公开(公告)号：US20180183522A1

公开(公告)日：2018-06-28

申请号：US15388564

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Emanuel Cohen ,  Sasha N. Oster ,  Telesphor Kamgaing

IPC: H04B10/2525 ,  H04B10/2575 ,  H04L25/03 ,  H04J14/00

CPC classification number: H04L25/03834 ,  H04B10/90 ,  H04L25/03343

Abstract: Embodiments of the present disclosure may relate to a transmitter that includes a baseband dispersion compensator to perform baseband dispersion compensation on an input signal. Embodiments may also include a receiver that includes a radio frequency (RF) dispersion compensator to perform RF dispersion compensation. Embodiments may also include a dielectric waveguide coupled with the transmitter and the receiver, the dielectric waveguide to convey the RF signal from the transmitter to the receiver. Other embodiments may be described and/or claimed.

公开(公告)号：US09960849B1

公开(公告)日：2018-05-01

申请号：US15388383

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Emanuel Cohen

IPC: H04B10/00 ,  H04B10/2575 ,  H04J14/00

CPC classification number: H04B10/2575

Abstract: Embodiments of the present disclosure may relate to a transmitter to transmit a radio frequency (RF) signal to a receiver via a dielectric waveguide where the transmitter includes a plurality of mixers to generate modulated RF signals and a combiner to combine the modulated RF signals. Embodiments may also include a receiver to receive, from a dielectric waveguide, a RF signal where the receiver includes a splitter to split the RF signal into a plurality of signal paths, a plurality of filters, and a plurality of demodulators. Embodiments may also include a dielectric waveguide communication apparatus that may include the transmitter and the receiver. Other embodiments may be described and/or claimed.

公开(公告)号：US09791470B2

公开(公告)日：2017-10-17

申请号：US14141759

申请日：2013-12-27

Applicant: Intel Corporation

Inventor： Feras Eid ,  Sasha N. Oster ,  Kyu Oh Lee ,  Sarah Haney

IPC: H01L27/22 ,  G01P1/04 ,  G01P15/097 ,  B81C1/00 ,  B81B3/00 ,  B81B7/00

CPC classification number: G01P1/04 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792 ,  G01P15/097 ,  H01L27/22 ,  Y10T29/49075

Abstract: Magnet placement is described for integrated circuit packages. In one example, a terminal is applied to a magnet. The magnet is then placed on a top layer of a substrate with solder between the terminal and the top layer, and the solder is reflowed to attach the magnet to the substrate.

公开(公告)号：US12183961B2

公开(公告)日：2024-12-31

申请号：US17403571

申请日：2021-08-16

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P3/12 ,  H01P11/00 ,  H01Q9/04 ,  H04L67/10

Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.

公开(公告)号：US11887946B2

公开(公告)日：2024-01-30

申请号：US17958300

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Sasha N. Oster

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30

CPC classification number: H01L23/66 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01Q1/36 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30

Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

公开(公告)号：US11525970B2

公开(公告)日：2022-12-13

申请号：US17083173

申请日：2020-10-28

Applicant: Intel Corporation

Inventor： Shawna Liff ,  Adel A. Elsherbini ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Gaurav Chawla

IPC: G06F13/14 ,  G02B6/42 ,  H01P5/00 ,  H01Q13/10 ,  H04B1/40 ,  H04B7/00 ,  H04M9/06 ,  G06F13/00

Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

公开(公告)号：US11437693B2

公开(公告)日：2022-09-06

申请号：US16764600

申请日：2017-12-30

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Kenneth Shoemaker ,  Erich N. Ewy ,  Adel A. Elsherbini ,  Johanna M. Swan

IPC: H01P3/16 ,  H04B3/54

Abstract: Embodiments include a waveguide bundle, a dielectric waveguide, and a vehicle. The waveguide bundle includes dielectric waveguides, where each dielectric waveguide has a dielectric core and a conductive coating around the dielectric core. The waveguide bundle also has a power delivery layer formed around the dielectric waveguides, and an insulating jacket enclosing the waveguide bundle. The waveguide bundle may also include the power deliver layer as a braided shield, where the braided shield provides at least one of a DC and an AC power line. The waveguide bundle may further have one of the dielectric waveguides provide a DC ground over their conductive coatings, where the AC power line does not use the braided shield as reference or ground. The waveguide bundle may include that the power delivery layer is separated from the dielectric waveguides by a braided shield, where the power delivery layer is a power delivery braided foil.

公开(公告)号：US11223524B2

公开(公告)日：2022-01-11

申请号：US16152280

申请日：2018-10-04

Applicant: Intel Corporation

Inventor： Shawna M. Liff ,  Adel A. Elsherbini ,  Sasha N. Oster ,  Feras Eid ,  Georgios C. Dogiamis ,  Thomas L. Sounart ,  Johanna M. Swan

IPC: H01L41/04 ,  H04L12/24 ,  H01H57/00 ,  H01L41/047 ,  H01L41/187 ,  A61B5/0205 ,  A61B5/00 ,  H01L41/09 ,  A61B5/024 ,  A61B5/021 ,  A61B5/08 ,  A61B5/145 ,  H01H37/00

Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

公开(公告)号：US11056765B2

公开(公告)日：2021-07-06

申请号：US16345173

申请日：2016-12-20

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01L25/065 ,  H01Q1/38 ,  H01L23/13 ,  H01Q9/04 ,  H01Q13/10 ,  H01L23/00 ,  H01L23/498 ,  H01Q21/06

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) circuits and a second substrate coupled to the first substrate. The second substrate includes a first section and a second section with the second substrate being foldable in order to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US11024933B2

公开(公告)日：2021-06-01

申请号：US16325351

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P3/12 ,  H01P3/123 ,  H01P3/14 ,  H01P11/00

Abstract: A method of making a waveguide, comprises: extruding a first dielectric material as a waveguide core of the waveguide, wherein the waveguide core is elongate; and coextruding an outer layer with the waveguide core, wherein the outer layer is arranged around the waveguide core.