一表面和第二表面具有相关联的不同厚度。 此外，第一微弹簧连接器和第二微弹簧连接器分别设置在第一表面和第二表面上。 在MCM中，多级插入板的给定的一个第一表面面向MCM中芯片阵列的第一层中的桥式芯片，使得设置在桥式芯片上的第一连接器机械地和电耦合到 第一个微型弹簧连接器。 类似地，多层插入板的给定的一个第二表面面向芯片阵列中的第二层中的岛状芯片，使得设置在岛状芯片上的第二连接器机械地和电耦合到第二微型弹簧 连接器

公开(公告)号：US08869695B2

公开(公告)日：2014-10-28

申请号：US12566518

申请日：2009-09-24

申请人： Eugene M. Chow ,  Jing Zhou ,  Gerald A. Domoto ,  Grace T. Brewington

发明人： Eugene M. Chow ,  Jing Zhou ,  Gerald A. Domoto ,  Grace T. Brewington

IPC分类号： B41F9/10 ,  B41F31/04 ,  B41M1/42 ,  G03G15/10

CPC分类号： G03G15/104

摘要： An embodiment is a method and apparatus to meter ink for electrographic printing. An ink loading mechanism having an anilox roller fills ink from an ink supply into cells in the anilox roller having a plurality of valleys and lands that form the cells. The ink loading mechanism causes the valleys to be full or nearly full with the ink. The anilox roller rotates in a first direction. A blanket roller rotationally engaged with the anilox roller pulls the ink out of the cells and causes the valleys to be partially filled. The blanket roller rotates in a second direction. A first cleaning blade cleans tops of the lands of the cells.Another embodiment is a method and apparatus to meter ink for electrographic printing. An ink loading mechanism having an anilox roller fills ink from an ink supply into cells in the anilox roller having a plurality of valleys and lands forming the cells. The ink loading mechanism causes the valleys to be full or nearly full with the ink. The anilox roller rotates in a first direction. A soft blade positioned slightly below surface of the lands removes ink from the cells and causes the valleys the partially filled as the anilox roller rotates. A hard blade positioned at the surface of the lands to clean residue of ink on the surface of the lands as the anilox roller rotates.

摘要翻译： 一个实施例是一种用于电印印刷墨水的方法和装置。 具有网纹辊的墨水装载机构将油墨从墨水供给装入具有形成该单元的多个谷和平台的网纹辊中的单元中。 墨水装载机构使墨水充满或接近满。 网纹辊沿第一方向旋转。 与网纹辊旋转地接合的橡皮布辊将墨水从电池中拉出并导致谷部分地被填充。 橡皮布滚筒沿第二个方向旋转。 第一清洁刀片清洁细胞的脊部的顶部。 另一个实施例是一种计量油墨用于电印印刷的方法和装置。 具有网纹辊的墨水装载机构将油墨从墨水供给装入具有形成单元的多个谷底的网纹辊中的单元中。 墨水装载机构使墨水充满或接近满。 网纹辊沿第一方向旋转。 稍微位于焊盘表面下方的软刀片从电池中取出墨水，并使网纹辊旋转时部分填充的谷物。 位于平台表面的硬刀片，以在网纹辊旋转时清洁焊盘表面上的油墨残留物。

公开(公告)号：US08405198B2

公开(公告)日：2013-03-26

申请号：US12471188

申请日：2009-05-22

申请人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

发明人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC分类号： H01L23/52

CPC分类号： H01L21/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05599 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13005 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81903 ,  H01L2224/83193 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/0132 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4015 ,  H05K2201/0311 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2924/01015 ,  H01L2924/01049 ,  H01L2924/01031 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552 ,  H01L2924/00

摘要： A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.

摘要翻译： 封装具有具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，互连中的化学活化剂 区域，以及响应于互连区域中的化学活化剂的粘合剂。 封装具有焊盘芯片，其具有接触焊盘，弹簧芯片，其具有与接触焊盘接触以形成互连的微弹簧，在焊盘芯片或弹簧芯片之一上的化学活化剂以及响应于化学活化剂的粘合剂 另一方面是垫片芯片或弹簧芯片。 一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂 芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。

公开(公告)号：US08399296B2

公开(公告)日：2013-03-19

申请号：US13269609

申请日：2011-10-09

申请人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

发明人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC分类号： H01L21/00 ,  H01L23/34

CPC分类号： H01L21/563 ,  H01L24/01 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L33/62 ,  H01L2224/13016 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81855 ,  H01L2224/81902 ,  H01L2224/83192 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.

摘要翻译： 组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配 将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。

公开(公告)号：US08393785B2

公开(公告)日：2013-03-12

申请号：US12467072

申请日：2009-05-15

申请人： Dirk De Bruyker ,  Francisco E. Torres ,  Michal V. Wolkin ,  Gregory B. Anderson ,  Eugene M. Chow

发明人： Dirk De Bruyker ,  Francisco E. Torres ,  Michal V. Wolkin ,  Gregory B. Anderson ,  Eugene M. Chow

IPC分类号： G01N25/20 ,  G01K17/04

CPC分类号： G01K17/006 ,  B82Y35/00 ,  G01K2211/00

摘要： A nanocalorimeter includes a merging layer having, a drop placement area for holding drops to be merged and a thermal equilibration area. A measurement layer includes a substrate, and a temperature probe on the substrate, wherein the temperature probe extends out of the surface of the substrate to come into operative contact with the thermal equilibration area when the measurement layer is placed in operative association with the merging layer. The nanocalorimeter is configured to have the merging layer and the measurement layer non-integrated, making the measurement layer reusable.

摘要翻译： 纳米尺度计包括具有用于保持要合并的液滴的液滴放置区域和热平衡区域的合并层。 测量层包括衬底和衬底上的温度探针，其中当测量层与合并层可操作地相关联时，温度探针从衬底的表面延伸出来以与热平衡区域操作接触 。 纳米尺度计被配置为具有合并层和测量层非集成，使得测量层可重复使用。

公开(公告)号：US08312619B2

公开(公告)日：2012-11-20

申请号：US12754254

申请日：2010-04-05

申请人： Eugene M. Chow ,  Jeng Ping Lu ,  Meng H. Lean ,  David K. Biegelsen

发明人： Eugene M. Chow ,  Jeng Ping Lu ,  Meng H. Lean ,  David K. Biegelsen

IPC分类号： B23P19/00

CPC分类号： B81C99/002 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2224/95145 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

公开(公告)号：US20120285550A1

公开(公告)日：2012-11-15

申请号：US13557157

申请日：2012-07-24

申请人： Ashish Pattekar ,  Eugene M. Chow ,  Eric Peeters

发明人： Ashish Pattekar ,  Eugene M. Chow ,  Eric Peeters

IPC分类号： F17D1/16

CPC分类号： F16K99/0001 ,  B01L3/502738 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2400/0655 ,  F16K99/0026 ,  Y10T137/0318 ,  Y10T137/0391 ,  Y10T137/87249

摘要： A method of controlling a main fluid in a conduit using a microvalve is described. The microvalve includes a corresponding actuation aperture in an actuation aperture layer. A control fluid flows through the actuation aperture in response to an electric field applied via a charge distribution near an actuation aperture layer. In one embodiment, the electric field may adjust the opening and closing of the actuation aperture thereby controlling the flow of the control fluid. In a second embodiment, the control fluid is an electrorheological fluid where the electric field controls the viscosity of the ER fluid, thereby controlling fluid flow through the actuation aperture. In both embodiments the flow of the control fluid controls stretching of a flexible membrane into and out of the conduit, thereby controlling the flow of the main fluid by opening or closing the conduit.

摘要翻译： 描述了使用微型阀控制导管中的主流体的方法。 微型阀包括致动孔层中相应的致动孔。 响应于通过致动孔层附近的电荷分布施加的电场，控制流体流过致动孔。 在一个实施例中，电场可以调节致动孔的打开和关闭，从而控制控制流体的流动。 在第二实施例中，控制流体是电流变流体，其中电场控制ER流体的粘度，由此控制通过致动孔的流体流动。 在两个实施例中，控制流体的流动控制柔性膜进出导管的伸展，从而通过打开或关闭导管来控制主流体的流动。

公开(公告)号：US08287744B2

公开(公告)日：2012-10-16

申请号：US12775452

申请日：2010-05-06

申请人： Thomas Hantschel ,  David K. Fork ,  Eugene M. Chow ,  Dirk De Bruyker ,  Michel A. Rosa

发明人： Thomas Hantschel ,  David K. Fork ,  Eugene M. Chow ,  Dirk De Bruyker ,  Michel A. Rosa

IPC分类号： B44C1/22 ,  B32B38/10 ,  C23C14/34

CPC分类号： G01N35/1074 ,  B01J2219/00387 ,  B01L3/0244 ,  B01L3/0255 ,  B01L3/502715 ,  B01L2300/0819 ,  B01L2400/025 ,  B01L2400/0406 ,  B41J2/14314 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/1643 ,  C40B60/14 ,  G01N35/1009 ,  G01N2035/00237 ,  G01N2035/1037 ,  G03F7/0002 ,  Y10T436/2575

摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.