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公开(公告)号：US20200043773A1
公开(公告)日：2020-02-06
申请号：US16532843
申请日：2019-08-06
申请人： EBARA CORPORATION
发明人： Osamu Nabeya , Satoru Yamaki , Makoto Fukushima
IPC分类号： H01L21/683 , H01L21/67 , B24B37/30 , H01L21/02 , H01L21/304
摘要： A substrate holding apparatus is provided, which includes a top ring main body to which an elastic film having a surface that can suck a substrate can be attached, a first line communicating with a first area of the plurality of areas, a second line communicating with a second area different from the first area of the plurality of areas, a pressure adjuster that can pressurize the first area by feeding fluid into the first area through the first line and can generate negative pressure in the second area through the second line, and a determiner that performs determination of whether or not the substrate is sucked to the elastic film based on a volume of the fluid fed into the first area or a measurement value corresponding to pressure in the first area.
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公开(公告)号：US10442056B2
公开(公告)日：2019-10-15
申请号：US13929295
申请日：2013-06-27
申请人： EBARA CORPORATION
发明人： Keisuke Namiki , Hozumi Yasuda , Osamu Nabeya , Makoto Fukushima
摘要： A substrate holding apparatus is used for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing and planarizing the substrate. The substrate holding apparatus includes an elastic membrane, a top ring body for holding the elastic membrane, and a plurality of pressure chambers partitioned by at least one partition wall of the elastic membrane. The substrate is held by a lower surface of the elastic membrane and pressed against the polishing surface with a fluid pressure by supplying a pressurized fluid to the pressure chambers. The substrate holding apparatus further include a stopper configured to limit the inflation of the elastic membrane by being brought into contact with a part of the partition wall of the elastic membrane or an extending member extending from a rear surface of the elastic membrane whose surface serves as a substrate holding surface.
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公开(公告)号：US10213896B2
公开(公告)日：2019-02-26
申请号：US15402703
申请日：2017-01-10
申请人： EBARA CORPORATION
发明人： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki , Shintaro Isono
IPC分类号： B24B37/30
摘要： An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
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公开(公告)号：US09815171B2
公开(公告)日：2017-11-14
申请号：US14537809
申请日：2014-11-10
申请人： EBARA CORPORATION
发明人： Satoru Yamaki , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Makoto Fukushima , Shingo Togashi
CPC分类号： B24B37/32 , B24B37/04 , B24B37/107
摘要： A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad, and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.
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公开(公告)号：US09687957B2
公开(公告)日：2017-06-27
申请号：US14530589
申请日：2014-10-31
申请人： EBARA CORPORATION
发明人： Mitsuru Miyazaki , Seiji Katsuoka , Naoki Matsuda , Junji Kunisawa , Kenichi Kobayashi , Hiroshi Sotozaki , Hiroyuki Shinozaki , Osamu Nabeya , Shinya Morisawa , Takahiro Ogawa , Natsuki Makino
IPC分类号： B24B37/34 , H01L21/677 , H01L21/67 , H01L21/306
CPC分类号： B24B37/345 , H01L21/30625 , H01L21/67219 , H01L21/67739 , H01L21/67742 , H01L21/67754 , Y10T137/0318 , Y10T137/8593
摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.
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38.发明申请公开(公告)号：US20170106497A1
公开(公告)日：2017-04-20
申请号：US15292325
申请日：2016-10-13
申请人： Ebara Corporation
发明人： Shingo Togashi , Hozumi Yasuda , Makoto Fukushima , Osamu Nabeya
摘要： Provided is a substrate holding device used in a substrate polishing apparatus that polishes a substrate using a polishing pad. The substrate holding device includes: a retainer ring configured to hold a peripheral edge of the substrate; and a drive ring fixed to the retainer ring so as to rotate together with the retainer ring. The surface of the retainer ring at the polishing pad side has a convex portion at a position other than an innermost circumference following a shape of the drive ring.
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公开(公告)号：US20160368115A1
公开(公告)日：2016-12-22
申请号：US15163571
申请日：2016-05-24
申请人： EBARA CORPORATION
发明人： Hozumi YASUDA , Makoto FUKUSHIMA , Osamu Nabeya
摘要： A polishing apparatus which can allow easy replacement of a retainer ring and can allow the retainer ring to be secured to a drive ring without causing deformation of the retainer ring is disclosed. The polishing head includes a head body having a substrate contact surface, a drive ring coupled to the head body, and a retainer ring surrounding the substrate contact surface and coupled to the drive ring. A first screw thread is formed on the drive ring, a second screw thread, which engages with the first screw thread, is formed on the retainer ring. The second screw thread extends in a circumferential direction of the retainer ring.
摘要翻译： 公开了一种抛光装置，其可以容易地更换保持环，并且可以允许保持环固定到驱动环上而不引起保持环的变形。 抛光头包括具有基板接触表面的头本体，联接到头本体的驱动环和围绕基板接触表面并联接到驱动环的保持环。 第一螺纹形成在驱动环上，与保持环形成在第一螺纹上的第二螺纹。 第二螺纹在保持环的圆周方向上延伸。
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公开(公告)号：US08859070B2
公开(公告)日：2014-10-14
申请号：US13687263
申请日：2012-11-28
申请人： Ebara Corporation
发明人： Hozumi Yasuda , Katsuhide Watanabe , Keisuke Namiki , Osamu Nabeya , Makoto Fukushima , Satoru Yamaki , Shingo Togashi
CPC分类号： B32B3/08 , B24B37/30 , B32B3/18 , B32B27/12 , Y10T428/21 , Y10T428/24174 , Y10T428/24851
摘要： An elastic member for use in a substrate holding apparatus includes an elastic member and a first reinforcing member. The first reinforcing member has a higher rigidity than the elastic membrane and reinforces substantially an entire area of the contact portion of the elastic membrane. The contact portion of the elastic member has a contact portion for contact with the substrate. The first peripheral wall portion of the elastic membrane is coupled to a peripheral end of the contact portion and extends upwardly. The second peripheral wall portion of the elastic member defines a first chamber on an outer side thereof and a second chamber on an inner side thereof. The first reinforcing member is embedded in substantially the entire area of the contact portion of the elastic membrane.
摘要翻译： 用于基板保持装置的弹性构件包括弹性构件和第一加强构件。 第一加强构件具有比弹性膜更高的刚性，并且基本上加强弹性膜的接触部分的整个区域。 弹性构件的接触部分具有用于与衬底接触的接触部分。 弹性膜的第一周壁连接到接触部分的外周端并向上延伸。 弹性构件的第二周壁部分在其外侧上限定第一室，在其内侧限定第二室。 第一加强构件嵌入在弹性膜的接触部分的大致整个区域中。
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