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    Sensing systems and methods using a coupling structure
    32.
    发明授权
    Sensing systems and methods using a coupling structure 有权

    公开(公告)号：US10345227B2

    公开(公告)日：2019-07-09

    申请号：US15617246

    申请日：2017-06-08

    申请人： Infineon Technologies AG

    发明人： Ventsislav Lavchiev ,  Thomas Grille ,  Ursula Hedenig ,  Bernhard Jakoby

    IPC分类号： G01N21/27 ,  G01N21/77 ,  G01N21/03

    摘要： A sensor system having coupling structures is disclosed. The system includes an input coupling structure, an interaction region, and an output coupling structure. The input coupling structure is configured to receive emitted light at a selected coupling efficiency and may provide filtering of the emitted light for a selected wavelength. The interaction region is coupled to the input coupling structure and configured to interact the light from the input coupling structure with a specimen. The output coupling structure is coupled to the interaction region and configured to provide interacted light from the interaction region to the detector.

    Micro mechanical structure and method for fabricating the same
    39.
    发明授权
    Micro mechanical structure and method for fabricating the same 有权
    微机械结构及其制造方法

    公开(公告)号：US09212045B1

    公开(公告)日：2015-12-15

    申请号：US14448783

    申请日：2014-07-31

    申请人： Infineon Technologies AG

    发明人： Ulrich Schmid ,  Tobias Frischmuth ,  Peter Irsigler ,  Thomas Grille ,  Daniel Maurer ,  Ursula Hedenig ,  Markus Kahn ,  Guenter Denifl

    IPC分类号： H01L29/66 ,  B81B3/00 ,  B81C1/00

    CPC分类号： B81C1/00658 ,  B81B2201/0257 ,  B81B2203/0127 ,  H04R19/005 ,  H04R31/00 ,  H04R2307/023

    摘要： A micro mechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region. The functional structure further includes a conductive base layer having a conductive base layer material. The conductive base layer material includes sectionally in a stiffening section a carbon material such that a carbon concentration of the carbon material in the conductive base layer material is at least 1014 per cubic cm and at least higher by a factor of 103 than in the conductive base layer material adjacent to the stiffening section.

    摘要翻译： 微机械结构包括衬底和布置在衬底上的功能结构。 功能结构包括响应于作用在功能区上的力而相对于衬底可偏转的功能区域。 功能结构还包括具有导电性基底层材料的导电性基底层。 导电基层材料在硬化部分中包括碳材料，使得导电基材层材料中的碳材料的碳浓度至少为1014每立方厘米，并且至少高于导电基体中的103倍 邻近加强部分的层材料。

    METHOD FOR MANUFACTURING A PLURALITY OF MICROPHONE STRUCTURES, MICROPHONE AND MOBILE DEVICE
    40.
    发明申请
    METHOD FOR MANUFACTURING A PLURALITY OF MICROPHONE STRUCTURES, MICROPHONE AND MOBILE DEVICE 有权
    制造麦克风结构多样性的方法，麦克风和移动装置

    公开(公告)号：US20150230039A1

    公开(公告)日：2015-08-13

    申请号：US14176182

    申请日：2014-02-10

    申请人： Infineon Technologies AG

    发明人： Ursula Hedenig ,  Daniel Maurer ,  Thomas Grille ,  Peter Irsigler ,  Soenke Pirk ,  Andre Brockmeier

    IPC分类号： H04R31/00 ,  H04R23/00

    CPC分类号： H04R31/00 ,  H04R19/005 ,  H04R23/00 ,  H04R2201/003 ,  Y10T29/49

    摘要： In various embodiments, a method for manufacturing microphone structures is provided. The method may include: Providing a substrate having a front side and a back side, the backside facing away from the front side, and having an inner area and an outer area laterally surrounding the inner area, with the inner area comprising a plurality of microphone areas each microphone are being provided for one microphone of the plurality of microphones; Forming a plurality of layers for the plurality of microphones in the microphone areas on the front side of the substrate; Forming a recess from the backside of the substrate with the recess laterally overlapping the entire inner area; Forming a plurality of cavities into a bottom of the recess with each cavity of the plurality of cavities being formed in one of the microphone areas; Processing the layers to form the plurality of microphone structures, wherein each microphone structure comprises at least one layer of the plurality of layers and one cavity; and Separating the plurality of microphone structures from each other.

    摘要翻译： 在各种实施例中，提供了一种用于制造麦克风结构的方法。 该方法可以包括：提供具有前侧和后侧的衬底，背面背离前侧，并且具有横向包围内部区域的内部区域和外部区域，其中内部区域包括多个麦克风 每个麦克风正在为多个麦克风中的一个麦克风提供的区域; 在基板正面的麦克风区域中形成多个麦克风层; 从基板的背面形成凹部，其中凹部横向重叠整个内部区域; 在所述多个空腔的每个空腔形成在所述麦克风区域中的一个中，形成多个空腔到所述凹部的底部; 处理层以形成多个麦克风结构，其中每个麦克风结构包括多层中的至少一层和一个空腔; 并且将多个麦克风结构彼此分离。