公开(公告)号：US20130043512A1

公开(公告)日：2013-02-21

申请号：US13212834

申请日：2011-08-18

申请人： Gin-Chen Huang ,  Tsai-Fu Hsiao ,  Ching-Hong Jiang ,  Neng-Kuo Chen ,  Hongfa Luan ,  Sey-Ping Sun ,  Clement Hsingjen Wann

发明人： Gin-Chen Huang ,  Tsai-Fu Hsiao ,  Ching-Hong Jiang ,  Neng-Kuo Chen ,  Hongfa Luan ,  Sey-Ping Sun ,  Clement Hsingjen Wann

IPC分类号： H01L21/31 ,  H01L21/28 ,  H01L29/78

CPC分类号： H01L21/02274 ,  H01L21/02164 ,  H01L21/022 ,  H01L21/0228 ,  H01L21/02332 ,  H01L21/324 ,  H01L29/66795

摘要： Semiconductor device manufacturing methods and methods of forming insulating material layers are disclosed. In one embodiment, a method of forming a composite insulating material layer of a semiconductor device includes providing a workpiece and forming a first sub-layer of the insulating material layer over the workpiece using a first plasma power level. A second sub-layer of the insulating material layer is formed over the first sub-layer of the insulating material layer using a second plasma power level, and the workpiece is annealed.

公开(公告)号：US20120326279A1

公开(公告)日：2012-12-27

申请号：US13607023

申请日：2012-09-07

申请人： David E. Brown ,  Hans Van Meer ,  Sey-Ping Sun

发明人： David E. Brown ,  Hans Van Meer ,  Sey-Ping Sun

IPC分类号： H01L21/20 ,  H01L29/16

CPC分类号： H01L29/0684 ,  H01L21/84 ,  H01L27/1203

摘要： A semiconductor product has different active thicknesses of silicon on a single semiconductor substrate. The thickness of the silicon layer is changed either by selectively adding silicon or subtracting silicon from an original layer of silicon. The different active thicknesses are suitable for use in different types of devices, such as diodes and transistors.

摘要翻译： 半导体产品在单个半导体衬底上具有不同的有源厚度的硅。 通过选择性地添加硅或从原始硅层减去硅来改变硅层的厚度。 不同的有源厚度适用于不同类型的器件，例如二极管和晶体管。

公开(公告)号：US06955931B1

公开(公告)日：2005-10-18

申请号：US11053863

申请日：2005-02-10

申请人： David E. Brown ,  Sey-Ping Sun

发明人： David E. Brown ,  Sey-Ping Sun

IPC分类号： H01L21/336 ,  H01L21/66

CPC分类号： H01L29/7842 ,  H01L22/24 ,  H01L29/665 ,  H01L29/6653

摘要： A method of detecting silicide encroachment to the sidewalls of a gate electrode includes forming silicide at a device, with sidewall spacers defining a desired separation of the silicide from the sidewalls of the gate electrode. After silicide formation, the sidewall spacers are removed and line-of-sight monitoring is performed of the region previously obscured by the sidewall spacers, thereby permitting detection of silicide encroachment.

摘要翻译： 检测硅化物侵入到栅电极的侧壁的方法包括在器件处形成硅化物，其中侧壁间隔物限定硅化物与栅电极的侧壁的期望间隔。 在硅化物形成之后，去除侧壁间隔物，并且对由先前被侧壁间隔物遮蔽的区域进行视线监测，从而允许检测硅化物侵入。

公开(公告)号：US06372668B1

公开(公告)日：2002-04-16

申请号：US09484603

申请日：2000-01-18

申请人： Sey-Ping Sun ,  Homi Nariman ,  Hartmut Ruelke

发明人： Sey-Ping Sun ,  Homi Nariman ,  Hartmut Ruelke

IPC分类号： H01L2131

摘要： The present invention is directed to a method of forming process layers comprised of silicon oxynitride. In one embodiment, the method comprises positioning a wafer in a process chamber, introducing silane and nitrous oxide into the chamber at a flow rate ratio ranging from approximately 2.6-3.8 silane to nitrous oxide, and generating a plasma in the chamber using a high frequency to low frequency power setting ratio ranging from approximately 1.2-1.8.

公开(公告)号：US06251800B1

公开(公告)日：2001-06-26

申请号：US09227513

申请日：1999-01-06

申请人： Sey-Ping Sun ,  Mark I. Gardner ,  Charles E. May

发明人： Sey-Ping Sun ,  Mark I. Gardner ,  Charles E. May

IPC分类号： H01L2131

CPC分类号： H01L21/28185 ,  C23C16/402 ,  H01L21/02164 ,  H01L21/02211 ,  H01L21/02274 ,  H01L21/0228 ,  H01L21/02332 ,  H01L21/02337 ,  H01L21/28194 ,  H01L21/31612

摘要： An ultrathin gate dielectric and a method for forming the same are provided. The gate dielectric is believed to allow enhanced performance of semiconductor devices including transistors and dual-gate memory cells. A low-power, low-pressure plasma-enhanced chemical vapor deposition (PECVD) method employing silane and nitrous oxide sources is used to deposit the dielectric. As compared to conventional PECVD deposition, the method uses lower silane and nitrous oxide flow rates, a more dilute silane in nitrogen mixture, a lower chamber pressure, and a lower radio frequency power density. These settings allow plasma conditions to stabilize so that deposition may be performed in time increments at least as short as 0.1 second, so that oxide thicknesses at least as small as one angstrom may be controllably deposited. The oxide is preferably deposited in portions at multiple substrate mounting positions in a deposition chamber. Combination of oxide portions in this manner is believed to reduce the density of pinholes in the oxide, and the low-power, low-pressure deposition conditions are further believed to reduce plasma damage to the oxide and reduce the density of trap states in the oxide. A rapid thermal anneal of the oxide may be performed after deposition, and may improve the quality of the interface between the oxide and the underlying semiconductor substrate.

摘要翻译： 提供一种超薄栅极电介质及其形成方法。 认为栅极电介质允许包括晶体管和双栅极存储器单元的半导体器件的增强的性能。 使用采用硅烷和一氧化二氮源的低功率，低压等离子体增强化学气相沉积（PECVD）方法沉积电介质。 与传统的PECVD沉积相比，该方法使用较低的硅烷和一氧化二氮流率，氮混合物中更稀的硅烷，较低的室压力和较低的射频功率密度。 这些设置允许等离子体条件稳定，使得可以以至少短至0.1秒的时间增量执行沉积，使得至少小至一埃的氧化物厚度可以可控地沉积。 优选在沉积室中的多个基板安装位置处部分地沉积氧化物。 认为以这种方式组合氧化物部分可以降低氧化物中针孔的密度，并且进一步认为低功率，低压沉积条件可减少对氧化物的等离子体损伤并降低氧化物中陷阱态的密度 。 可以在沉积之后进行氧化物的快速热退火，并且可以提高氧化物和下面的半导体衬底之间的界面的质量。

公开(公告)号：US6140688A

公开(公告)日：2000-10-31

申请号：US157627

申请日：1998-09-21

申请人： Mark I. Gardner ,  Sey-Ping Sun

发明人： Mark I. Gardner ,  Sey-Ping Sun

IPC分类号： H01L21/28 ,  H01L21/336 ,  H01L21/8234 ,  H01L21/8247 ,  H01L27/088 ,  H01L29/76

CPC分类号： H01L27/105 ,  H01L21/28061 ,  H01L21/28273 ,  H01L21/82345 ,  H01L27/088 ,  H01L27/11526 ,  H01L27/11531 ,  H01L27/11543 ,  H01L29/6659 ,  H01L29/66825 ,  H01L27/11529 ,  H01L29/66545

摘要： A semiconductor device is provided and formed using self-aligned metal-containing gates within a metal-oxide semiconductor (MOS) process. After forming junction regions within a semiconductor substrate, the gate conductor, or junction implant alignment structure, is at least partially removed to form a trench within a dielectric formed above the substrate. Upper surfaces of the transistor, except the upper surface of the gate conductor, are thereby protected by the dielectric. A metal-containing material can then be arranged within the trench, i.e., in the region removed of the gate conductor. The metal material can be formed either as a single layer or as multiple metal and/or dielectric layers interposed throughout the as-filled trench. The metal-filled trench formation occurs after high temperature cycles often associated with activating the previously implanted junctions or growing gate dielectrics. Thus, low-temperature metals such as copper or copper alloys can be used.

摘要翻译： 在金属氧化物半导体（MOS）工艺中，使用自对准的含金属栅极提供并形成半导体器件。 在半导体衬底中形成接合区域之后，至少部分去除栅极导体或结植入对准结构，以在衬底上形成的电介质内形成沟槽。 除了栅极导体的上表面之外，晶体管的上表面被电介质保护。 然后可以在沟槽内，即在去除栅极导体的区域中布置含金属的材料。 金属材料可以形成为单层或多个金属和/或介电层插入整个填充的沟槽中。 金属填充的沟槽形成在高温循环之后发生，通常与激活先前注入的结或生长栅极电介质相关联。 因此，可以使用诸如铜或铜合金的低温金属。

公开(公告)号：US6037244A

公开(公告)日：2000-03-14

申请号：US821660

申请日：1997-03-19

申请人： Mark I. Gardner ,  Thomas E. Spikes, Jr. ,  Robert Paiz ,  Frederick N. Hause ,  Sey-Ping Sun

发明人： Mark I. Gardner ,  Thomas E. Spikes, Jr. ,  Robert Paiz ,  Frederick N. Hause ,  Sey-Ping Sun

IPC分类号： H01L21/768 ,  H01L21/28 ,  H01L21/31

CPC分类号： H01L21/76895 ,  H01L21/76807

摘要： A method of forming a semiconductor device by using a pillar to form a contact with an active region of the device. A semiconductor device is formed by forming one or more active regions on a substrate of the semiconductor device and forming a pillar over at least a portion of one of the active regions. An insulating film selective to the pillar is provided over portions of the substrate adjacent the pillar. The pillar is then used to form a conductive contact with the active region over which it is formed. In one embodiment, the pillar is formed from a photoresist, while in other embodiments, the pillar is formed from a conductor material such as a metal. The active region may form a source/drain region or a gate electrode.

摘要翻译： 一种通过使用柱形成与器件的有源区的接触形成半导体器件的方法。 通过在半导体器件的衬底上形成一个或多个有源区并在一个有源区的至少一部分上形成柱来形成半导体器件。 在基板的邻近柱的部分上设置对柱子有选择性的绝缘膜。 然后使用该柱与其形成的有源区形成导电接触。 在一个实施例中，柱由光致抗蚀剂形成，而在其它实施例中，柱由诸如金属的导体材料形成。 有源区可以形成源/漏区或栅电极。

公开(公告)号：US09589803B2

公开(公告)日：2017-03-07

申请号：US13572494

申请日：2012-08-10

申请人： Neng-Kuo Chen ,  Clement Hsingjen Wann ,  Yi-An Lin ,  Chun-Wei Chang ,  Sey-Ping Sun

发明人： Neng-Kuo Chen ,  Clement Hsingjen Wann ,  Yi-An Lin ,  Chun-Wei Chang ,  Sey-Ping Sun

IPC分类号： H01L29/94 ,  H01L21/28 ,  H01L21/3105 ,  H01L29/66 ,  H01L21/8238 ,  H01L29/78 ,  H01L29/165

CPC分类号： H01L29/66545 ,  H01L21/28123 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/32134 ,  H01L21/32135 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823821 ,  H01L29/165 ,  H01L29/6653 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/7848 ,  H01L29/785

摘要： This description relates to a gate electrode of a field effect transistor. An exemplary structure for a field effect transistor includes a substrate; a gate electrode over the substrate including a first top surface and a sidewall; a source/drain (S/D) region at least partially disposed in the substrate on one side of the gate electrode; a spacer on the sidewall distributed between the gate electrode and the S/D region; and a contact etch stop layer (CESL) adjacent to the spacer and further comprising a portion extending over the S/D region, wherein the portion has a second top surface substantially coplanar with the first top surface.

摘要翻译： 该描述涉及场效应晶体管的栅电极。 场效应晶体管的示例性结构包括：衬底; 位于所述基板上方的包括第一顶表面和侧壁的栅电极; 至少部分地设置在所述栅电极的一侧的所述衬底中的源极/漏极（S / D）区域; 在所述侧壁上的间隔物分布在所述栅电极和所述S / D区之间; 以及与所述间隔物相邻的接触蚀刻停止层（CESL），并且还包括在所述S / D区域上延伸的部分，其中所述部分具有与所述第一顶表面基本上共面的第二顶表面。

公开(公告)号：US08003459B2

公开(公告)日：2011-08-23

申请号：US12691477

申请日：2010-01-21

申请人： David E. Brown ,  Hans Van Meer ,  Sey-Ping Sun

发明人： David E. Brown ,  Hans Van Meer ,  Sey-Ping Sun

IPC分类号： H01L21/8238

CPC分类号： H01L29/0684 ,  H01L21/84 ,  H01L27/1203

摘要： A method for forming different active thicknesses on the same silicon layer includes masking the silicon layer and exposing selected regions of the silicon layer. The thickness of the silicon layer at the exposed regions is changed, either by adding silicon or subtracting silicon from the layer at the exposed regions. Once the mask is removed, the silicon layer has regions of different active thicknesses, respectively suitable for use in different types of devices, such as diodes and transistors.

摘要翻译： 在同一硅层上形成不同有源厚度的方法包括掩蔽硅层并暴露硅层的选定区域。 通过在曝光区域从层中添加硅或从中减去硅来改变暴露区域处的硅层的厚度。 一旦去除掩模，硅层就具有不同有源厚度的区域，分别适用于不同类型的器件，例如二极管和晶体管。

公开(公告)号：US20080173942A1

公开(公告)日：2008-07-24

申请号：US11625431

申请日：2007-01-22

申请人： Huilong Zhu ,  Siddhartha Panda ,  Jay W. Strane ,  Sey-Ping Sun ,  Brian L. Tessier

发明人： Huilong Zhu ,  Siddhartha Panda ,  Jay W. Strane ,  Sey-Ping Sun ,  Brian L. Tessier

IPC分类号： H01L29/786 ,  H01L21/336

CPC分类号： H01L29/785 ,  H01L29/66795

摘要： A stressed semiconductor structure including at least one FinFET device on a surface of a substrate, typically a buried insulating layer of an initial semiconductor-on-insulator substrate, is provided. In a preferred embodiment, the at least one FinFET device includes a semiconductor Fin that is located on an unetched portion of the buried insulator layer which has a raised height as compared to an adjacent and adjoining etched portion of the buried insulating layer. The semiconductor Fin includes a gate dielectric on its sidewalls and optionally a hard mask located on an upper surface thereof. The inventive structure also includes a gate conductor, which is located on the surface of the substrate, typically the buried insulating layer, and the gate conductor is at least laterally adjacent to the gate dielectric located on the sidewalls of the semiconductor Fin. A stressed silicide is located on the gate conductor, which introduces stress into the channel of the FinFET device. The stressed silicide memorizes the stress from a sacrificial stressed film that is formed prior to forming the stressed silicide. The stress type of the stressed film is introduced into the silicide during a silicide anneal step.

摘要翻译： 提供了一种应力半导体结构，其包括在衬底的表面上的至少一个FinFET器件，通常是初始绝缘体上半导体衬底的掩埋绝缘层。 在优选实施例中，所述至少一个FinFET器件包括位于所述掩埋绝缘体层的未蚀刻部分上的半导体Fin，所述半导体Fin与所述掩埋绝缘层的相邻和相邻蚀刻部分相比具有升高的高度。 半导体鳍包括其侧壁上的栅极电介质和任选地位于其上表面上的硬掩模。 本发明的结构还包括栅极导体，其位于衬底的表面上，通常为掩埋绝缘层，并且栅极导体至少横向邻近位于半导体Fin的侧壁上的栅极电介质。 应力硅化物位于栅极导体上，其将应力引入FinFET器件的沟道中。 应力硅化物记忆在形成应力硅化物之前形成的牺牲应力膜的应力。 在硅化物退火步骤期间，将应力膜的应力类型引入到硅化物中。