摘要:
The present invention relates generally to a new apparatus and method for simultaneously laminating a plurality of substrates having at least one cavity. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic). A membrane with or without an opening is placed on the top surface of the unlaminated green sheet having at least one cavity and then standard pressure is applied to laminate the green sheets, while simultaneously a counter pressure is applied in the cavity to prevent the cavity from deforming or collapsing. This is done to simultaneously form a plurality of cavity substrates.
摘要:
A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises dual screened composite metal pastes, one on top of the other and bonded to the sintered ceramic substrate to provide bonding of the surface metallization to the sintered ceramic substrate.
摘要:
A sealed composite ceramic structure is formed by first forming a plurality of composite green sheets. Each of the green sheets is a composite structure comprising a central portion of partially densifiable material and an outer portion of fully densifiable material. Next, top and bottom green sheets of fully densifiable material are formed. The greensheets are then stacked to form a laminated structure in the following order: the bottom green sheet, the plurality of composite green sheets, and the top green sheet. The substrate laminate is sintered to form the sealed structure having a porous central portion. The composite structure has particular application to ceramic substrates for mounting semiconductor devices requiring low dielectric constant substrates, but the structure also has applications in fluid processing using porous laminated structures. In both applications, the creation of a porous ceramic body with solid, sealed edges and/or external surfaces hold significant advantages.
摘要:
There is disclosed a sintering arrangement for enhancing the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.
摘要:
A laminated glass structure comprising a non-glass substrate and a glass sheet bonded to the non-glass substrate to form the laminated glass structure, wherein the laminated glass structure withstands a ball drop test wherein a 535 g stainless steel ball is dropped from a height of 0.8 m onto the laminated glass structure, with the glass sheet being impacted by the ball. The glass sheet has a thickness such that the glass sheet exhibits, without cracking, deformation to adapt to any shape change of the non-glass substrate as imparted by the ball of the ball drop test.
摘要:
A contoured glass sheet laminating system may include a glass-side vacuum bed, a laminate-side vacuum bed and a lamination actuator. The glass-side vacuum bed may include a vacuum backside and a mold-receiving side and may have sufficient permeability to permit a vacuum system to pull a vacuum across a thickness of the glass-side vacuum bed between the vacuum backside and the mold-receiving side of the glass-side vacuum bed. The laminate-side vacuum bed may include a vacuum backside and a thin-film loading side and may have sufficient permeability to permit a vacuum system to pull a vacuum across a thickness of the laminate-side vacuum bed between the vacuum backside and the thin-film loading side of the of the laminate-side vacuum bed.
摘要:
A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.
摘要:
An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
摘要:
An apparatus and a method are disclosed for providing point of care testing for osmolarity of a bodily fluid. An apparatus is disclosed as having a fluid pathway passing through it for receiving and testing a sample fluid. The invention permits osmolarity testing of a sample fluid wherein the sample fluid has a volume of less than approximately 30 nL, and implements a method and device to measure fluid osmolarity in a clinical setting quickly and accurately, while also reducing evaporation of the fluid.
摘要:
Methods of forming, and the intermediate substrate products formed, are disclosed whereby a via is formed in the substrate, followed by a second via. The second via is formed such that it overlap the first via, and may remove a first portion of any via distortion residing within the first via. A third via is then formed in the substrate to at least overlap the first via. The third via may remove a second portion of any via distortion within the first via. The second and third vias are formed on opposite sides of the first via, such that the first, second and third vias together form a symmetrically extended via within the substrate. Optionally, a rigid support film may be provided under the substrate prior to forming the extended via.