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42 条记录 (耗时 0.028 秒)

    Crank angle sensor and ignition timing control system using same
    31.
    发明授权
    Crank angle sensor and ignition timing control system using same 失效
    曲柄角度传感器和点火正时控制系统使用相同

    公开(公告)号：US5056485A

    公开(公告)日：1991-10-15

    申请号：US529418

    申请日：1990-05-29

    申请人： Sadao Kobayashi ,  Hisayuki Yamamoto

    发明人： Sadao Kobayashi ,  Hisayuki Yamamoto

    IPC分类号： F02P5/15 ,  F02B77/08 ,  F02P5/155 ,  F02P7/073 ,  G01M15/06

    CPC分类号： F02P7/073 ,  F02B77/08 ,  F02P5/1558 ,  G01M15/06 ,  Y02T10/46

    摘要： A crank angle sensor comprises a rotor plate formed with first slits for detecting a first cylinder angular position, second slits for a second cylinder angular position, and a third slit for detecting an angular position of a specified cylinder. The first slits are equi-angularly distant one after another and arranged within a predetermined annular band within the rotor plate, and the second slits are equi-angularly distant one after another and arranged within the predetermined annular band. Each of the first slits is located adjacent to the corresponding one of the second slits. In an ignition timing control system using the crank angle sensor, the control is performed by generating a train of pulses including a train of leading pulses and a train of trailing pulses superimposed to each other, determining whether a start switch is turned ON or not, determining whether an engine temperature is greater than a predetermined value or not, and carrying out an ignition at a falling edge of each of the trailing pulses when the engine temperature is greater than the predetermined value, and at a falling edge of each of the leading pulses when the engine temperature is not greater than the predetermined value.

    摘要翻译： 曲柄角传感器包括形成有用于检测第一气缸角位置的第一狭缝，用于第二气缸角位置的第二狭缝和用于检测指定气缸的角位置的第三狭缝的转子板。 第一狭缝一个接一个地等角度地延伸并且布置在转子板内的预定环形带内，并且第二狭缝一个接一个地等距离地布置在预定的环形带内。 每个第一狭缝位于与相应的一个第二狭缝相邻的位置。 在使用曲轴转角传感器的点火正时控制系统中，通过产生一串脉冲串来进行控制，所述脉冲串包括相互叠加的前导脉冲串和一串拖尾脉冲，确定启动开关是否接通， 确定发动机温度是否大于预定值，并且当发动机温度大于预定值时在每个后沿脉冲的下降沿进行点火，并且在每个前导点的下降沿 当发动机温度不大于预定值时脉冲。

    HEAT RESISTING VACUUM INSULATING MATERIAL AND HEATING DEVICE
    33.
    发明申请
    HEAT RESISTING VACUUM INSULATING MATERIAL AND HEATING DEVICE 有权
    耐热真空绝热材料和加热装置

    公开(公告)号：US20090184100A1

    公开(公告)日：2009-07-23

    申请号：US12298192

    申请日：2007-04-20

    申请人： Tadahiro Ohmi ,  Yasuyuki Shirai ,  Sadao Kobayashi ,  Yoshihide Wakayama ,  Kazutaka Uekado

    发明人： Tadahiro Ohmi ,  Yasuyuki Shirai ,  Sadao Kobayashi ,  Yoshihide Wakayama ,  Kazutaka Uekado

    IPC分类号： H05B3/02 ,  D02G3/00

    CPC分类号： H01L21/67103 ,  C23C14/22 ,  C23C14/56 ,  C23C16/4412 ,  F01N13/08 ,  F01N13/146 ,  F16L53/38 ,  F16L58/00 ,  F16L59/065 ,  Y10T428/2933

    摘要： A heating device which can prevent unused active chemical species from attaching to the bodies of various vacuum devices or depositing on the inner wall of their exhaust pipes to thereby be able to make the size of exhaust pipes smaller than before and make the exhaust pipe maintenance easier. The heating device comprises a heat resisting vacuum insulator (4) wound around the outer periphery of an electric heater (3) disposed along the outer wall of an exhaust pipe (1), wherein the electric heater (3) has a resistance heating element and a heat resisting electric insulator covering this resistance heating element, and the heat resisting vacuum insulator (4) comprises a hollow platy covering material air-tightly sealed thereinside by a metal seat (5) having a heat resisting temperature of at least 100° C., and a fibrous or granular filling material (6) filled in the hollow portion of this covering material and having a heat resisting temperature of at least 100° C., the inside of the covering material being kept vacuum.

    摘要翻译： 一种加热装置，其可以防止未使用的活性化学物质附着到各种真空装置的主体或沉积在其排气管的内壁上，从而能够使排气管的尺寸比以前更小，并使排气管维持更容易 。 加热装置包括围绕沿着排气管（1）的外壁设置的电加热器（3）的外周缠绕的耐热真空绝缘体（4），其中电加热器（3）具有电阻加热元件 覆盖该电阻加热元件的耐热电绝缘体，并且耐热真空绝缘体（4）包括由耐热温度为至少100℃的金属座（5）气密地密封在其中的中空板状覆盖材料。 以及填充在该覆盖材料的中空部分中并具有至少100℃的耐热温度的纤维或颗粒填充材料（6），覆盖材料的内部保持真空。

    Filter medium for air filter and process for producing the same
    36.
    发明授权
    Filter medium for air filter and process for producing the same 有权
    用于空气过滤器的过滤介质及其制造方法

    公开(公告)号：US06929672B1

    公开(公告)日：2005-08-16

    申请号：US09601390

    申请日：1998-12-22

    申请人： Yoshihide Wakayama ,  Sadao Kobayashi ,  Satoki Sugiyama ,  Seiichi Takizawa ,  Takeshi Yamada ,  Keiji Matsuno

    发明人： Yoshihide Wakayama ,  Sadao Kobayashi ,  Satoki Sugiyama ,  Seiichi Takizawa ,  Takeshi Yamada ,  Keiji Matsuno

    IPC分类号： B01D39/16 ,  D21H27/08 ,  B01D39/04

    CPC分类号： D04H1/4218 ,  B01D39/163 ,  D04H1/587 ,  D21H27/08 ,  Y10S55/05

    摘要： The present invention has as its object to provide an air filter not only for trapping suspended particulate substances but also for not generating hazardous contaminates in the air, which cause trouble in the manufacture of semiconductor devices. As a binder to bind fibers of the air filter together, a polymer dispersion is used in which a copolymer of a hydrophilic monomer and a hydrophobic monomer is dispersed in water. As an initiator for polymerization of the copolymer, an organic peroxide is used. When an air filter (8) is installed downstream of a chemical filter (7), the space (4) placed downstream of the air filter (8) is made substantially free of organic substances and/or inorganic substances that cause trouble in the manufacture of semiconductor devices.

    摘要翻译： 本发明的目的是提供一种空气过滤器，其不仅用于捕获悬浮颗粒物质，而且还用于在空气中不产生有害污染物，这在制造半导体器件时引起故障。 作为将空气过滤器的纤维结合在一起的粘合剂，使用聚合物分散体，其中亲水单体和疏水性单体的共聚物分散在水中。 作为共聚物聚合的引发剂，使用有机过氧化物。 当空气过滤器（8）安装在化学过滤器（7）的下游时，放置在空气过滤器（8）下游的空间（4）基本上不含导致生产麻烦的有机物质和/或无机物质 的半导体器件。

    Semiconductor manufacturing facility, semiconductor manufacturing apparatus and semiconductor manufacturing method
    37.
    发明授权
    Semiconductor manufacturing facility, semiconductor manufacturing apparatus and semiconductor manufacturing method 失效
    半导体制造设备，半导体制造装置和半导体制造方法

    公开(公告)号：US06547660B1

    公开(公告)日：2003-04-15

    申请号：US09669909

    申请日：2000-09-27

    申请人： Osamu Suenaga ,  Tadahiro Ohmi ,  Sadao Kobayashi

    发明人： Osamu Suenaga ,  Tadahiro Ohmi ,  Sadao Kobayashi

    IPC分类号： B01L104

    CPC分类号： H01L21/67109 ,  H01L21/67098 ,  Y10S414/135 ,  Y10S414/14

    摘要： A semiconductor manufacturing facility is provided, which can reduce a thermal load in a clean room and reduce an amount of energy thereof. Semiconductor manufacturing equipment, which generates heat when it is used, is installed in the clean room and is covered by a housing. The housing is configured to be capable of introducing the air inside the clean room into an interior thereof. The air inside the housing is exhausted outside the clean room through a plurality of exhaust passage members. A heat insulating material is associated with the housing to reduce the release of heat from the housing to the air inside the clean room. A space between the housing and the semiconductor manufacturing equipment may be hermetically sealed, and an air introducing member may be connected to the housing to take air outside the clean room into the hermetically sealed space.

    摘要翻译： 提供了一种半导体制造设备，其可以降低洁净室中的热负荷并减少其能量。 使用时产生热量的半导体制造设备安装在洁净室中并被壳体覆盖。 壳体构造成能够将清洁室内的空气引入其内部。 壳体内的空气通过多个排气通道构件在洁净室外排出。 绝热材料与壳体相关联，以减少热量从壳体释放到洁净室内的空气。 壳体和半导体制造设备之间的空间可以被气密地密封，并且空气引入构件可以连接到壳体以将清洁室外的空气吸入密封空间。