公开(公告)号：US20210134770A1

公开(公告)日：2021-05-06

申请号：US17090077

申请日：2020-11-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik HWANG ,  Sungwoo HWANG

IPC: H01L25/075 ,  H01L23/00

Abstract: A method of transferring a micro light emitting diode (LED) to a pixel array panel includes transferring the micro LED by spraying using an inkjet method, wherein the micro LED comprises an active layer comprising a first portion emitting light in a first direction and a second portion emitting the light in a second direction different from the first direction.

公开(公告)号：US20180010245A1

公开(公告)日：2018-01-11

申请号：US15368892

申请日：2016-12-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jooho LEE ,  Yongsung KIM ,  Sanghoon SONG ,  Wooyoung YANG ,  Changseung LEE ,  Sungjin LIM ,  Junsik HWANG

IPC: C23C16/34 ,  C23C16/50 ,  C23C16/06 ,  H01M4/04 ,  C23C16/44

CPC classification number: C23C16/34 ,  C23C16/045 ,  C23C16/06 ,  C23C16/308 ,  C23C16/4408 ,  C23C16/45523 ,  C23C16/50 ,  C23C16/515 ,  H01J37/32 ,  H01J37/3244 ,  H01J2237/3321 ,  H01M4/0428 ,  H01M4/13 ,  H01M10/052 ,  H01M2220/30 ,  H01M2300/0068

Abstract: A plasma-enhanced chemical vapor deposition apparatus for depositing a lithium (Li)-based film on a surface of a substrate includes a reaction chamber, in which the substrate is disposed; a first source supply configured to supply a Li source material into the reaction chamber; a second source supply configured to supply phosphor (P) and oxygen (O) source materials and a nitrogen (N) source material into the reaction chamber; a power supply configured to supply power into the reaction chamber to generate plasma in the reaction chamber; and a controller configured to control the power supply to turn on or off generation of the plasma.

公开(公告)号：US20250061844A1

公开(公告)日：2025-02-20

申请号：US18935158

申请日：2024-11-01

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION

Inventor： Junsik HWANG ,  Geonwood YOO ,  Hojin LEE ,  Yongchan KIM ,  Kyungwook HWANG

IPC: G09G3/32

Abstract: A driving circuit board includes a driving circuit board includes: a plurality of driving electrode regions on a surface of the driving circuit board; a plurality of driving electrodes symmetrically arranged on the plurality of driving electrode regions; and a driving circuit electrically connected to at least one of the plurality of driving electrodes, wherein the plurality of driving electrodes include at least one dummy electrode that is not connected to the driving circuit.

公开(公告)号：US20250054813A1

公开(公告)日：2025-02-13

申请号：US18795805

申请日：2024-08-06

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  CHUNGBUK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION

Inventor： Kyungwook HWANG ,  Jaewook JEONG ,  Jonghyun JEONG ,  Minchul YU ,  Sanghoon SONG ,  Dongho KIM ,  Joonyong PARK ,  Youngtek OH ,  Junsik HWANG

IPC: H01L21/78 ,  H01L21/306 ,  H01L21/67 ,  H01L33/00 ,  H01L33/22

Abstract: Provided are a semiconductor chip, a method of preparing a semiconductor chip, and an apparatus for manufacturing a semiconductor chip. The method includes separating a semiconductor chip from a laminate, the laminate including a substrate, a lift-off layer on the substrate, and a semiconductor layer on the lift-off layer. The method further includes removing the lift-off layer with an etchant by applying a magnetic field while contacting the laminate and the etchant, to thereby prepare a semiconductor chip.

公开(公告)号：US20240178342A1

公开(公告)日：2024-05-30

申请号：US18198089

申请日：2023-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngtek OH ,  Kyungwook HWANG ,  Dongkyun KIM ,  Dongho KIM ,  Joonyong PARK ,  Sanghoon SONG ,  Minchul YU ,  Junsik HWANG

IPC: H01L33/00

CPC classification number: H01L33/005

Abstract: A chip wet-transferring device includes a chamber, a support member provided in the chamber and configured to support a transfer substrate, the transfer substrate including a plurality of grooves and on which a plurality of micro-semiconductor chips are disposed, and a magnetic field generator configured to remove a first micro-semiconductor chip from among the plurality of micro-semiconductor chips that is disposed on the transfer substrate and at least partially outside of the plurality of grooves on the transfer substrate by generating a magnetic field that moves the first micro-semiconductor chip in a direction substantially parallel with an upper surface of the transfer substrate.

公开(公告)号：US20240021661A1

公开(公告)日：2024-01-18

申请号：US18218664

申请日：2023-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihye YEON ,  Hankyu SEONG ,  Suhyun JO ,  Sammook KANG ,  Mihyun KIM ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L27/15 ,  H01L33/38 ,  H01L33/50

CPC classification number: H01L27/156 ,  H01L33/382 ,  H01L33/502

Abstract: A display apparatus, including a circuit substrate including driver circuits and first bonding electrodes, and a pixel array on the circuit substrate and including a plurality of pixels each including first to third sub-pixels, and second bonding electrodes bonded to the first bonding electrodes, the pixel array further including, a plurality of first LED cells corresponding to the first and third sub-pixels, respectively, and each including a first conductivity-type semiconductor layer, a first active layer, and a second conductivity-type semiconductor layer, a plurality of second LED cells corresponding to the second sub-pixels, respectively, and each including the first conductivity-type semiconductor layer, a second active layer, and the second conductivity-type semiconductor layer, a first electrode extending to cover upper surfaces of the plurality of first and second LED cells and connected to the first conductivity-type semiconductor layers in common.

公开(公告)号：US20240006563A1

公开(公告)日：2024-01-04

申请号：US18084186

申请日：2022-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Seogwoo HONG ,  Dongkyun KIM ,  Dongho KIM ,  Joonyong Park ,  Sanghoon SONG ,  Kyungwook Hwang ,  Junsik HWANG

IPC: H01L33/48 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L25/0753 ,  H01L2933/0066

Abstract: Disclosed are a method of transferring semiconductor chips. The method may include providing a first substrate, adhering a support substrate to the first substrate, supplying and aligning a plurality of semiconductor chips, partially adhering a second substrate to a first surface of the first substrate, separating the support substrate from the first substrate, and adhering the plurality of semiconductor chips to the second substrate by supplying a fluid to a periphery of a second surface of the first substrate and applying a pressure to the second surface.

公开(公告)号：US20240006554A1

公开(公告)日：2024-01-04

申请号：US18215377

申请日：2023-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Dongho KIM ,  Ho Won JANG ,  Kyungwook HWANG ,  Junsik HWANG ,  Sohyeon PARK ,  Jehong OH ,  Jungel RYU

IPC: H01L33/24 ,  H01L33/38 ,  H01L33/40 ,  H01L33/42 ,  H01L33/08

CPC classification number: H01L33/24 ,  H01L33/385 ,  H01L33/382 ,  H01L33/405 ,  H01L33/42 ,  H01L33/08

Abstract: A light-emitting device may include a plurality of light-emitting rods. Each of the plurality of light-emitting rods may include a first semiconductor layer having a rod shape, an active layer having a shell shape disposed about a plurality of surfaces of the first semiconductor layer, and a second semiconductor layer having a shell shape disposed about a plurality of surfaces of the active layer. The light emitting device may further include an insulating layer disposed in spaces between the plurality of light-emitting rods; a transparent electrode electrically connected to the first semiconductor layer of each of the plurality of light-emitting rods; and a reflective electrode electrically connected to the second semiconductor layer of each of the plurality of light-emitting rods.

公开(公告)号：US20230274970A1

公开(公告)日：2023-08-31

申请号：US18312655

申请日：2023-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik HWANG

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62

CPC classification number: H01L21/6835 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2221/68309 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.

公开(公告)号：US20230131855A1

公开(公告)日：2023-04-27

申请号：US17713807

申请日：2022-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Seogwoo HONG ,  Kyungwook HWANG ,  Dongkyun KIM ,  Joonyong PARK ,  Junsik HWANG

IPC: H01L33/38 ,  H01L33/62 ,  H01L33/24 ,  H01L25/075 ,  H01L33/00

Abstract: A light-emitting device and a display apparatus including the light-emitting device are provided. The light-emitting device includes a light-emitting cell including first and second electrodes arranged on an upper surface to be apart from each other, an extended layer in which the light-emitting cell is embedded and which has a width greater than a width of the light-emitting cell, and first and second electrode pads arranged on an upper surface of the extended layer to be apart from each other and respectively electrically connected to the first and second electrode.