-
公开(公告)号：US11536781B2
公开(公告)日：2022-12-27
申请号：US17301795
申请日：2021-04-14
Applicant: Infineon Technologies AG
Inventor： Horst Theuss , Klaus Elian , Helmut Wietschorke
IPC: G01R33/038 , G01R33/07
Abstract: The present disclosure relates to a magnetic-sensor device comprising a circuit board made of an electrically insulating material and having conductor tracks, and comprising a permanent magnet surface-mounted on the circuit board, and a magnetic-field sensor connected to the conductor tracks of the circuit board. An SMD component for populating a circuit board is also proposed, which SMD component comprises a permanent magnet and a magnetic-field sensor.
-
公开(公告)号：US11239176B2
公开(公告)日：2022-02-01
申请号：US16835627
申请日：2020-03-31
Applicant: Infineon Technologies AG
Inventor： Jochen Dangelmaier , Klaus Elian
IPC: H01L23/544 , H01L23/495
Abstract: A package comprising a carrier, an electronic component mounted on the carrier, and an identifier indicative of an origin of the package and being formed on and/or in the carrier is disclosed.
-
公开(公告)号：US10543722B2
公开(公告)日：2020-01-28
申请号：US15911305
申请日：2018-03-05
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Thomas Mueller
Abstract: Tire sensor devices, tires equipped with such devices and corresponding methods are disclosed, where a tire sensor chip is provided on a flexible sheet material.
-
公开(公告)号：US10519030B2
公开(公告)日：2019-12-31
申请号：US15478946
申请日：2017-04-04
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Franz Gabler , Thomas Mueller , Horst Theuss , Mathias Vaupel
Abstract: A package which comprises a carrier, a transducer mounted on the carrier and configured for converting between a package-external property and an electric signal, a package housing at least partially housing at least one of the carrier and the transducer, and a sealing which forms at least part of the package housing for sealing between the package and a package-external body.
-
公开(公告)号：US10310026B2
公开(公告)日：2019-06-04
申请号：US15595136
申请日：2017-05-15
Applicant: Infineon Technologies AG
Inventor： Tobias Werth , Klaus Elian , James Sterling
IPC: G01B7/30 , G01R33/00 , B82Y25/00 , G01R33/07 , G01R33/09 , H01L43/08 , G01D5/12 , G01R3/00 , G01D5/16 , G11B5/00
Abstract: Embodiments related to the generation of magnetic bias fields for magnetic sensing are described and depicted. In one embodiment, a sensor includes at least one magnetosensitive element, and a magnetic body with an opening, the magnetic body comprising magnetic material, the magnetic body having inclined surface sections shaped by the opening, wherein the sensor is arranged within the opening such that the magnetosensitive element is in lateral directions bounded by the inclined surface sections.
-
Patent Agency Ranking
公开(公告)号：US09911966B2
公开(公告)日：2018-03-06
申请号：US14689259
申请日：2015-04-17
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Werner Roessler , Werner Breuer
CPC classification number: H01M2/345 , H01M2/26 , H01M2/34 , H01M2/348 , H01M10/4257 , H01M2010/4278 , H01M2200/00 , H01M2200/10 , H01M2200/20 , H02J7/0031 , H02J7/007
Abstract: A battery cell having a first switching member switchable between a first position and a second position, wherein in the first position of the first switching member, a first electrode of the battery stack is being connected to a first terminal of the battery cell. In the second position of the first switching member the first electrode is being separated from the first terminal. The battery cell may further comprise a control unit in order to control a switching of the first switching member. Optionally there may be a second switching member providing a bypass between the second electrode and the first terminal, once the first terminal is being separated from the first electrode in response to a critical state of the battery cell.
-
公开(公告)号：US20170288130A1
公开(公告)日：2017-10-05
申请号：US15089984
申请日：2016-04-04
Applicant: Infineon Technologies AG
Inventor： Volker Strutz , Klaus Elian , Cyrus Ghahremani , Rainer Markus Schaller
CPC classification number: H01L43/02 , G01R33/0047 , G01R33/07 , H01L43/065 , H01L43/08 , H01L43/12 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.
-
公开(公告)号：US20160103219A1
公开(公告)日：2016-04-14
申请号：US14969848
申请日：2015-12-15
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss
CPC classification number: G01S7/521 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , G01S15/08 , G01S15/10 , G10K11/004 , H01L41/053 , H01L41/0973 , H04R2201/003
Abstract: Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.
-
公开(公告)号：US09209497B2
公开(公告)日：2015-12-08
申请号：US13717417
申请日：2012-12-17
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss , Guenther Ruhl
CPC classification number: H01M10/48 , G01M3/227 , G01M3/3272 , G01M3/36 , H01M2/345 , H01M10/052 , H01M2200/20
Abstract: A sensor module includes an enclosure adapted to hermetically seal an opening or a hole on the outer surface of a casing or packaging, a sensor element and a membrane. The membrane is arranged between the enclosure and the opening or hole of the casing or packaging.
Abstract translation: 传感器模块包括适于气密地密封壳体或包装，传感器元件和膜的外表面上的开口或孔的外壳。 隔膜布置在外壳和外壳或包装的开口或孔之间。
-
公开(公告)号：US08652866B2
公开(公告)日：2014-02-18
申请号：US13733375
申请日：2013-01-03
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Georg Meyer-Berg , Horst Theuss
CPC classification number: H01L21/563 , G01L9/0054 , G01L19/0627 , G01L19/141 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.
Abstract translation: 传感器装置及方法。 一个实施例提供了具有感测区域的第一半导体芯片。 多孔结构元件附接到第一半导体芯片。 多孔结构元件的第一区域面向第一半导体芯片的感测区域。 封装材料部分地封装第一半导体芯片和多孔结构元件。
-
-
-
-
-
-
-
-
-
Search Results
80
records
(took 0.024 seconds)
