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公开(公告)号:US08630505B2
公开(公告)日:2014-01-14
申请号:US12690518
申请日:2010-01-20
申请人: Taehoon Kim
发明人: Taehoon Kim
IPC分类号: G06K9/40
CPC分类号: H04N9/646
摘要: Image processing devices include a color extractor circuit configured to extract color information from input image data, a color shifter circuit configured to color shift the input image data according to the extracted color information and a definition enhancement circuit configured to detect a color difference from the color-shifted image data and to unsharp mask filter the color-shifted image data according to the detected color difference.
摘要翻译: 图像处理装置包括:颜色提取器电路,被配置为从输入图像数据中提取颜色信息;颜色移动器电路,被配置为根据提取的颜色信息对输入图像数据进行颜色移位;以及定义增强电路,被配置为检测与颜色的色差 移位的图像数据,并且根据所检测到的色差,对不同颜色的图像数据进行去锐化掩模过滤。
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公开(公告)号:USD696169S1
公开(公告)日:2013-12-24
申请号:US29423493
申请日:2012-06-01
申请人: Dinesh Mana , Taehoon Kim
设计人: Dinesh Mana , Taehoon Kim
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公开(公告)号:US08531135B2
公开(公告)日:2013-09-10
申请号:US13340209
申请日:2011-12-29
申请人: Heegu Park , Taehoon Kim , Junwan Bang
发明人: Heegu Park , Taehoon Kim , Junwan Bang
IPC分类号: H05B39/00
CPC分类号: H05B37/0272
摘要: A lighting system which automatically assigns a unique address to each lighting device and controls each lighting device assigned the unique address is disclosed. The lighting system may include a plurality of lighting apparatuses, at least one bridge coupled to the plurality of lighting apparatuses, and a lighting controller coupled to the at least one bridge for controlling the lighting apparatuses. One of the at least one bridge or the controller may generate address data for assigning an address to one of the plurality of lighting apparatuses. The plurality of lighting apparatuses may include an LED module, a connection circuit configured to control a connection between the at least one bridge and the plurality of lighting apparatuses, and a controller configured to control the connection circuit based on the address.
摘要翻译: 公开了一种自动为每个照明装置分配唯一地址并控制分配了唯一地址的每个照明装置的照明系统。 照明系统可以包括多个照明设备,耦合到多个照明设备的至少一个桥接器,以及耦合到至少一个桥接器用于控制照明设备的照明控制器。 至少一个桥接器或控制器中的一个可以产生用于将地址分配给多个照明设备中的一个的地址数据。 所述多个照明装置可以包括LED模块,被配置为控制所述至少一个桥与所述多个照明装置之间的连接的连接电路,以及被配置为基于所述地址来控制所述连接电路的控制器。
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公开(公告)号:US20130175813A1
公开(公告)日:2013-07-11
申请号:US13477367
申请日:2012-05-22
申请人: Dinesh Mana , Taehoon Kim
发明人: Dinesh Mana , Taehoon Kim
CPC分类号: B60R19/18 , B60R19/03 , B60R2019/1846
摘要: An energy absorbing assembly for impact energy absorption can comprise: an elongated plastic member having a major axis, a first side and a second side, comprising a central portion disposed between a first end portion and a second end portion, the second side defines a channel extending from the first end portion to the second end portion; and an elongated insert having a front, edges, tips, and a rear, wherein the insert is configured to flex upon impact, and is removably friction fit within the channel such that the plastic member surrounds the front, and greater than or equal to 50% of the edges and tips. The energy absorbing assembly can be configured to attach to a vehicle to absorb energy absorption impact. A vehicle can comprise: a vehicle rail and the energy absorbing assembly attached to the vehicle rail.
摘要翻译: 用于冲击能量吸收的能量吸收组件可以包括:具有长轴的细长塑料构件,第一侧和第二侧,包括设置在第一端部和第二端部之间的中心部分,第二侧限定通道 从所述第一端部延伸到所述第二端部; 以及具有前部,边缘,尖端和后部的细长插入件,其中所述插入件构造成在冲击时弯曲,并且可移除地摩擦配合在所述通道内,使得所述塑料构件围绕所述前部,并且大于或等于50 %的边缘和尖端。 能量吸收组件可以被配置成附接到车辆以吸收能量吸收冲击。 车辆可以包括:车辆轨道和附接到车辆轨道的能量吸收组件。
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公开(公告)号:US08441860B2
公开(公告)日:2013-05-14
申请号:US13366557
申请日:2012-02-06
申请人: Akira Goda , Taehoon Kim , Doyle Rivers , Roger Porter
发明人: Akira Goda , Taehoon Kim , Doyle Rivers , Roger Porter
IPC分类号: G11C16/04
CPC分类号: G11C16/10 , G11C5/145 , G11C11/5628 , G11C16/0483 , G11C16/3454 , G11C2211/5621
摘要: Methods and memories having switching points for changing Vstep increments according to a level of a multilevel cell being programmed include programming at a smaller Vstep increment in narrow threshold voltage situations and programming at a larger Vstep increment where faster programming is desired.
摘要翻译: 具有用于根据正在编程的多电平单元的电平改变Vstep增量的切换点的方法和存储器包括在窄阈值电压情况下以较小的Vstep增量进行编程,并且在需要更快编程的较大Vstep增量下进行编程。
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公开(公告)号:US20130020720A1
公开(公告)日:2013-01-24
申请号:US13546163
申请日:2012-07-11
申请人: Young Lyong Kim , Taehoon Kim , Jongho Lee , Chul-Yong Jang
发明人: Young Lyong Kim , Taehoon Kim , Jongho Lee , Chul-Yong Jang
IPC分类号: H01L25/07
CPC分类号: H01L21/76802 , H01L23/3121 , H01L23/3135 , H01L23/3185 , H01L24/24 , H01L24/82 , H01L25/0657 , H01L25/50 , H01L2224/24146 , H01L2224/24225 , H01L2224/24226 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/92144 , H01L2225/06524 , H01L2225/06562 , H01L2225/06568 , H01L2924/01012 , H01L2924/01029 , H01L2924/12042 , H01L2924/181 , H01L2924/00
摘要: A semiconductor package may include a substrate including a substrate connection terminal, at least one semiconductor chip stacked on the substrate and having a chip connection terminal, a first insulating layer covering at least portions of the substrate and the at least one semiconductor chip, and/or an interconnection penetrating the first insulating layer to connect the substrate connection terminal to the chip connection terminal. A semiconductor package may include stacked semiconductor chips, edge portions of the semiconductor chips constituting a stepped structure, and each of the semiconductor chips including a chip connection terminal; at least one insulating layer covering at least the edge portions of the semiconductor chips; and/or an interconnection penetrating the at least one insulating layer to connect to the chip connection terminal of each of the semiconductor chips.
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公开(公告)号:US08304876B2
公开(公告)日:2012-11-06
申请号:US12461456
申请日:2009-08-12
申请人: Hak-Kyoon Byun , Taehoon Kim , Jongkook Kim , Sang-Uk Han , Jung-Do Lee , Seonhyang You
发明人: Hak-Kyoon Byun , Taehoon Kim , Jongkook Kim , Sang-Uk Han , Jung-Do Lee , Seonhyang You
IPC分类号: H01L25/11
CPC分类号: H01L25/105 , H01L23/49816 , H01L23/5387 , H01L24/48 , H01L25/0657 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1064 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: Provided is a semiconductor package and a method for fabricating the semiconductor package. The semiconductor package may include a first package having a first semiconductor chip mounted on a first substrate and a second package having a second semiconductor chip mounted on a second substrate, the second substrate being bent to cover a side of the first package to contact the first substrate such that the first and second packages are connected electrically.
摘要翻译: 提供半导体封装和制造半导体封装的方法。 半导体封装可以包括具有安装在第一基板上的第一半导体芯片的第一封装和安装在第二基板上的第二半导体芯片的第二封装,所述第二基板弯曲以覆盖第一封装的一侧以接触第一封装 基板,使得第一和第二封装电连接。
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公开(公告)号:US20100284219A1
公开(公告)日:2010-11-11
申请号:US12436955
申请日:2009-05-07
申请人: Taehoon Kim , Deping He , Jeffrey Alan Kessenich
发明人: Taehoon Kim , Deping He , Jeffrey Alan Kessenich
CPC分类号: G11C11/5628 , G11C16/3454 , G11C16/3459 , G11C2211/5621
摘要: Methods for multiple level program verify, memory devices, and memory systems are disclosed. In one such method, a series of programming pulses are applied to a memory cell to be programmed. A program verify pulse, at an initial program verify voltage, is applied to the memory cell after each programming pulse. The initial program verify voltage is a verify voltage that has been increased by a quick charge loss voltage. The quick charge loss voltage is subtracted from the initial program verify voltage after either a programming pulse has reached a certain reference voltage or a quantity of programming pulses has reached a pulse count threshold.
摘要翻译: 公开了用于多级程序验证,存储器件和存储器系统的方法。 在一种这样的方法中,一系列编程脉冲被施加到待编程的存储器单元。 在每个编程脉冲之后,在初始程序验证电压下将程序验证脉冲施加到存储单元。 初始程序验证电压是通过快速充电损耗电压增加的验证电压。 在编程脉冲达到某个参考电压或编程脉冲数达到脉冲计数阈值之后,从初始编程验证电压中减去快速充电损耗电压。
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公开(公告)号:US20100038765A1
公开(公告)日:2010-02-18
申请号:US12461456
申请日:2009-08-12
申请人: Hak-Kyoon Byun , Taehoon Kim , Jongkook Kim , Sang-Uk Han , Jung-Do Lee , Seonhyang You
发明人: Hak-Kyoon Byun , Taehoon Kim , Jongkook Kim , Sang-Uk Han , Jung-Do Lee , Seonhyang You
IPC分类号: H01L25/11
CPC分类号: H01L25/105 , H01L23/49816 , H01L23/5387 , H01L24/48 , H01L25/0657 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1064 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: Provided is a semiconductor package and a method for fabricating the semiconductor package. The semiconductor package may include a first package having a first semiconductor chip mounted on a first substrate and a second package having a second semiconductor chip mounted on a second substrate, the second substrate being bent to cover a side of the first package to contact the first substrate such that the first and second packages are connected electrically.
摘要翻译: 提供半导体封装和制造半导体封装的方法。 半导体封装可以包括具有安装在第一基板上的第一半导体芯片的第一封装和安装在第二基板上的第二半导体芯片的第二封装,所述第二基板弯曲以覆盖第一封装的一侧以接触第一封装 基板,使得第一和第二封装电连接。
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公开(公告)号:US08637356B2
公开(公告)日:2014-01-28
申请号:US13534105
申请日:2012-06-27
申请人: Sivasubramanian Somu , Ahmed Busnaina , Nicol McGruer , Peter Ryan , George G. Adams , Xugang Xiong , Taehoon Kim
发明人: Sivasubramanian Somu , Ahmed Busnaina , Nicol McGruer , Peter Ryan , George G. Adams , Xugang Xiong , Taehoon Kim
CPC分类号: H01H11/04 , B82Y10/00 , B82Y40/00 , G11C11/50 , G11C13/025 , G11C2213/16 , H01L51/0048 , H01L51/0575 , H01L51/0591 , Y10S977/89 , Y10S977/943
摘要: A non-volatile bistable nano-electromechanical switch is provided for use in memory devices and microprocessors. The switch employs carbon nanotubes as the actuation element. A method has been developed for fabricating nanoswitches having one single-walled carbon nanotube as the actuator. The actuation of two different states can be achieved using the same low voltage for each state.
摘要翻译: 提供了用于存储器件和微处理器的非易失性双稳态纳米机电开关。 开关采用碳纳米管作为驱动元件。 已经开发了用于制造具有一个单壁碳纳米管作为致动器的纳米开关的方法。 对于每个状态,可以使用相同的低电压来实现两种不同状态的致动。
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