公开(公告)号：US12040543B2

公开(公告)日：2024-07-16

申请号：US17648730

申请日：2022-01-24

Applicant: Infineon Technologies AG

Inventor： Walter Hartner ,  Tuncay Erdoel ,  Klaus Elian ,  Christian Geissler ,  Bernhard Rieder ,  Rainer Markus Schaller ,  Horst Theuss ,  Maciej Wojnowski

IPC: H01Q13/06 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q23/00

CPC classification number: H01Q13/06 ,  H01Q1/2283 ,  H01Q1/526 ,  H01Q23/00

Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.

公开(公告)号：US12030450B2

公开(公告)日：2024-07-09

申请号：US17351329

申请日：2021-06-18

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Horst Theuss

IPC: B60R21/0136 ,  B81B3/00 ,  B60R21/013

CPC classification number: B60R21/0136 ,  B81B3/0021 ,  B60R2021/01302 ,  B81B2201/0257

Abstract: A sensor device includes a sensor which is configured to detect a physical quantity generated by an impact event and to generate first measurement data based on the impact event. The sensor device also includes a MEMS microphone configured to detect sound waves generated by the impact event and to generate second measurement data based on the impact event. The sensor device is configured to provide the first measurement data and the second measurement data to a logic unit. The logic unit is configured to detect the impact event based on a combination of the first measurement data and the second measurement data.

公开(公告)号：US11876007B2

公开(公告)日：2024-01-16

申请号：US17651612

申请日：2022-02-18

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Horst Theuss

IPC: H01L21/673 ,  H01L23/049 ,  H01L23/20 ,  H01L21/67 ,  B81C1/00

CPC classification number: H01L21/67376 ,  B81C1/00285 ,  H01L21/67126 ,  H01L21/67393 ,  H01L23/049 ,  H01L23/20 ,  B81C2203/0145

Abstract: A method is provided for producing a hermetically sealed housing having a semiconductor component. The method comprises introducing a housing having a housing body and a housing cover into a process chamber. The housing cover closes off a cavity of the housing body and is attached in a gas-tight manner to the housing body. At least one opening is formed in the housing. At least one semiconductor component is arranged in the cavity. The method furthermore comprises generating a vacuum in the cavity by evacuating the process chamber, and also generating a predetermined gas atmosphere in the cavity and the process chamber. The method moreover comprises applying sealing material to the at least one opening while the predetermined gas atmosphere prevails in the process chamber.

公开(公告)号：US11726148B2

公开(公告)日：2023-08-15

申请号：US17836204

申请日：2022-06-09

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Volker Strutz

IPC: G01R33/07 ,  G01R15/20

CPC classification number: G01R33/07 ,  G01R15/202

Abstract: A sensor device includes a current conductor designed to carry a measurement current, and a magnetic field sensor chip having a sensor element, wherein the magnetic field sensor chip is designed to detect a magnetic field at the location of the sensor element. The sensor device furthermore includes an encapsulation material, wherein the magnetic field sensor chip is encapsulated by the encapsulation material, and a soft magnet secured to the encapsulation material and designed to concentrate the magnetic field at the location of the sensor element. The magnetic field sensor chip and the soft magnet are galvanically isolated from one another by the encapsulation material.

公开(公告)号：US11662232B2

公开(公告)日：2023-05-30

申请号：US17736204

申请日：2022-05-04

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Rainer Markus Schaller

IPC: G01R33/06 ,  G01R33/07 ,  G01D11/24

CPC classification number: G01D11/245 ,  G01R33/07

Abstract: A sensor package including a metal carrier and a sensor chip arranged on the metal carrier and having a first sensor element. In an orthogonal projection of the sensor chip onto a surface of the metal carrier, at least two edge sections of the sensor chip are free of overlap with the surface of the metal carrier. The sensor chip is designed to detect a magnetic field induced by an electric current flowing through a current conductor.

公开(公告)号：US11326910B2

公开(公告)日：2022-05-10

申请号：US16532680

申请日：2019-08-06

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Rainer Markus Schaller

IPC: G01R33/06 ,  G01D11/24 ,  G01R33/07

Abstract: A sensor package including a metal carrier and a sensor chip arranged on the metal carrier and having a first sensor element. In an orthogonal projection of the sensor chip onto a surface of the metal carrier, at least two edge sections of the sensor chip are free of overlap with the surface of the metal carrier. The sensor chip is designed to detect a magnetic field induced by an electric current flowing through a current conductor.

公开(公告)号：US20220115585A1

公开(公告)日：2022-04-14

申请号：US17555809

申请日：2021-12-20

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Volker Strutz

IPC: H01L43/04 ,  G01R15/20 ,  G01R19/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L43/02 ,  H01L43/06 ,  H01L43/12 ,  H01L43/14

Abstract: A current sensor package, comprises a current path and a sensing device. The sensing device is spaced from the current path, and the sensing device is configured for sensing a magnetic field generated by a current flowing through the current path. Further, the sensing device comprises a sensor element. The sensing device is electrically connected to a conductive trace. An encapsulant extends continuously between the current path and the sensing device.

公开(公告)号：US11105776B2

公开(公告)日：2021-08-31

申请号：US16534143

申请日：2019-08-07

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Rainer Markus Schaller

IPC: G01N29/24 ,  G01N21/17

Abstract: A detector module is disclosed. In one example, the detector module is for a photo-acoustic gas sensor and comprises a first substrate made of a semiconductor material and comprising a first surface and a second surface opposite to the first surface, a second substrate comprising a third surface, a fourth surface opposite to the third surface, and a first recess formed in the fourth surface. The second substrate is connected with its fourth surface to the first substrate so that the first recess forms an airtight-closed first cell which is filled with a reference gas and a pressure sensitive element comprising a membrane disposed in contact with the reference gas. The detector module is further configured such that a beam of light pulses passes through the first substrate and thereby enters the first cell.

公开(公告)号：US10782270B2

公开(公告)日：2020-09-22

申请号：US16036484

申请日：2018-07-16

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Rainer Markus Schaller ,  Thomas Mueller

IPC: G01J5/02 ,  G01N29/24 ,  G01N21/17 ,  G01N29/30 ,  G01N29/032

Abstract: A photoacoustic sensor device may include a housing and first and second ceramic cavity packages disposed in the housing. The first ceramic cavity package may include a first sidewall having a first set of electrical contact elements, a first cavity structure, and a light source electrically coupled to the first set of electrical contact elements. The second ceramic cavity package may include a second sidewall having a second set of electrical contact elements, a second cavity structure, and a photoacoustic detector electrically coupled to the second set of electrical contact elements. The first and second ceramic cavity packages may be arranged such that the light source and the photoacoustic detector face one another, and oriented such that the first and second sets of electrical contact elements align with electrical contact points of a PCB when the photoacoustic sensor device is positioned over the PCB for coupling to the PCB.

公开(公告)号：US20190386206A1

公开(公告)日：2019-12-19

申请号：US16441304

申请日：2019-06-14

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Volker Strutz

IPC: H01L43/04 ,  H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L43/12 ,  H01L43/02 ,  H01L43/14 ,  H01L43/06 ,  G01R15/20 ,  G01R19/00

Abstract: A current sensor package, comprises a current path and a sensing device. The sensing device is spaced from the current path, and the sensing device is configured for sensing a magnetic field generated by a current flowing through the current path. Further, the sensing device comprises a sensor element. The sensing device is electrically connected to a conductive trace. An encapsulant extends continuously between the current path and the sensing device.