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公开(公告)号：US20140202750A1
公开(公告)日：2014-07-24
申请号：US14148979
申请日：2014-01-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi KOGURE , Hiromichi KITAJIMA
CPC classification number: H05K1/165 , H05K1/0298 , H05K2201/0792 , H05K2201/09309 , H05K2201/0969
Abstract: A multilayer substrate module includes a multilayer circuit substrate, a mounting land, and an input/output terminal. Inside the multilayer circuit substrate, a wiring line that connects the mounting land and the input/output terminal to each other, an inductor that defines a portion of the wiring line, a first ground conductor that is positioned on the one main surface side of the inductor, and a second ground conductor that is positioned on the other main surface side of the inductor are defined by conductor patterns. The area where inductor is located is not superposed with the area where the second ground conductor is located, when the one main surface or the other main surface of the multilayer circuit substrate is viewed in plan, the second ground conductor being closer to the layer where the inductor is located than the first ground conductor is.
Abstract translation: 多层基板模块包括多层电路基板，安装台面和输入/输出端子。 在多层电路基板的内部，将安装台面和输入输出端子彼此连接的布线，限定布线的一部分的电感器，位于第一接地导体的一个主面侧的第一接地导体 电感器和位于电感器的另一主表面侧的第二接地导体由导体图案限定。 电感器所在的区域不与第二接地导体所在的区域重叠，当在平面图中观察多层电路衬底的一个主表面或另一个主表面时，第二接地导体更靠近层 电感器位于第一接地导体之上。
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公开(公告)号：US20140055965A1
公开(公告)日：2014-02-27
申请号：US14069402
申请日：2013-11-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA
CPC classification number: H05K1/0271 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H05K1/113 , H05K1/181 , H05K3/4629 , H05K7/06 , H05K2201/09381 , H05K2201/0979 , H05K2201/099 , H01L2924/00
Abstract: A via conductor connected to a mounting electrode near a corner portion of a circuit substrate is provided in a position in a corresponding mounting electrode, located closer to the center of the circuit substrate. Thus, concentration of a stress in a portion of the via conductor is effectively reduced, and a break, a chip, or a crack is prevented from occurring to the circuit substrate. Even if the portion located closer to the corner portion of the mounting electrode is peeled from the circuit substrate, the electrical characteristics of the circuit module are secured because disconnection between the corresponding mounting electrode and the via conductor is prevented.
Abstract translation: 连接到电路基板的角部附近的安装电极的通孔导体设置在位于更靠近电路基板的中心的相应的安装电极的位置。 因此，有效地减小了通路导体的一部分中的应力集中，并且防止了对电路基板的破裂，芯片或裂纹的发生。 即使靠近安装电极的角部的部分从电路基板剥离，也可以确保电路模块的电气特性，因为防止了相应的安装电极和通路导体之间的断开。
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公开(公告)号：US20240364368A1
公开(公告)日：2024-10-31
申请号：US18619172
申请日：2024-03-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Masanari MIURA , Hiroyuki NAGAMORI , Hiromichi KITAJIMA , Takahiro KATAMATA , Shogo YANASE , Kouichi UENO , Hiroyuki KANI
CPC classification number: H04B1/0078 , H04B1/0483 , H04B1/10
Abstract: A radio frequency module that includes a first antenna terminal, a second antenna terminal, a TDD filter, a transmission filter, a filter, and a first switch. The first switch has a first common terminal, a second common terminal, a first terminal, a second terminal, and a third terminal. The filter is connected to the first terminal, the TDD filter is connected to the second terminal, and the transmission filter is connected to the third terminal. The first switch is capable of switching between a first connection state and a second connection state. The first connection state connects the first common terminal to the first terminal and the first common terminal to the second terminal simultaneously. The second connection state connects the first common terminal to the first terminal, the first common terminal to the second terminal, and the second common terminal to the third terminal simultaneously.
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公开(公告)号：US20240356570A1
公开(公告)日：2024-10-24
申请号：US18763282
申请日：2024-07-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA , Naoya MATSUMOTO
CPC classification number: H04B1/0067 , H04B1/1018 , H04B1/40
Abstract: A radio frequency module includes: a module substrate having a main surface; a conductive member to partition the main surface into regions in a plan view of the main surface, and being set to ground electric potential; a switch disposed in one of the regions and connected to an antenna connection terminal; a power amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch; and a low-noise amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch.
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公开(公告)号：US20240030165A1
公开(公告)日：2024-01-25
申请号：US18475231
申请日：2023-09-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyoshi AIKAWA , Hiromichi KITAJIMA , Takanori UEJIMA , Takashi YAMADA , Yoshihiro DAIMON
IPC: H01L23/66 , H01L23/00 , H01L25/065 , H01L23/498 , H01L23/552 , H03F3/213
CPC classification number: H01L23/66 , H01L24/16 , H01L25/0652 , H01L23/49822 , H01L23/49838 , H01L23/552 , H03F3/213 , H01L2223/6655 , H01L2223/6672 , H01L2224/16155 , H01L2224/16137 , H01L2924/1206 , H01L2924/1205 , H01L2924/14215 , H03F2200/294
Abstract: A high-frequency module includes a module substrate including major surfaces opposite to each other; a module substrate including major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier; a second electronic component including a filter coupled to a low-noise amplifier; and a third electronic component (an integrated circuit) including the low-noise amplifier. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surface surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.
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Patent Agency Ranking
公开(公告)号：US20240022275A1
公开(公告)日：2024-01-18
申请号：US18475222
申请日：2023-09-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyoshi AIKAWA , Takanori UEJIMA , Hiromichi KITAJIMA , Takashi YAMADA , Yoshihiro DAIMON , Syuichi ONODERA , Yuudai TANOUE , Norihiro SHIMADA
CPC classification number: H04B1/38 , H01Q1/2283 , H03H9/25 , H03H7/38
Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component disposed on the major surface; a second electronic component that includes a first electrode joined to the major surface and a second electrode joined to the major surface and that is disposed between the major surfaces; and a third electronic component disposed on the major surface; and an external connection terminal disposed on the major surface. The second electronic component is at least one of a chip inductor, a chip capacitor, and a chip resistor. The second electronic component is coupled via the first electrode to the first electronic component and is coupled via the second electrode to the third electronic component or external connection terminal.
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公开(公告)号：US20230187297A1
公开(公告)日：2023-06-15
申请号：US18166534
申请日：2023-02-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shota HAYASHI , Nobuaki OGAWA , Yuki ASANO , Takanori UEJIMA , Hiromichi KITAJIMA , Takahiro EGUCHI , Kunitoshi HANAOKA
IPC: H01L23/31 , H01L23/66 , H01L23/552 , H01L25/16 , H05K9/00 , H01L23/498
CPC classification number: H01L23/3157 , H01L23/66 , H01L23/552 , H01L25/165 , H05K9/0024 , H01L23/498
Abstract: A substrate has an upper main surface and a lower main surface arranged in an up-down direction. A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The sealing resin layer is provided on the upper main surface of the substrate, covers the metal member, the first electronic component, and the second electronic component, and has an upper surface. The shield is provided on the upper surface of the sealing resin layer so as to be connected to the upper end of the plate-shaped portion. The plate-shaped portion is inclined with respect to the up-down direction such that an upper end of the plate-shaped portion is located in front of a lower end of the plate-shaped portion.
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公开(公告)号：US20230179233A1
公开(公告)日：2023-06-08
申请号：US18154896
申请日：2023-01-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA
CPC classification number: H04B1/0057 , H04B1/04 , H04B2001/0408
Abstract: A radio-frequency module includes a switch; power amplifiers; a transmission filter that has a passband including a transmission band of a communication band A included in a communication band group X and that has one end connected to an antenna connection terminal via the switch and the other end connected to an output of the power amplifier; a transmission filter that has a passband including a transmission band of a communication band C included in a communication band group Y lower than the communication band group X and that has one end connected to the antenna connection terminal via the switch and the other end connected to an output of the power amplifier; and a module substrate. In a plan view of the module substrate, a distance between the power amplifier and the switch is shorter than a distance between the power amplifier and the switch.
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公开(公告)号：US20230145698A1
公开(公告)日：2023-05-11
申请号：US18154225
申请日：2023-01-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA , Kunitoshi HANAOKA , Motoji TSUDA
CPC classification number: H04B1/0057 , H04B1/0078 , H04B1/04 , H04B2001/0408
Abstract: A radio-frequency module includes a power amplifier, a power amplifier, a low noise amplifier, a duplexer that has a passband including a communication band A included in a communication band group X and that is connected to the power amplifier and the low noise amplifier, a duplexer that has a passband including a communication band C included in a communication band group Y lower than the communication band group X and that is connected to the power amplifier, and a module substrate having the power amplifier, the power amplifier, the low noise amplifier, and the duplexers arranged thereon. In a plan view of the module substrate, a distance between the power amplifier and the low noise amplifier is longer than a distance between the power amplifier and the low noise amplifier.
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公开(公告)号：US20230066774A1
公开(公告)日：2023-03-02
申请号：US18047295
申请日：2022-10-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Dai NAKAGAWA , Takanori UEJIMA , Yuji TAKEMATSU , Naoya MATSUMOTO , Ryohei OKABE , Hiromichi KITAJIMA
Abstract: Heat dissipating characteristics of an acoustic wave filter is improved. A high frequency module includes a mounting substrate, an acoustic wave filter, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The acoustic wave filter is arranged near the first main surface of the mounting substrate. The resin layer is arranged on the first main surface of the mounting substrate and covers an outer peripheral surface of the acoustic wave filter. The shield layer covers the resin layer and the acoustic wave filter. The shield layer is in contact with a second main surface of the acoustic wave filter that is far from the mounting substrate.
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