公开(公告)号：US20160365491A1

公开(公告)日：2016-12-15

申请号：US14887451

申请日：2015-10-20

Applicant: Lextar Electronics Corporation

Inventor： Ching-Yi Chen ,  Hung-Chun Tong ,  Li-Cheng Yang ,  Wen-Wan Tai ,  Yu-Chun Lee ,  Tzong-Liang Tsai

IPC: H01L33/50 ,  F21V8/00 ,  F21K99/00

CPC classification number: H01L33/504 ,  G02B6/0003 ,  G02B6/0035 ,  G02B6/0073

Abstract: The present disclosure provides a light emitting structure including a blue light source, a first fluorescent material layer and a second fluorescent material layer. The blue light source has a light emitting surface. The first fluorescent material layer covers the light emitting surface of the blue light source. The first fluorescent material layer consists of a first fluorescent material. An excitation band of the first fluorescent material is in a blue wave band, and an emission band of the first fluorescent material is in a green wave band. The second fluorescent material layer covers the first fluorescent material layer. The second fluorescent material layer consists of a second fluorescent material. An excitation band of the second fluorescent material is in a green wave band, and an emission band of the second fluorescent material is in a red wave band. A light device and a backlight module are also provided herein.

Abstract translation: 本公开提供了包括蓝色光源，第一荧光材料层和第二荧光材料层的发光结构。 蓝色光源具有发光面。 第一荧光体层覆盖蓝色光源的发光面。 第一荧光材料层由第一荧光材料构成。 第一荧光体的激发带为蓝色波段，第一荧光体的发光带为绿色波段。 第二荧光材料层覆盖第一荧光材料层。 第二荧光材料层由第二荧光材料构成。 第二荧光体的激发带为绿色波段，第二荧光体的发光带为红色波段。 本文还提供了一种灯装置和背光模块。

公开(公告)号：US20160359090A1

公开(公告)日：2016-12-08

申请号：US15162531

申请日：2016-05-23

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Hoang Duy Nguyen ,  Ren Hong Wang ,  Chaochin Su ,  Ru-Shi Liu ,  Ching-Yi Chen ,  Yu-Chun Lee ,  Tzong-Liang Tsai

IPC: H01L33/50 ,  C09K11/67

CPC classification number: H01L33/504 ,  C09K11/675 ,  H01L33/501 ,  H01L33/56 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention provides a phosphor with a preferred orientation represented by the following formula: A2[MF6]:Mn4+, wherein A is selected from a group consisting of Li, Na, K, Rb, Cs, and NH4, M is selected from a group consisting of Ge, Si, Sn, Ti, and Zr. The preferred orientation is a (001)/(011) preferred orientation. The present invention also provides a method for fabricating the above phosphor. The present invention further provides a light-emitting element package structure employing the same.

Abstract translation: 本发明提供一种具有由下式表示的优选取向的荧光体：A2 [MF6]：Mn4 +，其中A选自Li，Na，K，Rb，Cs和NH4，M选自 由Ge，Si，Sn，Ti和Zr组成的组。 优选的取向是（001）/（011）优选的取向。 本发明还提供了制造上述荧光体的方法。 本发明还提供一种采用该发光元件封装结构的发光元件封装结构。

公开(公告)号：US20220115257A1

公开(公告)日：2022-04-14

申请号：US17644792

申请日：2021-12-17

Applicant: Lextar Electronics Corporation

Inventor： Fu-Hsin Chen ,  Yu-Chun Lee ,  Hung-Chun Tong ,  Tzong-Liang Tsai

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/50 ,  H01L33/62

Abstract: A display device includes a substrate, a plurality of white light-emitting units, and a color filter layer. The white light-emitting units are arranged on the substrate at intervals, and the white light-emitting units are chip scale package (CSP). The color filter layer is above the white light-emitting units. Each of the white light-emitting units includes a light-emitting diode chip and a wavelength conversion film. The wavelength conversion film directly covers a top surface and side surfaces of the light-emitting diode chip, and the wavelength conversion film converts light emitted by the light-emitting diode chip into white light.

公开(公告)号：US10816716B2

公开(公告)日：2020-10-27

申请号：US16548901

申请日：2019-08-23

Applicant: Lextar Electronics Corporation

Inventor： Hung-Chia Wang ,  Xue-Jie Zhang ,  Shin-Ying Lin ,  An-Cih Tang ,  Ru-Shi Liu ,  Tzong-Liang Tsai ,  Yu-Chun Lee ,  Ching-Yi Chen ,  Hung-Chun Tong

IPC: C09K11/02 ,  C09K11/66 ,  H01L33/50 ,  F21V8/00 ,  H01L25/075 ,  H01L33/56 ,  H01L33/62 ,  B82Y20/00 ,  B82Y40/00

Abstract: A quantum dot composite material and a manufacturing method and an application thereof are provided. The quantum dot composite material includes an all-inorganic perovskite quantum dot and a modification protection on a surface of the all-inorganic perovskite quantum dot. The all-inorganic perovskite quantum dot has a chemical formula of CsPb(ClaBr1-a-bIb)3, wherein 0≤a≤1, 0≤b≤1.

公开(公告)号：US20190383990A1

公开(公告)日：2019-12-19

申请号：US16548901

申请日：2019-08-23

Applicant: Lextar Electronics Corporation

Inventor： Hung-Chia Wang ,  Xue-Jie Zhang ,  Shin-Ying Lin ,  An-Cih Tang ,  Ru-Shi Liu ,  Tzong-Liang Tsai ,  Yu-Chun Lee ,  Ching-Yi Chen ,  Hung-Chun Tong

IPC: F21V8/00 ,  H01L33/62 ,  H01L33/56 ,  H01L33/50 ,  H01L25/075 ,  C09K11/66

Abstract: A quantum dot composite material and a manufacturing method and an application thereof are provided. The quantum dot composite material includes an all-inorganic perovskite quantum dot and a modification protection on a surface of the all-inorganic perovskite quantum dot. The all-inorganic perovskite quantum dot has a chemical formula of CsPb(ClaBr1-a-bIb)3, wherein 0≤a≤1, 0≤b≤1.

公开(公告)号：US10351766B2

公开(公告)日：2019-07-16

申请号：US15364207

申请日：2016-11-29

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Wen-Li Zhou ,  Wei-Lun Wu ,  Ru-Shi Liu ,  Yu-Chun Lee ,  Ching-Yi Chen ,  Tzong-Liang Tsai

IPC: C30B7/14 ,  C09K11/66 ,  C30B29/12

Abstract: The present disclosure provides a method for fabricating a phosphor. A first solution is formed by dissolving potassium hexafluorogermanate (K2GeF6) and either K2MnF6 or KMnO4 in a hydrofluoric acid solution. An anhydrous ethanol is added to the first solution to make a total concentration of fluoride ions of potassium hexafluorogermanate (K2GeF6), hydrofluoric acid, and either K2MnF6 or KMnO4 equal to or less than 48M to form a precipitate. Afterward, the precipitate is collected.

公开(公告)号：US10040994B2

公开(公告)日：2018-08-07

申请号：US15154747

申请日：2016-05-13

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Chun Che Lin ,  Ling-Ling Wei ,  Huan Jiao ,  Ru-Shi Liu ,  Ching-Yi Chen ,  Yu-Chun Lee ,  Tzong-Liang Tsai

IPC: G09F13/04 ,  C09K11/66 ,  G02F1/13357 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62

Abstract: The present invention provides a phosphor represented by the following formula: K2[Ge1-xF6]:Mnx4+, wherein 0

公开(公告)号：US09966413B2

公开(公告)日：2018-05-08

申请号：US15088616

申请日：2016-04-01

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Fang-Chang Hsueh ,  Yu-Min Lin ,  Chih-Hao Lin ,  Tzong-Liang Tsai

IPC: H01L27/15 ,  F21K9/23 ,  H01L25/075 ,  H01L33/50 ,  F21V3/00 ,  F21V8/00 ,  H01L33/58 ,  F21Y101/00 ,  H01L33/36 ,  F21Y105/16 ,  F21K9/232 ,  F21Y115/10 ,  H01L33/48

CPC classification number: H01L27/15 ,  F21K9/23 ,  F21K9/232 ,  F21V3/00 ,  F21Y2101/00 ,  F21Y2105/16 ,  F21Y2115/10 ,  G02B6/0073 ,  H01L25/0753 ,  H01L33/36 ,  H01L33/486 ,  H01L33/505 ,  H01L33/58

Abstract: A light-emitting diode (LED) module and a lamp using the same are provided. The LED module includes a substrate and several light-emitting packages. Each light-emitting package includes an optical wavelength conversion layer and a light-emitting diode having a first light-output surface, a bonding surface, and several second light-output surfaces. The bonding surface is opposite the first light-output surface and connected to the substrate. The second light-output surfaces are between the first light-output surface and the bonding surface. The optical wavelength conversion layer covers the first and second light-output surfaces. The distance between the bonding surface and the top surface of the optical wavelength conversion layer represents a light source thickness. The distance between two adjacent light-emitting packages represents a spacing of light sources. Specifically, the ratio of the spacing of light sources to the light source thickness is between 1 and 6.3.

公开(公告)号：US20180102459A1

公开(公告)日：2018-04-12

申请号：US15722368

申请日：2017-10-02

Applicant: Lextar Electronics Corporation

Inventor： Che-Hsuan Huang ,  Hsin-Lun Su ,  Shu-Hsiu Chang ,  Chih-Hao Lin ,  Tzong-Liang Tsai

IPC: H01L33/08

CPC classification number: H01L33/08 ,  H01L33/50 ,  H01L33/56 ,  H01L2933/0091

Abstract: A light emitting diode chip scale packaging structure and a direct type backlight module are disclosed. The light emitting diode chip scale packaging structure includes a light emitting diode chip, a wavelength converting layer, a diffusion structure and a lens. The wavelength converting layer is disposed on the light emitting diode chip and directly contacting the light emitting diode chip, and the wavelength converting layer includes phosphor powders. The diffusion structure covers the light emitting diode chip and the wavelength converting layer, a ratio of a height of the diffusion structure to a width of the diffusion structure is 1:2 to 5:4, and the lens covers the diffusion structure. An outer surface of the lens is a free-form surface, and a material of the lens is different from a material of the diffusion structure.

公开(公告)号：US09732940B2

公开(公告)日：2017-08-15

申请号：US14337648

申请日：2014-07-22

Applicant: Lextar Electronics Corporation

Inventor： Kuang-Neng Yang ,  Kun-Hua Wu ,  Jo-Hsiang Chen ,  Tai-Hua Ho ,  Tzong-Liang Tsai ,  Chih-Hao Lin

IPC: F21V9/16 ,  F21K9/20 ,  F21K9/64 ,  F21Y103/00 ,  F21Y115/10

CPC classification number: F21V9/30 ,  F21K9/20 ,  F21K9/64 ,  F21Y2103/00 ,  F21Y2115/10

Abstract: A lighting apparatus includes a wavelength converting apparatus. The wavelength converting apparatus includes a hollow tube and a wavelength converting material. The hollow tube has an accommodating chamber. The wavelength converting material is positioned in the accommodating chamber.