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公开(公告)号：US10378924B2
公开(公告)日：2019-08-13
申请号：US16136589
申请日：2018-09-20
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , Silvio Dragone , Roger S. Krabbenhoft , David C. Long , Stefano S. Oggioni , Michael T. Peets , William Santiago-Fernandez
Abstract: Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.
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公开(公告)号：US10251288B2
公开(公告)日：2019-04-02
申请号：US15836966
申请日：2017-12-11
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Michael J. Fisher , David C. Long , Michael T. Peets , Robert Weiss , Thomas Weiss , James E. Tersigni
Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.
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公开(公告)号：US10237964B2
公开(公告)日：2019-03-19
申请号：US14846897
申请日：2015-09-07
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Phillip D. Isaacs , Michael T. Peets , Xiaojin Wei
IPC: H05K1/02 , H05K3/30 , H05K7/14 , H01L23/36 , H01L23/42 , H01L23/00 , H05K5/03 , H05K5/06 , H05K13/00 , H05K5/02 , H05K7/20 , H01L23/367 , H01L23/373 , H01L23/433
Abstract: Manufacturing electronic packages is provided with enhanced heat dissipation capabilities. The method includes providing a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. The method includes providing at least one heat transfer element coupled to, or integrated with, the thermally conductive cover between a main surface of the cover and at least one respective electronic component. Further, the method includes providing a thermal interface material disposed between the heat transfer element(s) and the respective electronic component(s), which facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.
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公开(公告)号：US20180098423A1
公开(公告)日：2018-04-05
申请号：US15827275
申请日：2017-11-30
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , James A. Busby , Edward N. Cohen , Silvio Dragone , Michael J. Fisher , David C. Long , Michael T. Peets , William Santiago-Fernandez , Thomas Weiss
CPC classification number: H05K1/0275 , G08B13/128 , H05K1/0216 , H05K1/112 , H05K1/181 , H05K3/22 , H05K5/0208 , H05K2201/10151 , H05K2201/10265 , H05K2201/10371
Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
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公开(公告)号：US09717154B2
公开(公告)日：2017-07-25
申请号：US15409851
申请日：2017-01-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , John R. Dangler , Zachary T. Dreiss , David C. Long , Michael T. Peets , William Santiago-Fernandez , Thomas Weiss
CPC classification number: H05K5/0247 , G06F1/00 , H05K5/0208 , H05K13/00
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner main surface, and an inner sidewall surface which has at least one inner-sidewall corner. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner sidewall surface of the electronic enclosure. The tamper-respondent sensor includes a flexible layer(s) with tamper-detect circuit lines and multiple slots provided therein. The multiple slots facilitate disposing the tamper-respondent sensor to cover the at least one inner-sidewall corner of the inner sidewall surface by allowing for one or more regions of overlap of the flexible layer(s) of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.
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Patent Agency Ranking
公开(公告)号：US09560737B2
公开(公告)日：2017-01-31
申请号：US14637501
申请日：2015-03-04
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Phillip D. Isaacs , Michael T. Peets , Xiaojin Wei
CPC classification number: H05K1/0203 , H01L23/36 , H01L23/3672 , H01L23/3675 , H01L23/373 , H01L23/3736 , H01L23/42 , H01L23/433 , H01L23/57 , H05K3/30 , H05K5/0208 , H05K5/03 , H05K5/065 , H05K7/1427 , H05K7/20436 , H05K13/00 , Y10T29/4913 , Y10T29/49137
Abstract: Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.
Abstract translation: 电子封装具有增强的散热能力。 电子封装包括多个电子部件和电子部件所在的外壳。 外壳包括覆盖电子部件的导热盖。 至少一个热传递元件耦合到或者与导热盖一体，并且位于盖的主表面和多个电子部件中的至少一个相应的电子部件之间。 热交换材料设置在传热元件和相应的电子部件之间，并且有助于通过传热元件将热量从电子部件传导到导热盖。 导热盖有助于向外传播和散发所传送的热量，例如通过周围的篡改传感器传感器和/或周围的密封剂。
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公开(公告)号：US20160309625A1
公开(公告)日：2016-10-20
申请号：US14687947
申请日：2015-04-16
Applicant: International Business Machines Corporation
Inventor： William L. Brodsky , Robert R. Genest , John J. Loparco , Michael T. Peets
IPC: H05K9/00
CPC classification number: H05K9/0016 , H01R13/6584 , H01R13/6592 , H01R13/74 , H05K9/0015
Abstract: A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.
Abstract translation: 一种垫圈组件结构，其包括框架，该框架包括前半部和后半部，所述前半部和后半部连接有限定在所述前半部和所述后半部之间的限定在所述框架的周边周围的多个互锁突出部， 的框架 其中电磁垫圈沿着窗的内部周边并且从框架部分地延伸到窗户中，以及通过框架的窗口的通道，该通道由受约束的电磁垫圈限定。 一种壳体结构，包括凹陷在壳体前侧的开口内的容器，容器刚性地附接到壳体，以及凹陷在开口内并位于壳体的前侧和容器之间的垫圈组件，其中 垫圈组件直接固定在壳体上。
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公开(公告)号：US20160219745A1
公开(公告)日：2016-07-28
申请号：US15014273
申请日：2016-02-03
Applicant: International Business Machines Corporation
Inventor： John J. Loparco , David C. Olson , Michael T. Peets , John G. Torok , Wade H. White , Mitchell L. Zapotoski
IPC: H05K7/14
CPC classification number: G06F1/16 , H05K7/1401 , H05K7/1405 , H05K7/1407 , H05K7/1411 , H05K7/1492
Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.
Abstract translation: 本发明的一个方面公开了一种用于配合计算设备结构的设备。 该装置包括一个或多个可旋转的闩锁，该一个或多个可旋转闩锁各自包括容纳在该一个或多个可旋转闩锁内的相应的螺钉机构。 该装置还包括一个或多个弹簧组件，一个或多个弹簧组件各自包括容纳在一个或多个弹簧组件内的相应的螺纹组件。 相应的螺纹组件包括能够接收一个或多个可旋转闩锁的相应螺钉机构的螺纹。
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39.发明授权Connector with a rotatably coupled cam shaft having a connect-assist element 有权具有可旋转联接的凸轮轴的连接器，其具有连接辅助元件公开(公告)号：US08936497B2
公开(公告)日：2015-01-20
申请号：US13777340
申请日：2013-02-26
Applicant: International Business Machines Corporation
Inventor： William L. Brodsky , Charles C. Gange , Robert R. Genest , Michael T. Peets
IPC: H01R13/62
CPC classification number: H01R13/62 , H01R13/62905 , H01R24/005 , Y10T29/49204
Abstract: A connector apparatus is provided which includes a connector and a mechanical connect-assist mechanism associated, at least in part, with the connector. The connector is configured to operatively plug into a socket structure, and the mechanical connect-assist mechanism includes a cam shaft rotatably coupled to the connector and a connect-assist element projecting from the rotatable cam shaft. The connect-assist element is configured to engage at least one element-receiving opening associated with the socket structure with insertion of the connector within the socket structure. Rotating of the rotatable cam shaft moves the connect-assist element within the at least one element-receiving opening to facilitate secure seating and retention of the connector within the socket structure. In one embodiment, the connect-assist element is a rod extending transverse through the rotatable cam shaft, and configured to engage first and second element-receiving openings associated with the socket structure on opposite sides of the connector.
Abstract translation: 提供一种连接器装置，其包括至少部分地与连接器相关联的连接器和机械连接辅助机构。 连接器构造成可操作地插入到插座结构中，并且机械连接辅助机构包括可旋转地联接到连接器的凸轮轴和从可旋转凸轮轴突出的连接辅助元件。 所述连接辅助元件被构造成通过将所述连接器插入所述插座结构而与所述插座结构相关联的至少一个元件接收开口接合。 旋转的凸轮轴的旋转将连接辅助元件移动到至少一个元件接收开口内，以便于将连接器牢固地安置并保持在插座结构内。 在一个实施例中，连接辅助元件是横向延伸穿过可旋转凸轮轴的杆，并且构造成在连接器的相对侧上接合与插座结构相关联的第一和第二元件接收开口。
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公开(公告)号：US20130033820A1
公开(公告)日：2013-02-07
申请号：US13648496
申请日：2012-10-10
Applicant: International Business Machines Corporation
Inventor： David L. Edwards , Randall G. Kemink , David C. Olson , Michael T. Peets , John G. Torok , Wade H. White
IPC: H05K7/20
CPC classification number: H01L23/467 , H01L23/36 , H01L23/42 , H01L2924/0002 , H01L2924/00
Abstract: A method of cooling a multi-chip electronic module includes receiving in an inlet of the multi-chip module an amount of fluid, and passing the amount of fluid along a plurality of substantially parallel flow paths that extends between a heat spreader member and a printed circuit board supporting a plurality of electronic components. The plurality of electronic components is in thermal contact with an internal surface of the heat spreader member. A heat exchange is facilitated between the plurality of electronic components and the amount of fluid passing along the flow path.
Abstract translation: 冷却多芯片电子模块的方法包括在多芯片模块的入口处接收一定量的流体，并且使多个流体沿着多个基本上平行的流动路径传递，所述流动路径在散热构件和印刷 电路板支撑多个电子部件。 多个电子部件与散热构件的内表面热接触。 在多个电子部件之间促进热交换和沿着流路通过的流体量。
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