公开(公告)号：US20220076892A1

公开(公告)日：2022-03-10

申请号：US17467841

申请日：2021-09-07

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Nathan A. Reed ,  Allen Templeton ,  James R. Magee ,  James Davis ,  Abhijit Gurav ,  Hunter Hayes ,  Hanzheng Guo

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/40 ,  C04B35/465

Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.

公开(公告)号：US11037871B2

公开(公告)日：2021-06-15

申请号：US16553395

申请日：2019-08-28

Applicant: KEMET Electronics Corporation

Inventor： Allen Templeton ,  John Bultitude ,  Lonnie G. Jones ,  Philip M. Lessner

IPC: H01L23/498 ,  H01L23/522 ,  H01L29/778 ,  H01L23/367

Abstract: An improved electronic assembly is provided. The electronic assembly comprises a ceramic interposer comprising multiple layers. The active layers of the multiple layers form an embedded capacitor comprising parallel electrodes with a dielectric between adjacent electrodes wherein adjacent electrodes have opposite polarity. A wide band gap device is also on the multilayered ceramic interposer.

公开(公告)号：US10790094B2

公开(公告)日：2020-09-29

申请号：US16456912

申请日：2019-06-28

Applicant: KEMET Electronics Corporation

Inventor： John E. McConnell ,  Garry L. Renner ,  John Bultitude ,  R. Allen Hill ,  Galen W. Miller

IPC: H01G4/40 ,  H01G4/30 ,  H01G4/232 ,  H01G4/002 ,  H01G4/38 ,  B23K35/36 ,  B23K20/00 ,  B23K20/02 ,  B23K20/16 ,  B23K20/22 ,  B23K35/02 ,  H01G4/012 ,  H01G4/248 ,  H01G4/12 ,  B22F3/10 ,  H01G4/008 ,  B23K101/40 ,  B23K101/42

Abstract: A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.

公开(公告)号：US20200273949A1

公开(公告)日：2020-08-27

申请号：US16531255

申请日：2019-08-05

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Lonnie G. Jones ,  Allen Templeton ,  Philip M. Lessner

IPC: H01L49/02 ,  H01L23/48 ,  H01L23/522

Abstract: Provided herein is a module for packaging semiconductors comprising: at least one PDC comprising parallel internal electrodes of alternating polarity with a paraelectric dielectric between adjacent internal electrodes wherein the paraelectric dielectric has a permittivity above 10 to no more than 300; and wherein the PDC forms a capacitor couple with at least one semiconductor.

公开(公告)号：US10681814B2

公开(公告)日：2020-06-09

申请号：US15699654

申请日：2017-09-08

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Galen W. Miller ,  John McConnell

IPC: H05K1/18 ,  H05K3/30 ,  H01L23/498 ,  H05K3/34

Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

公开(公告)号：US20190200457A1

公开(公告)日：2019-06-27

申请号：US16212156

申请日：2018-12-06

Applicant: KEMET Electronics Corporation

Inventor： James A. Burk ,  John Bultitude ,  Galen W. Miller

IPC: H05K1/18 ,  H01G4/30 ,  H03H7/01 ,  H05K1/02 ,  H05K3/30 ,  H01G4/228

CPC classification number: H05K1/18 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H03H7/0115 ,  H05K1/028 ,  H05K1/181 ,  H05K3/30 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/1006 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2201/10181 ,  H05K2201/10196 ,  H05K2201/10515 ,  H05K2201/10636

Abstract: A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive

公开(公告)号：US20190090348A1

公开(公告)日：2019-03-21

申请号：US16195346

申请日：2018-11-19

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Galen Miller ,  John E. McConnell

IPC: H05K1/18 ,  H01L23/498 ,  H05K3/30

Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

公开(公告)号：US20180337002A1

公开(公告)日：2018-11-22

申请号：US15601323

申请日：2017-05-22

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Philip M. Lessner ,  Abhijit Gurav

IPC: H01G4/258 ,  H01G4/30 ,  H01G4/38 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/258 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38

Abstract: An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.

公开(公告)号：US09881744B2

公开(公告)日：2018-01-30

申请号：US14193293

申请日：2014-02-28

Applicant: KEMET Electronics Corporation

Inventor： John E. McConnell ,  Garry L. Renner ,  John Bultitude

IPC: H01G4/232 ,  H01G4/30 ,  H01G9/00 ,  B23K1/00 ,  B23K1/005 ,  B23K1/008 ,  B23K1/20 ,  B23K35/36 ,  B23K35/02 ,  H01G4/005 ,  B23K35/28 ,  H01G9/008 ,  H01G9/045 ,  H01G9/07 ,  B23K101/42

CPC classification number: H01G9/0032 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/286 ,  B23K35/3613 ,  B23K2101/42 ,  H01G4/005 ,  H01G4/2325 ,  H01G4/30 ,  H01G9/0029 ,  H01G9/008 ,  H01G9/045 ,  H01G9/07 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00

Abstract: An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.

公开(公告)号：US20180012706A1

公开(公告)日：2018-01-11

申请号：US15642643

申请日：2017-07-06

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude

IPC: H01G4/33 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  H01G4/005 ,  H01G4/248 ,  H01G4/002

CPC classification number: H01G4/33 ,  H01G4/002 ,  H01G4/005 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30

Abstract: An improved multilayer ceramic capacitor is described. The multilayered ceramic capacitor comprises first internal electrodes and second internal electrodes. The first internal electrodes and said second internal electrodes are parallel with dielectric there between. A first external termination is in electrical connection with the first internal electrodes and a second external termination is in electrical contact with the second internal electrodes. A closed void layer, comprising at least one closed void, is between electrodes.