公开(公告)号：US20050001199A1

公开(公告)日：2005-01-06

申请号：US10878052

申请日：2004-06-29

申请人： Masayuki Hattori ,  Nobuo Kawahashi

发明人： Masayuki Hattori ,  Nobuo Kawahashi

IPC分类号： A01N25/04 ,  A01N33/20 ,  A01N37/34 ,  B24B37/00 ,  C09G1/02 ,  C09K3/14 ,  C09K13/00 ,  H01L21/304 ,  C09K5/00

CPC分类号： C09K3/1463 ,  C09G1/02

摘要： The aqueous dispersion comprising (A) abrasive grains, (B) at least one compound selected from the group consisting of 2-bromo-2-nitro-1,3-propanediol, 2-bromo-2-nitro-1,3-butanediol, 2,2-dibromo-2-nitroethanol, and 2,2-dibromo-3-nitrilopropionamide, and (C) an organic component other than the compounds of component (B is disclosed. The aqueous dispersion has no problem of rotting even if stored or used in a neutral pH region and produces an excellent polished surface with almost no dishing or scratches, when applied particularly to the STI process for manufacturing of semiconductor devices.

摘要翻译： 所述水性分散体包含（A）磨粒，（B）至少一种选自2-溴-2-硝基-1,3-丙二醇，2-溴-2-硝基-1,3-丁二醇 ，2,2-二溴-3-硝基丙酰胺和2,2-二溴-3-硝基丙酰胺，（C）除了组分（B）的化合物以外的有机成分，即使是水分散体也没有腐烂的问题 储存或使用在中性pH区域，并且当特别用于制造半导体器件的STI工艺时，产生几乎没有凹陷或划痕的优异的抛光表面。

公开(公告)号：US06832949B2

公开(公告)日：2004-12-21

申请号：US10279843

申请日：2002-10-25

申请人： Tomohisa Konno ,  Masayuki Motonari ,  Masayuki Hattori ,  Kou Hasegawa ,  Nobuo Kawahashi

发明人： Tomohisa Konno ,  Masayuki Motonari ,  Masayuki Hattori ,  Kou Hasegawa ,  Nobuo Kawahashi

IPC分类号： B24B500

CPC分类号： B24B37/205

摘要： An object of the present invention is to provide a window member for chemical mechanical polishing, which is excellent in antifouling property and transparency and is excellent in anti-scratching and, further, can easily perform detection of a polishing endpoint of the surface of a semiconductor wafer by passing a light for endpoint detection, in polishing of a semiconductor wafer using an optical endpoint detecting apparatus and also to a polishing pad. A window member for chemical mechanical polishing of the present invention is provided with a substrate part (comprised of polyurethane resin and the like), which is transparent partly at least, an antifouling resin layer formed on at least one side of the substrate part. This antifouling resin layer is preferably comprised of a fluorine-based polymer having a polysiloxane segment in a main chain. A polishing pad may be the one that a window member is fitted in a through hole of a substrate for a polishing pad (comprised of polyurethane resin and the like, disc-like, belt-like or the like) provided with a through hole penetrating from surface to back, or adhered to a substrate for a polishing pad so as to cover an opening part of the through hole.

摘要翻译： 本发明的目的是提供一种化学机械抛光用的窗构件，其防污性和透明性优异，抗划伤性优异，并且还可以容易地进行半导体表面的研磨终点的检测 使用光学终点检测装置对抛光用的半导体晶片进行端点检测的光，也可以使用抛光垫。 本发明的化学机械抛光用窗构件具有至少部分透明地形成在基板部的至少一侧上的防污树脂层的基板部（由聚氨酯树脂等构成）。 该防污树脂层优选由在主链中具有聚硅氧烷链段的氟系聚合物构成。 抛光垫可以是窗构件装配在用于抛光垫（由聚氨酯树脂等构成的盘状，带状等）的通孔的通孔中，该基板设置有贯通孔 或者粘附到用于抛光垫的基板上，以覆盖通孔的开口部分。

公开(公告)号：US06992123B2

公开(公告)日：2006-01-31

申请号：US10700554

申请日：2003-11-05

申请人： Hiroshi Shiho ,  Hiromi Aoi ,  Kou Hasegawa ,  Nobuo Kawahashi

发明人： Hiroshi Shiho ,  Hiromi Aoi ,  Kou Hasegawa ,  Nobuo Kawahashi

IPC分类号： C08L1/00 ,  C08L1/26 ,  C08L3/00 ,  C08L5/00 ,  C08L89/00

CPC分类号： B24B37/24 ,  B24D3/32 ,  B24D3/344 ,  C09K3/1436

摘要： A polishing pad of the present invention contains a water-insoluble matrix material comprising a crosslinked polymer such as a crosslinked 1,2-polybutadiene and water-soluble particles dispersed in the material, such as saccharides. The solubility of the water-soluble particles in water is 0.1 to 10 wt % at 25° C., and the amount of water-soluble particles eluted from the pad when the pad is immersed in water is 0.05 to 50 wt % at 25° C. Further, in the polishing pad of the present invention, the solubility of the water-soluble particles in water is 0.1 to 10 wt % at 25° C. at a pH of 3 to 11, and solubility thereof in water at 25° C. at a pH of 3 to 11 is within ±50% of solubility thereof in water at 25° C. at a pH of 7. In addition, the water-soluble particles contain an amino group, an epoxy group, an isocyanurate group, and the like. This polishing pad has good slurry retainability even if using slurries different in pH and also has excellent polishing properties such as a polishing rate and planarity.

摘要翻译： 本发明的抛光垫含有包含交联聚合物如交联的1,2-聚丁二烯的水不溶性基质材料和分散在该物质中的水溶性颗粒，例如糖类。 水溶性颗粒在水中的溶解度在25℃为0.1〜10重量％，当将垫浸入水中时，从垫中洗脱的水溶性颗粒的量在25℃为0.05〜50重量％ 此外，在本发明的研磨垫中，水溶性颗粒在水中的溶解度在25℃，pH为3〜11时为0.1〜10重量％，在25℃下在水中的溶解度 在pH为3〜11的条件下，在pH为7的情况下，25℃下在水中的溶解度的±50％以内。另外，水溶性粒子含有氨基，环氧基，异氰脲酸酯基 ，等等。 该抛光垫即使使用pH不同的浆料也具有良好的浆料保持性，并且还具有抛光速度和平面性等优异的抛光性能。

公开(公告)号：US20050245171A1

公开(公告)日：2005-11-03

申请号：US11115122

申请日：2005-04-27

申请人： Yukio Hosaka ,  Hiroshi Shiho ,  Hiroyuki Miyauchi ,  Takahiro Okamoto ,  Kou Hasefawa ,  Nobuo Kawahashi

发明人： Yukio Hosaka ,  Hiroshi Shiho ,  Hiroyuki Miyauchi ,  Takahiro Okamoto ,  Kou Hasefawa ,  Nobuo Kawahashi

IPC分类号： B24B37/04 ,  B24D18/00 ,  B24B49/00

CPC分类号： B24B37/04 ,  B24D18/0009

摘要： There is provided a chemical mechanical polishing pad containing a polishing substrate having a polishing surface and a light-transmitting member fused to the polishing substrate. The sectional form of the light-transmitting member when it is cut with a plane parallel to the polishing surface is elliptic with a value obtained by dividing its long diameter by its short diameter of more than 1. The pad is capable of transmitting end-point detection light without reducing its polishing efficiency in polishing a semiconductor wafer.

摘要翻译： 提供了一种化学机械抛光垫，其包含具有抛光表面的抛光基板和与抛光基板融合的透光部件。 当透光部件被切割成与抛光表面平行的平面时的截面形状是椭圆形的，其值通过将其长度除以其大于1的短直径而获得的值。该焊盘能够传输端点 检测光，而不降低其抛光半导体晶片的抛光效率。

公开(公告)号：US5773532A

公开(公告)日：1998-06-30

申请号：US784960

申请日：1997-01-16

申请人： Motoki Okaniwa ,  Norifumi Sumimoto ,  Yoshihisa Ohta ,  Nobuo Kawahashi ,  Kazuki Iwai

发明人： Motoki Okaniwa ,  Norifumi Sumimoto ,  Yoshihisa Ohta ,  Nobuo Kawahashi ,  Kazuki Iwai

IPC分类号： C08F283/12 ,  C08F283/00

CPC分类号： C08F283/12

摘要： A process for producing a polyorganosiloxane-based thermoplastic resin which comprises graft polymerizing (3) at least one vinyl monomer using (4) an initiator which is an organic peroxide which, upon decomposition, produces an organic radical represented by the structural formula: ##STR1## wherein R.sup.2, R.sup.3 and R.sup.4 represent independently hydrogen atoms or alkyl groups having 1 to 10 carbon atoms, in the presence of (2) a polyorganosiloxane.

摘要翻译： 一种聚有机硅氧烷类热塑性树脂的制造方法，其特征在于，使用（4）作为有机过氧化物的引发剂使（3）至少一种乙烯基单体接枝聚合，所述引发剂在分解时产生由结构式表示的有机基团： 其中R2，R3和R4独立地表示氢原子或碳原子数1〜10的烷基，（2）聚有机硅氧烷的存在下进行。

公开(公告)号：US5457167A

公开(公告)日：1995-10-10

申请号：US340391

申请日：1994-11-15

申请人： Keigo Higaki ,  Kouichi Sakurai ,  Nobuo Kawahashi ,  Yoichi Kamoshida ,  Makoto Matsumoto ,  Kazuto Shinohara ,  Kouji Kanuma

发明人： Keigo Higaki ,  Kouichi Sakurai ,  Nobuo Kawahashi ,  Yoichi Kamoshida ,  Makoto Matsumoto ,  Kazuto Shinohara ,  Kouji Kanuma

IPC分类号： C08F283/12 ,  C08F285/00 ,  C08F290/14 ,  C08G77/50 ,  C08G77/52

CPC分类号： C08G77/50 ,  C08F283/122 ,  C08F283/124 ,  C08G77/52

摘要： A polyorganosiloxane-type thermoplastic resin having excellent slidability, abrasion resistance, weatherability, impact strength, fatigue resistance and chemical resistance is disclosed. The thermoplastic resin comprises a graft copolymer (IV) obtained by graft-polymerizing at least one vinyl monomer (v) onto a modified polyorganosiloxane obtained by polymerizing 80 to 99.8% by weight of an organosiloxane (I) having the structural unit described thereinabove, 0.1 to 10% by weight of at least one graft crosslinking agent (II) containing an alkoxysilyl group, selected from the group consisting of a vinyl-type graft crosslinking agent, a mercapto-type graft crosslinking agent, an acryloyl-type crosslinking agent and a vinylphenyl-type crosslinking agent, and 0.1 to 10% by weight of a compound (III) having two alkoxysilyl groups, provided that (I)+(II)+(III)=100% by weight.

摘要翻译： 公开了具有优异的滑动性，耐磨性，耐候性，冲击强度，耐疲劳性和耐化学性的聚有机硅氧烷型热塑性树脂。 热塑性树脂包括通过将至少一种乙烯基单体（v）接枝聚合到通过使80至99.8重量％的具有上述结构单元的有机硅氧烷（I）聚合而获得的改性聚有机硅氧烷上获得的接枝共聚物（IV），0.1 至10重量％的至少一种含有烷氧基甲硅烷基的接枝交联剂（II），其选自乙烯基型接枝交联剂，巯基型接枝交联剂，丙烯酰基型交联剂和 乙烯基苯基型交联剂和0.1〜10重量％的具有两个烷氧基甲硅烷基的化合物（III），条件是（I）+（II）+（III）= 100重量％。

公开(公告)号：US20050239380A1

公开(公告)日：2005-10-27

申请号：US11110728

申请日：2005-04-21

申请人： Yukio Hosaka ,  Yuuji Shimoyama ,  Hiroshi Shiho ,  Nobuo Kawahashi

发明人： Yukio Hosaka ,  Yuuji Shimoyama ,  Hiroshi Shiho ,  Nobuo Kawahashi

IPC分类号： B24B37/04 ,  B24B1/00

CPC分类号： B24B37/04 ,  B24B37/042

摘要： A chemical mechanical polishing pad having a polishing surface with an arithmetic mean roughness (Ra) of 0.1 to 15 μm, a 10-point height (Rz) of 40 to 150 μm, a core roughness depth (Rk) of 12 to 50 μm and a reduced peak height (Rpk) of 7 to 40 μm, a manufacturing process thereof and a chemical mechanical polishing method. Even when the chemical mechanical polishing of a large-diameter wafer as an object to be polished is carried out by this pad, a polished surface having excellent in-plane uniformity and flatness can be formed.

摘要翻译： 一种化学机械抛光垫，其抛光表面的算术平均粗糙度（Ra）为0.1〜15μm，10点高（Rz）为40〜150μm，芯粗糙度深度（Rk）为12〜50μm， 降低的峰值高度（Rpk）为7至40μm，其制造方法和化学机械抛光方法。 即使通过该垫进行作为被研磨物的大直径晶片的化学机械研磨，也可以形成具有优异的面内均匀性，平坦性的研磨面。

公开(公告)号：US5318797A

公开(公告)日：1994-06-07

申请号：US540930

申请日：1990-06-20

申请人： Egon Matijevic ,  Nobuo Kawahashi

发明人： Egon Matijevic ,  Nobuo Kawahashi

IPC分类号： A61K47/02 ,  A61K8/00 ,  A61K8/11 ,  A61K8/26 ,  A61K9/50 ,  A61K47/34 ,  A61K49/00 ,  A61Q17/04 ,  B01J2/00 ,  B01J13/02 ,  B01J13/04 ,  B01J13/20 ,  C01B31/02 ,  C01B31/30 ,  C01F7/02 ,  C01F17/00 ,  C01G25/00 ,  C04B38/06 ,  C08J3/12 ,  C10M103/00 ,  H01F1/11 ,  B05D7/24

CPC分类号： B01J13/02

摘要： Spherical particles include a core of a polymer and a metal compound covering the polymer core. These particles may be formed by homogeneously dispersing particles of a polymeric compound in an aqueous solution of a hydrolyzable metal salt to form a uniform metal layer around the spherical particles. The spherical particles can also include a core of carbon and a metal compound covering the carbon core or the particles can have a hollow core prepared by heating spherical polymer particles coated with a metal compound to a temperature of 150.degree. C. or higher in the presence of oxygen to completely decompose the polymeric compound. These spherical particles are useful in electronic materials, magnetic materials and the like.

摘要翻译： 球形颗粒包括聚合物芯和覆盖聚合物芯的金属化合物。 这些颗粒可以通过将高分子化合物的颗粒均匀分散在可水解金属盐的水溶液中形成，以在球形颗粒周围形成均匀的金属层。 球形颗粒还可以包括碳芯和覆盖碳芯的金属化合物，或者颗粒可以具有通过将存在金属化合物的球形聚合物颗粒加热至150℃或更高的温度而制备的中空芯 的氧气以完全分解聚合物。 这些球形颗粒可用于电子材料，磁性材料等。

公开(公告)号：US07442116B2

公开(公告)日：2008-10-28

申请号：US10978472

申请日：2004-11-02

申请人： Hiroyuki Miyauchi ,  Hiroshi Shiho ,  Nobuo Kawahashi

发明人： Hiroyuki Miyauchi ,  Hiroshi Shiho ,  Nobuo Kawahashi

IPC分类号： B24D11/00

CPC分类号： B24B37/205 ,  Y10S451/921

摘要： A chemical mechanical polishing pad having a face for polishing an object to be polished, a non-polishing face opposite to the face and a side face for interconnecting these faces and including the pattern of recessed portions which are formed on the non-polishing face and are open to the non-polishing face but not on the side face.

摘要翻译： 一种化学机械抛光垫，其具有用于抛光待抛光物体的面，与该面相反的非抛光面和用于互连这些面的侧面，并且包括形成在非抛光面上的凹部的图案，以及 对非抛光面开放，但不在侧面。

公开(公告)号：US07183213B2

公开(公告)日：2007-02-27

申请号：US10892096

申请日：2004-07-16

申请人： Hiroshi Shiho ,  Yukio Hosaka ,  Kou Hasegawa ,  Nobuo Kawahashi

发明人： Hiroshi Shiho ,  Yukio Hosaka ,  Kou Hasegawa ,  Nobuo Kawahashi

IPC分类号： H01L21/302

CPC分类号： B24B37/205 ,  B24B37/013

摘要： A chemical mechanical polishing pad. The pad contains a water-insoluble matrix and Water-soluble particles dispersed in the water-insoluble matrix material and has a polishing surface and a non-polishing surface on a side opposite to the polishing surface. The pad has a light transmitting area which optically communicates from the polishing surface to the non-polishing surface. The non-polishing surface of the light transmitting area has a surface roughness (Ra) of 10 pm or less.

摘要翻译： 化学机械抛光垫。 垫包含分散在水不溶性基质材料中的水不溶性基质和水溶性颗粒，并且在与抛光表面相对的一侧上具有抛光表面和非抛光表面。 垫具有从抛光表面与非抛光表面光学连通的透光区域。 透光区域的非抛光面的表面粗糙度（Ra）为10μm以下。