FUNCTIONAL FILM MANUFACTURING METHOD AND FUNCTIONAL FILM
    32.
    发明申请
    FUNCTIONAL FILM MANUFACTURING METHOD AND FUNCTIONAL FILM 审中-公开
    功能膜制造方法和功能膜

    公开(公告)号:US20140170382A1

    公开(公告)日:2014-06-19

    申请号:US14185288

    申请日:2014-02-20

    Inventor: Eijiro IWASE

    Abstract: A functional film manufacturing method, in manufacturing a functional film having an organic layer on a support and an inorganic layer on the organic layer, comprises steps of preparing a coating material containing an organic compound which has a glass transition temperature of 100° C. or higher and is to be the organic layer, and an organic solvent; coating a support surface with 5 cc/m2 or more of the coating material such that the organic layer thickness becomes 0.05 to 3 μm; forming the organic layer by drying the coating material on the support surface such that the coating material has a viscosity of 20 cP or higher and a surface tension of 34 mN/m or less in a decreasing-rate-of-drying state, and curing the organic compound; and forming the inorganic layer on the organic layer surface by a vapor phase deposition method accompanied by generation of plasma.

    Abstract translation: 功能性膜制造方法在制造在有机层上具有有机层的有机层和有机层上的无机层的功能膜包括以下步骤:制备含有玻璃化转变温度为100℃的有机化合物的涂料,或 是有机层,有机溶剂; 用5cc / m 2以上的涂料涂布支撑面,使有机层的厚度为0.05〜3μm; 通过干燥载体表面上的涂料形成有机层,使得涂料在降低干燥状态下的粘度为20cP以上,表面张力为34mN / m以下,固化 有机化合物; 并通过伴随产生等离子体的气相沉积法在有机层表面上形成无机层。

    MANUFACTURING METHOD OF MOLDED BODY FOR SHEET-LIKE ELECTRODE

    公开(公告)号:US20250158015A1

    公开(公告)日:2025-05-15

    申请号:US19023361

    申请日:2025-01-16

    Abstract: Provided is a manufacturing method of a molded body for a sheet-like electrode, the manufacturing method including: applying a first material containing an electrode active material and an electrolytic solution onto a support to form a first film of the first material; and applying a second powder material containing an electrode active material and containing no liquid component onto the first film, in which an electrode material film having a monolayer structure, which is a mixture of the first film and the second powder material, is formed.

    METHOD OF MANUFACTURING FORMED BODY FOR ELECTRODE

    公开(公告)号:US20220131128A1

    公开(公告)日:2022-04-28

    申请号:US17647601

    申请日:2022-01-11

    Abstract: The present disclosure provides a method of manufacturing a formed body for an electrode including: a step of preparing an electrode material containing an electrode active material; a step of forming at least two projecting portions containing the electrode material and placed side by side on a support in a width direction of the support by supplying the electrode material onto the support; and a step of leveling the projecting portions on the support.

    FILM FORMING METHOD FOR ORGANIC SEMICONDUCTOR FILM

    公开(公告)号:US20210359212A1

    公开(公告)日:2021-11-18

    申请号:US17387111

    申请日:2021-07-28

    Inventor: Eijiro IWASE

    Abstract: An object of the present invention is to provide a film forming method for an organic semiconductor film, with which an organic semiconductor film having good uniformity and high mobility can be manufactured with good productivity. A coating liquid is prepared by dissolving an organic semiconductor material in a solvent, the coating liquid is sprayed by a spray unit, and the coating liquid is applied onto a temperature-controlled substrate while the coating liquid during the flight which has been sprayed by the spray unit is being heated, whereby problems are solved.

    ORGANIC THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING ORGANIC THIN FILM TRANSISTOR

    公开(公告)号:US20210175449A1

    公开(公告)日:2021-06-10

    申请号:US17182900

    申请日:2021-02-23

    Inventor: Eijiro IWASE

    Abstract: Provided are an organic thin film transistor having high bendability and high stability in air and a method of manufacturing the organic thin film transistor. The organic thin film transistor includes: a gas barrier layer consisting of a resin layer and an inorganic layer; a transistor element that is formed on one main surface side of the gas barrier layer and includes a gate electrode, an insulating film, an organic semiconductor layer, a source electrode, and a drain electrode; and a sealing layer that is laminated on a side of the transistor element opposite to the gas barrier layer through an adhesive layer, in which a thickness of the resin layer in the gas barrier layer is less than a thickness ranging from the inorganic layer to the sealing layer in the gas barrier layer.

    GAS BARRIER FILM AND METHOD FOR PRODUCING GAS BARRIER FILM

    公开(公告)号:US20200180285A1

    公开(公告)日:2020-06-11

    申请号:US16793450

    申请日:2020-02-18

    Inventor: Eijiro IWASE

    Abstract: A gas barrier film has, in sequence, a support, an inorganic layer, and a resin film, the inorganic layer and the resin film being supported on the support. The resin film has a hydroxy group. The inorganic layer and the resin film are directly joined to each other with separate portions that are partially present at an interface between the inorganic layer and the resin film. The gas barrier film has one or more sets of a combination of the inorganic layer and the resin film. A method for producing the gas barrier film includes forming an inorganic layer by a gas-phase deposition method, subsequently laminating a resin film having a hydroxy group with the inorganic layer, and heating the resulting film laminate.

    FUNCTIONAL FILM AMD METHOD FOR PRODUCING FUNCTIONAL FILM
    40.
    发明申请
    FUNCTIONAL FILM AMD METHOD FOR PRODUCING FUNCTIONAL FILM 审中-公开
    功能薄膜生产功能膜的AMD方法

    公开(公告)号:US20160207285A1

    公开(公告)日:2016-07-21

    申请号:US15084062

    申请日:2016-03-29

    Abstract: A functional film has an organic layer and an inorganic layer which are alternately formed on a support and a protective material which is stuck to a rear surface of the support through an adhesive layer and has thermal characteristics different from thermal characteristics of the support, in which an adhesive force between the adhesive layer and the support is 0.01 N/25 mm to 0.15 N/25 mm, and an adhesive force between the adhesive layer and the protective material is 5 N/25 mm to 50 N/25 mm. In a state where a long laminate composed of the support, the adhesive layer, and the protective material is being transported in a longitudinal direction, the organic layer and the inorganic layer are alternately formed on the surface of the support. As a result, a low-cost functional film, in which the inorganic layer or the like is not damaged and which stably demonstrates the intended performance, is obtained.

    Abstract translation: 功能膜具有交替形成在支撑体上的有机层和无机层,以及通过粘合剂层粘附到载体的后表面的保护材料,其具有与载体的热特性不同的热特性,其中 粘合剂层和载体之间的粘合力为0.01N / 25mm至0.15N / 25mm,粘合剂层和保护材料之间的粘合力为5N / 25mm至50N / 25mm。 在由支撑体,粘合剂层和保护材料构成的长层压体沿长度方向输送的状态下,有机层和无机层交替地形成在载体的表面上。 结果,获得了其中无机层等不被损坏并且稳定地表现出预期性能的低成本功能膜。

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