公开(公告)号：US20090185888A1

公开(公告)日：2009-07-23

申请号：US12010259

申请日：2008-01-23

Applicant: Hong-Chin Lin ,  Venkata Rama Varma Dantuluri

Inventor： Hong-Chin Lin ,  Venkata Rama Varma Dantuluri

IPC: E02F9/22 ,  G06G7/66

CPC classification number: E02F9/2203 ,  E02F9/226

Abstract: A hydraulic implement system for a machine is disclosed. The hydraulic implement system may have a boom member, a boom actuator, and a boom operator control device movable to indicate a related operator desired boom member velocity. The hydraulic implement system may also have an implement pivotally connected to the boom member, an implement actuator, and an implement operator control device movable to indicated a related operator desired implement velocity. The range of the implement operator control device may be divided into a first portion and a second portion. The hydraulic implement system may also have a controller configured to selectively limit a velocity of the implement during manipulation of the implement operator control device within the first portion such that a lift velocity of the boom member of at least 65% of the desired boom member velocity is always possible.

Abstract translation: 公开了一种用于机器的液压工具系统。 液压工具系统可以具有悬臂构件，悬臂致动器和动臂操作器控制装置，可移动以指示相关操作者所需的动臂构件速度。 液压工具系统还可以具有枢转地连接到悬臂构件的工具，工具致动器和可移动以指示相关操作者期望的实施速度的工具操作器控制装置。 工具操作员控制装置的范围可以分为第一部分和第二部分。 液压工具系统还可以具有控制器，该控制器被配置为在第一部分内的操纵操纵器控制装置的操纵期间选择性地限制工具的速度，使得悬臂构件的提升速度为所需悬臂构件速度的至少65％ 总是可能的

公开(公告)号：US20090142201A1

公开(公告)日：2009-06-04

申请号：US11987526

申请日：2007-11-30

Applicant: Hong-Chin Lin ,  James Eugene Schimpf ,  James Thomas Ferrier

Inventor： Hong-Chin Lin ,  James Eugene Schimpf ,  James Thomas Ferrier

IPC: F04B49/00 ,  B66F9/00 ,  F01C20/24

CPC classification number: E02F9/2203 ,  E02F9/2228 ,  E02F9/2296 ,  F15B11/024 ,  F15B2211/3122 ,  F15B2211/3144 ,  F15B2211/61 ,  F15B2211/6346 ,  F15B2211/7053 ,  F15B2211/761 ,  F15B2211/88

Abstract: Apparatus and methods are provided for controlling a double-acting hydraulic cylinder during a load-induced rod-extending operation, where the cylinder is activated by fluid supplied from a reservoir by a pump, and the cylinder has a rod end, a head end, a piston connected to a rod for engaging the load, the cylinder piston being urged toward the rod end by the load during the operation. The apparatus includes a cylinder activating circuit including an activation valve for providing a flow path from the pump to the cylinder head end; a flow regeneration circuit fluidly connecting the cylinder rod end and the cylinder head end and configured for providing flow from the cylinder rod end to the cylinder head end during rod extension, the regeneration circuit including a regeneration flow valve; and a controller operatively connected to the regeneration flow valve and the activation valve, the controller being responsive to rod-extending rate demands from an operator to control the activation valve to provide flow from the pump to the head end and to control the regeneration valve to provide flow from the rod end to the head end. The cylinder activating circuit also includes a return flow path and a return valve positioned in the return flow path and configured to control flow from the cylinder rod end to the fluid reservoir. Both the activation valve and the return valve are controllable by the controller independently from the regeneration flow valve.

Abstract translation: 提供了一种装置和方法，用于在负载诱导的杆延伸操作期间控制双作用液压缸，其中气缸由通过泵从储存器供应的流体启动，并且气缸具有杆端，头端， 连接到用于接合负载的杆的活塞，在操作期间，气缸活塞被负载朝着杆端推压。 该装置包括气缸启动电路，其包括用于提供从泵到气缸头端部的流动路径的启动阀; 流动再生回路，其将所述气缸杆端部和所述气缸盖端部流体连接并且构造成在杆延伸期间提供从所述气缸杆端向所述气缸盖端部的流动，所述再生回路包括再生流量阀; 以及控制器，其可操作地连接到所述再生流量阀和所述致动阀，所述控制器响应于来自操作者的杆伸出率需求以控制所述致动阀以提供从所述泵到所述头端的流量，并且将所述再生阀控制到 提供从杆端到头端的流动。 气缸启动电路还包括返回流动路径和位于返回流动路径中并且被配置为控制从气缸杆端到流体储存器的流动的回流阀。 启动阀和回流阀均可由控制器独立于再生流量阀控制。

公开(公告)号：US20080290486A1

公开(公告)日：2008-11-27

申请号：US12177879

申请日：2008-07-22

Applicant: Nan-Jang Chen ,  Hong-Chin Lin

Inventor： Nan-Jang Chen ,  Hong-Chin Lin

IPC: H01L23/495

CPC classification number: H01L23/49531 ,  H01L21/4828 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/14 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.

Abstract translation: 引线框封装包括具有四个一体的向外延伸的细长条的管芯焊盘; 沿所述管芯焊盘的周边布置的多个引线; 与所述管芯焊盘分离并与所述多个引线隔离的单独焊盘段; 安装在所述管芯焊盘的上侧的半导体管芯，其中，所述半导体管芯包含与所述多个引线引线接合的第一接合焊盘和与所述独立焊盘区段焊接的第二接合焊盘; 以及封装半导体管芯的模塑料，管芯焊盘的上侧，第一悬挂焊盘段和多个引线的内部。

公开(公告)号：US06718244B2

公开(公告)日：2004-04-06

申请号：US10034421

申请日：2001-12-28

Applicant: Hong-Chin Lin ,  Peter J. Dix ,  Anthony J. Lamela ,  Brian E. Felsing ,  Troy D. Bateman ,  Daniel B. Shore

Inventor： Hong-Chin Lin ,  Peter J. Dix ,  Anthony J. Lamela ,  Brian E. Felsing ,  Troy D. Bateman ,  Daniel B. Shore

IPC: G06F1700

CPC classification number: B60G17/005 ,  B60G2200/132 ,  B60G2202/134 ,  B60G2204/46 ,  B60G2204/4605 ,  B60G2300/09 ,  B60G2400/106 ,  B60G2400/208 ,  B60G2600/02

Abstract: A skid steer vehicle has sprung suspensions, variable displacement pumps and motors connected to those pumps that drive the wheels on the vehicle as well as an electronic controller that receives signals that indicate fore-and-aft acceleration of the skid steer vehicle. Based on these signals, the controller determines whether the forward acceleration exceeds a predetermined value and locks up the rear suspensions if that value is exceeded. It also determines whether the forward deceleration exceeds a predetermined value and locks up the front suspensions if that value is exceeded. The signals can be provided by an accelerometer, a satellite receiver, wheel/motor speed sensors, sensors in the pumps that signal the specific displacement of the pumps such as their swash plate positions, or memory locations that contain previously calculated specific displacement commands that are used to drive the pumps to a particular specific displacement.

Abstract translation: 滑行转向车辆具有悬挂，可变排量泵和连接到驱动车辆上的车轮的泵的马达以及接收指示滑行转向车前后加速度的信号的电子控制器。 基于这些信号，控制器确定正向加速度是否超过预定值，并且如果超过该值则锁定后悬架。 它还确定正向减速度是否超过预定值，如果超过该值，则锁定前悬架。 这些信号可以由加速度计，卫星接收器，轮/马达速度传感器，泵中的传感器提供，该传感器指示泵的特定位移，例如其斜盘位置，或包含先前计算的特定位移命令的存储器位置 用于将泵驱动到特定的位移。

公开(公告)号：US08409054B2

公开(公告)日：2013-04-02

申请号：US13192628

申请日：2011-07-28

Applicant: Hong-Chin Lin

Inventor： Hong-Chin Lin

IPC: B60W10/02

CPC classification number: F16D48/06 ,  B60W10/023 ,  B60W10/06 ,  B60Y2200/415 ,  F16D2500/10412 ,  F16D2500/1045 ,  F16D2500/1112 ,  F16D2500/3108 ,  F16D2500/31413 ,  F16D2500/31466 ,  F16D2500/51 ,  F16D2500/5126 ,  F16D2500/70494 ,  F16D2500/7105 ,  F16H61/143 ,  F16H61/21 ,  F16H2061/0237 ,  F16H2061/147 ,  F16H2061/216 ,  Y10T477/6403 ,  Y10T477/6414 ,  Y10T477/6422 ,  Y10T477/753 ,  Y10T477/87

Abstract: An overspeed system for a vehicle is disclosed. The overspeed system may have a power source, a transmission unit, and a torque converter assembly operatively coupling the power source to the transmission unit. The overspeed system may also have a travel speed sensor configured to generate a signal indicative of a vehicle speed, and a controller in communication with the torque converter assembly and the travel speed sensor. The controller may be configured to prevent a decoupling of the torque converter assembly in response to the signal.

Abstract translation: 公开了一种用于车辆的超速系统。 超速系统可以具有电源，传输单元和将电源可操作地耦合到传动单元的变矩器组件。 超速系统还可以具有配置成产生指示车辆速度的信号的行驶速度传感器，以及与变矩器组件和行驶速度传感器通信的控制器。 控制器可以被配置为防止响应于信号的变矩器组件的去耦。

公开(公告)号：US20120104588A1

公开(公告)日：2012-05-03

申请号：US13346641

申请日：2012-01-09

Applicant: Nan-Jang Chen ,  Hong-Chin Lin

Inventor： Nan-Jang Chen ,  Hong-Chin Lin

IPC: H01L23/495

CPC classification number: H01L23/49531 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/66 ,  H01L24/14 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4847 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.

Abstract translation: 引线框封装包括具有四个一体的向外延伸的细长条的管芯焊盘; 沿所述管芯焊盘的周边布置的多个引线; 与所述管芯焊盘分离并与所述多个引线隔离的单独焊盘段; 安装在所述管芯焊盘的上侧的半导体管芯，其中，所述半导体管芯包含与所述多个引线引线接合的第一接合焊盘和与所述独立焊盘区段焊接的第二接合焊盘; 以及封装半导体管芯的模塑料，管芯焊盘的上侧，第一悬挂焊盘段和多个引线的内部。

公开(公告)号：US08012061B2

公开(公告)日：2011-09-06

申请号：US11730384

申请日：2007-03-30

Applicant: Hong-Chin Lin

Inventor： Hong-Chin Lin

IPC: B60W10/02

CPC classification number: F16D48/06 ,  B60W10/023 ,  B60W10/06 ,  B60Y2200/415 ,  F16D2500/10412 ,  F16D2500/1045 ,  F16D2500/1112 ,  F16D2500/3108 ,  F16D2500/31413 ,  F16D2500/31466 ,  F16D2500/51 ,  F16D2500/5126 ,  F16D2500/70494 ,  F16D2500/7105 ,  F16H61/143 ,  F16H61/21 ,  F16H2061/0237 ,  F16H2061/147 ,  F16H2061/216 ,  Y10T477/6403 ,  Y10T477/6414 ,  Y10T477/6422 ,  Y10T477/753 ,  Y10T477/87

Abstract: An overspeed system for a vehicle is disclosed. The overspeed system may have a power source, a transmission unit, and a torque converter assembly operatively coupling the power source to the transmission unit. The overspeed system may also have a travel speed sensor configured to generate a signal indicative of a vehicle speed, and a controller in communication with the torque converter assembly and the travel speed sensor. The controller may be configured to prevent a decoupling of the torque converter assembly in response to the signal.

Abstract translation: 公开了一种用于车辆的超速系统。 超速系统可以具有电源，传输单元和将电源可操作地耦合到传动单元的变矩器组件。 超速系统还可以具有配置成产生指示车辆速度的信号的行驶速度传感器，以及与变矩器组件和行驶速度传感器通信的控制器。 控制器可以被配置为防止响应于信号的变矩器组件的去耦。

公开(公告)号：US07875965B2

公开(公告)日：2011-01-25

申请号：US12050210

申请日：2008-03-18

Applicant: Nan-Jang Chen ,  Hong-Chin Lin

Inventor： Nan-Jang Chen ,  Hong-Chin Lin

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor chip package is disclosed. The semiconductor chip package comprises a lead frame having a chip carrier, wherein the chip carrier has a first surface and an opposite second surface. A semiconductor chip is mounted on the first surface, having a plurality of bonding pads thereon, wherein the semiconductor chip has an area larger than that of the chip carrier. A package substrate comprises a central region attached to the second surface, having an area larger than that of the semiconductor chip, wherein some of the bonding pads of the semiconductor chip are electrically connected to a marginal region of the package substrate.

Abstract translation: 公开了半导体芯片封装。 半导体芯片封装包括具有芯片载体的引线框架，其中芯片载体具有第一表面和相对的第二表面。 半导体芯片安装在第一表面上，其上具有多个焊盘，其中半导体芯片的面积大于芯片载体的面积。 封装衬底包括附接到第二表面的中心区域，具有大于半导体芯片的面积的区域，其中半导体芯片的一些焊盘电连接到封装衬底的边缘区域。

公开(公告)号：US20090251876A1

公开(公告)日：2009-10-08

申请号：US12098474

申请日：2008-04-07

Applicant: Nan-Jang Chen ,  Hong-Chin Lin

Inventor： Nan-Jang Chen ,  Hong-Chin Lin

IPC: H05K7/00

CPC classification number: H05K1/0216 ,  H01L2924/0002 ,  H05K3/222 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't directly pass over any split of the ground plane.

公开(公告)号：US20090229261A1

公开(公告)日：2009-09-17

申请号：US12049969

申请日：2008-03-17

Applicant: Hong-Chin Lin ,  Salem Haggag

Inventor： Hong-Chin Lin ,  Salem Haggag

IPC: F15B11/00 ,  F15B11/08 ,  F15B21/08

CPC classification number: F15B21/082 ,  F15B2211/20546 ,  F15B2211/252 ,  F15B2211/3116 ,  F15B2211/31529 ,  F15B2211/327 ,  F15B2211/6309 ,  F15B2211/633 ,  F15B2211/6346

Abstract: A dual mode control system for a hydraulic circuit (200) having a variable displacement pump (216) includes at least two actuators, each controlled by a respective valve. The valves are connected in series with a pressure sensor (250) measuring a pressure of fluid between the first valve (224) and the second valve (234) and relaying a signal to the electronic controller (202). The electronic controller (202) operates in a first mode, varying the displacement of the pump (216) based on a command signal operating at least one of the valves, and operates in a standby mode, varying the displacement of the pump (216) based on the signal from the sensor, when both valves are in their respective neutral positions.

Abstract translation: 一种用于具有可变排量泵（216）的液压回路（200）的双模式控制系统，包括至少两个致动器，每个致动器由相应的阀控制。 这些阀与测量第一阀（224）和第二阀（234）之间的流体压力的压力传感器（250）串联连接并将信号中继到电子控制器（202）。 电子控制器（202）以第一模式操作，基于操作至少一个阀的命令信号改变泵216的位移，并且在备用模式下操作，改变泵216的位移， 基于来自传感器的信号，当两个阀处于它们各自的中立位置时。