SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20220246765A1

    公开(公告)日:2022-08-04

    申请号:US17727038

    申请日:2022-04-22

    Abstract: A semiconductor device includes a transistor including, a first to fifth insulator, a first to third oxide, a first to third conductor. An opening reaching the second oxide is provided in the fourth insulator and the fifth insulator. The third oxide, the third insulator, and the third conductor are arranged sequentially from the inner wall side of the opening so as to fill the opening. In the channel length direction of the transistor, at least part of the fourth insulator in a region where the fourth insulator and the second oxide do not overlap with each other is in contact with the first insulator. In the channel width direction of the transistor, at least part of the third oxide in a region where the third oxide and the second oxide do not overlap with each other is in contact with the first insulator.

    SEMICONDUCTOR DEVICE
    32.
    发明申请

    公开(公告)号:US20220199832A1

    公开(公告)日:2022-06-23

    申请号:US17606823

    申请日:2020-05-12

    Abstract: A semiconductor device with small variations in transistor characteristics is provided. The semiconductor device includes an oxide; a first conductor and a second conductor provided apart from each other over the oxide; an insulator in a region between the first conductor and the second conductor over the oxide; and a conductor over the insulator. A side surface of the oxide, a top surface of the first conductor, a side surface of the first conductor, a top surface of the second conductor, and a side surface of the second conductor include regions in contact with a nitride containing silicon.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

    公开(公告)号:US20220199613A1

    公开(公告)日:2022-06-23

    申请号:US17691213

    申请日:2022-03-10

    Abstract: A semiconductor device having favorable electrical characteristics is provided. The semiconductor device includes a transistor and a capacitor. The transistor includes a first conductor and a second insulator over a first insulator; a third insulator over the first conductor and the second insulator; a fourth insulator over the third insulator; a first oxide over the fourth insulator; a second oxide and a third oxide over the first oxide; a second conductor in contact with a top surface of the third insulator, a side surface of the fourth insulator, a side surface of the first oxide, a side surface of the second oxide, and a top surface of the second oxide; a third conductor in contact with the top surface of the third insulator, a side surface of the fourth insulator, a side surface of the first oxide, a side surface of the third oxide, and a top surface of the third oxide; a fourth oxide over the first oxide; a fifth insulator over the fourth oxide; and a fourth conductor over the fifth insulator. The capacitor includes a fifth conductor over the first insulator, the third insulator over the fifth conductor, and the second conductor over the third insulator.

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20210183906A1

    公开(公告)日:2021-06-17

    申请号:US16770670

    申请日:2018-12-19

    Abstract: A highly reliable semiconductor device having a high on-state current is provided. The semiconductor device includes a first insulator, a second insulator over the first insulator, a first oxide over the first insulator, a second oxide over the first oxide, a first conductor and a second conductor over the second oxide, a third insulator over the first conductor, a fourth insulator over the second conductor, a third oxide over the second oxide, a fifth insulator over the third oxide, a third conductor that is positioned over the fifth insulator and overlaps with the third oxide, a sixth insulator covering the first to fifth insulators, the first oxide, the second oxide, and the first to third conductors, and a seventh insulator over the sixth insulator.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    39.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20170062619A1

    公开(公告)日:2017-03-02

    申请号:US15235242

    申请日:2016-08-12

    Abstract: A minute transistor is provided. A transistor with low parasitic capacitance is provided. A transistor having high frequency characteristics is provided. A transistor having a high on-state current is provided. A semiconductor device including the transistor is provided. A semiconductor device having a high degree of integration is provided. A semiconductor device including an oxide semiconductor; a second insulator; a second conductor; a third conductor; a fourth conductor; a fifth conductor; a first conductor and a first insulator embedded in an opening portion formed in the second insulator, the second conductor, the third conductor, the fourth conductor, and the fifth conductor; a region where a side surface and a bottom surface of the second conductor are in contact with the fourth conductor; and a region where a side surface and a bottom surface of the third conductor are in contact with the fifth conductor.

    Abstract translation: 提供一分钟晶体管。 提供具有低寄生电容的晶体管。 提供具有高频特性的晶体管。 提供具有高导通状态电流的晶体管。 提供包括晶体管的半导体器件。 提供了具有高集成度的半导体器件。 一种包括氧化物半导体的半导体器件; 第二绝缘体; 第二导体 第三导体; 第四导体 第五个指挥 嵌入在形成于第二绝缘体的开口部的第一导体和第一绝缘体,第二导​​体,第三导体,第四导体和第五导体; 第二导体的侧表面和底表面与第四导体接触的区域; 以及第三导体的侧表面和底表面与第五导体接触的区域。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    40.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20160087105A1

    公开(公告)日:2016-03-24

    申请号:US14853542

    申请日:2015-09-14

    Abstract: A method for manufacturing a semiconductor device, including the steps of forming a semiconductor over a substrate; forming a first conductor over the semiconductor; forming a first insulator over the first conductor; forming a resist over the first insulator; performing light exposure and development on the resist to make a second region and a third region remain and expose part of the first insulator; applying a bias in a direction perpendicular to a top surface of the substrate and generating plasma using a gas containing carbon and halogen; and depositing and etching an organic substance with the plasma. The etching rate of the organic substance is higher than the deposition rate of the organic substance in an exposed part of the first insulator, and the deposition rate of the organic substance is higher than the etching rate of the organic substance in a side surface of the second region.

    Abstract translation: 一种制造半导体器件的方法,包括在衬底上形成半导体的步骤; 在半导体上形成第一导体; 在所述第一导体上形成第一绝缘体; 在第一绝缘体上形成抗蚀剂; 在抗蚀剂上进行曝光和显影以使第二区域和第三区域保持并暴露第一绝缘体的部分; 在垂直于衬底的顶表面的方向施加偏压并使用含有碳和卤素的气体产生等离子体; 并用等离子体沉积和蚀刻有机物质。 有机物的蚀刻速度高于第一绝缘体的露出部分中的有机物质的沉积速度,并且有机物质的沉积速度高于有机物的侧表面中的有机物质的蚀刻速率 第二区。

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