WALL STRUCTURE OF LARGE-SIZED REFRIGERATED STORAGE AND CONSTRUCTION METHOD THEREOF
    31.
    发明申请
    WALL STRUCTURE OF LARGE-SIZED REFRIGERATED STORAGE AND CONSTRUCTION METHOD THEREOF 有权
    大型制冷储存的壁结构及其结构方法

    公开(公告)号:US20120031912A1

    公开(公告)日:2012-02-09

    申请号:US13262242

    申请日:2010-03-30

    申请人: Hong Wang

    发明人: Hong Wang

    IPC分类号: B65D81/38 B23P25/00

    摘要: A wall structure of a large-sized refrigerated storage and a construction method thereof are provided. The wall structure comprises an interior wall board (1), an exterior wall board (2) and a skeleton positioned between the interior wall board (1) and the exterior wall board (2). A polyurethane foam plastic (7) is filled between the interior wall board (1) and he exterior wall board (2). The method for construction a wall of a large-sized refrigerated storage comprises the following steps: A. building the wall skeleton; B. mounting a color steel plate on the outer surface of the skeleton to form an exterior wall board (2) of the wall; C. painting the polyurethane spraying material on the exterior wall board (2) layer by layer for multiple times, and reserving a pouring apace at a distance of 40 to 80 mm from the installation position of a interior wall board (1); and D. taking the color steel plate of the interior wall as a mould plate and pouring space at the color steel plate of the interior wall to form the interior wall board (1) of the wall. The wall structure is simple and the structural strength of light steel is high.

    摘要翻译: 提供了一种大型冷藏库的壁结构及其构造方法。 壁结构包括内壁板(1),外壁板(2)和位于内壁板(1)和外壁板(2)之间的骨架。 聚氨酯泡沫塑料(7)填充在内墙板(1)和外墙板(2)之间。 大型冷藏库墙体的建造方法,包括以下步骤:A.建筑墙体; B.将彩色钢板安装在骨架的外表面上以形成壁的外壁板(2); C.将聚氨酯喷涂材料逐层涂在外墙板(2)上多次,并与内壁板(1)的安装位置相距40至80mm的距离储存一个倾倒空间。 并且将内壁的彩色钢板作为模板并在内壁的彩色钢板上倾倒空间以形成壁的内壁板(1)。 壁结构简单,轻钢结构强度高。

    Detecting chemical and biological impurities by nano-structure based spectral sensing
    33.
    发明授权
    Detecting chemical and biological impurities by nano-structure based spectral sensing 有权
    通过纳米结构的光谱感测检测化学和生物杂质

    公开(公告)号:US08081308B2

    公开(公告)日:2011-12-20

    申请号:US12643689

    申请日:2009-12-21

    申请人: Hong Wang Xun Guo

    发明人: Hong Wang Xun Guo

    IPC分类号: G01J3/30

    摘要: A method is disclosed for providing quality assurance in an industrial process. The method includes obtaining a manufacturing material from the industrial process, allowing the manufacturing material to contact with a nano-scale surface, which allows the harmful substance to adsorb to the nano-scale surface. The method also includes obtaining a Raman spectrum from the manufacturing material and the nano-scale surface using a spectrometer, searching for, using a spectral analyzer, a spectral signature of a harmful substance in a predetermined spectral region in the Raman spectrum to determine the existence of the harmful substance in the manufacturing material, determining the concentration of the manufacturing material if the spectral signature is found in the Raman spectrum, and rejecting the manufacturing material from the industrial process if the concentration of the manufacturing material is determined to be above a predetermined tolerance level.

    摘要翻译: 公开了一种在工业过程中提供质量保证的方法。 该方法包括从工业过程获得制造材料,允许制造材料与允许有害物质吸附到纳米级表面的纳米级表面接触。 该方法还包括使用光谱仪从制造材料和纳米级表面获得拉曼光谱,使用光谱分析仪搜索在拉曼光谱中的预定光谱区域中的有害物质的光谱特征,以确定存在 的制造材料中的有害物质,如果在拉曼光谱中发现光谱特征,则确定制造材料的浓度,并且如果将制造材料的浓度确定为高于预定值,则拒绝来自工业过程的制造材料 公差水平

    Method And Apparatus For Virtualized Microcode Sequencing
    35.
    发明申请
    Method And Apparatus For Virtualized Microcode Sequencing 审中-公开
    用于虚拟化微代码排序的方法和装置

    公开(公告)号:US20110296096A1

    公开(公告)日:2011-12-01

    申请号:US12912169

    申请日:2010-10-26

    IPC分类号: G06F12/06 G06F12/08

    摘要: In one embodiment, the present invention includes a processor having multiple cores and an uncore. The uncore may include a microcode read only memory to store microcode to be executed in the cores (that themselves do not include such memory). The cores can include a microcode sequencer to sequence a plurality of micro-instructions (uops) of microcode that corresponds to a macro-instruction to be executed in an execution unit of the corresponding core. Other embodiments are described and claimed.

    摘要翻译: 在一个实施例中,本发明包括具有多个核心和非核心的处理器。 无孔可以包括微代码只读存储器,以存储要在核心中执行的微代码(其本身不包括这样的存储器)。 核心可以包括微代码定序器,以对应于在相应核心的执行单元中执行的宏指令的微代码的多个微指令(uop)。 描述和要求保护其他实施例。

    METHOD AND APPARATUS TO EFFICIENTLY GENERATE A PROCESSOR ARCHITECTURE MODEL
    38.
    发明申请
    METHOD AND APPARATUS TO EFFICIENTLY GENERATE A PROCESSOR ARCHITECTURE MODEL 审中-公开
    方法和设备有效地生成处理器架构模型

    公开(公告)号:US20110153529A1

    公开(公告)日:2011-06-23

    申请号:US12646541

    申请日:2009-12-23

    IPC分类号: G06F15/18 G06N5/02

    CPC分类号: G06F17/5022

    摘要: A method and apparatus for efficiently generating a processor architecture model that accurately predicts performance of the processor for minimizing simulation time are described. In one embodiment, the method comprises: identifying a performance benchmark of a processor; sampling a portion of a design space for the identified performance benchmark; simulating the sampled portion of the design space to generate training data; generating a processor performance model from the training data by modifying the training data to predict an entire design space; and predicting performance of the processor for the entire design space by executing the processor performance model.

    摘要翻译: 描述了一种用于有效地生成准确地预测处理器的性能以最小化模拟时间的处理器架构模型的方法和装置。 在一个实施例中,该方法包括:识别处理器的性能基准; 对所识别的性能基准的一部分设计空间进行采样; 模拟设计空间的采样部分以产生训练数据; 通过修改训练数据来预测整个设计空间,从训练数据生成处理器性能模型; 并通过执行处理器性能模型来预测处理器对于整个设计空间的性能。

    Edge removal of silicon-on-insulator transfer wafer
    39.
    发明授权
    Edge removal of silicon-on-insulator transfer wafer 有权
    边缘去除绝缘体上硅转移晶片

    公开(公告)号:US07951718B2

    公开(公告)日:2011-05-31

    申请号:US12033727

    申请日:2008-02-19

    IPC分类号: H01L21/302

    摘要: A silicon-on-insulator transfer wafer having a front surface with a circumferential lip around a circular recess is polished. In one version, the circular recess on the front surface of the wafer is masked by filling the recess with spin-on-glass. The front surface of the wafer is exposed to an etchant to preferentially etch away the circumferential lip, while the circular recess is masked by the spin-on-glass. The spin-on glass is removed, and the front surface of the transfer wafer is polished. Other methods of removing the circumferential lip include applying a higher pressure to the circumferential lip in a polishing process, and directing a pressurized fluid jet at the base of the circumferential lip.

    摘要翻译: 抛光具有围绕圆形凹槽的具有周向唇缘的前表面的绝缘体上硅转移晶片。 在一个版本中,通过用旋转玻璃填充凹槽来掩蔽晶片前表面上的圆形凹槽。 将晶片的前表面暴露于蚀刻剂以优先蚀刻掉周缘,同时圆形凹槽被旋涂玻璃掩蔽。 去除旋涂玻璃,并且转印晶片的前表面被抛光。 去除圆周唇缘的其它方法包括在抛光过程中向周缘施加更高的压力,并且在周向唇缘的底部引导加压流体射流。