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公开(公告)号:US10534554B2
公开(公告)日:2020-01-14
申请号:US15784025
申请日:2017-10-13
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Vipin Tiwari , Nhan Do
IPC: G06F3/06 , G06F11/07 , G11C16/04 , G11C16/08 , G11C16/10 , G11C16/26 , G11C16/34 , H01L21/78 , H01L27/11521 , H01L29/423 , H01L23/00
Abstract: Apparatus, and an associated method, for enhancing security and preventing hacking of a flash memory device. The apparatus and method use a random number to offset the read or write address in a memory cell. The random number is generated by determining the leakage current of memory cells. In another embodiment, random data can be written or read in parallel to thwart hackers from determining contents of data being written or read by monitoring sense amplifiers.
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32.
公开(公告)号:US20190341110A1
公开(公告)日:2019-11-07
申请号:US16042972
申请日:2018-07-23
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Thuan Vu , Staniey Hong , Anh Ly , Vlpln Tlwarl , Nhan Do
IPC: G11C16/04 , G06N3/08 , H01L29/788 , H01L27/11521
Abstract: Numerous embodiments are disclosed for a high voltage generation algorithm and system for generating high voltages necessary for a particular programming operation in analog neural memory used in a deep learning artificial neural network. Different calibration algorithms and systems are also disclosed. Optionally, compensation measures can be utilized that compensate for changes in voltage or current as the number of cells being programmed changes.
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33.
公开(公告)号:US10460811B2
公开(公告)日:2019-10-29
申请号:US16387377
申请日:2019-04-17
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Vipin Tiwari , Nhan Do
Abstract: A memory device and method of erasing same that includes a substrate of semiconductor material and a plurality of memory cells formed on the substrate and arranged in an array of rows and columns. Each of the memory cells includes spaced apart source and drain regions in the substrate, with a channel region in the substrate extending there between, a floating gate disposed over and insulated from a first portion of the channel region which is adjacent the source region, a select gate disposed over and insulated from a second portion of the channel region which is adjacent the drain region, and a program-erase gate disposed over and insulated from the source region. The program-erase gate lines alone or in combination with the select gate lines, or the source lines, are arranged in the column direction so that each memory cell can be individually programmed, read and erased.
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34.
公开(公告)号:US20190206486A1
公开(公告)日:2019-07-04
申请号:US16213860
申请日:2018-12-07
Applicant: Silicon Storage Technology, Inc.
Inventor: Vipin Tiwari , Hieu Van Tran , Nhan Do
IPC: G11C11/56
CPC classification number: G11C11/5642 , G11C2211/5641
Abstract: A memory device includes memory cells each configured to produce an output current during a read operation. Circuitry is configured to, for each of the memory cells, generate a read value based on the output current of the memory cell. Circuitry is configured to, for each of the memory cells, multiply the read value for the memory cell by a multiplier to generate a multiplied read value, wherein the multiplier for each of the memory cells is different from the multipliers for any others of the memory cells. Circuitry is configured to sum the multiplied read values. The read values can be electrical currents, electrical voltages or numerical values. Alternatively, added constant values can be used instead of multipliers. The multipliers or constants can be applied to read currents from individual cells, or read currents on entire bit lines.
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35.
公开(公告)号:US10340010B2
公开(公告)日:2019-07-02
申请号:US15238681
申请日:2016-08-16
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu , Vipin Tiwari , Nhan Do
IPC: G11C16/10 , G11C16/08 , G11C16/14 , G11C16/24 , G11C16/34 , G11C16/26 , G11C16/04 , G11C16/28 , G11C16/32
Abstract: In one embodiment of the present invention, one row is selected and two columns are selected for a read or programming operation, such that twice as many flash memory cells can be read from or programmed in a single operation compared to the prior art. In another embodiment of the present invention, two rows in different sectors are selected and one column is selected for a read operation, such that twice as many flash memory cells can be read in a single operation compared to the prior art.
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公开(公告)号:US20190172543A1
公开(公告)日:2019-06-06
申请号:US16271673
申请日:2019-02-08
Inventor: Xinjie Guo , Farnood Merrikh Bayat , Dmitri Strukov , Nhan Do , Hieu Van Tran , Vipin Tiwari
IPC: G11C16/34 , H01L27/11524 , H01L29/788 , G11C16/04 , G11C8/14 , H01L27/11521 , G11C16/26 , G11C16/14 , G11C16/10 , H01L27/11558 , G11C7/18
CPC classification number: G11C16/3431 , G11C7/18 , G11C8/14 , G11C16/0483 , G11C16/10 , G11C16/14 , G11C16/26 , G11C16/3427 , H01L27/11521 , H01L27/11524 , H01L27/11558 , H01L29/7881
Abstract: A memory device that provides individual memory cell read, write and erase. In an array of memory cells arranged in rows and columns, each column of memory cells includes a column bit line, a first column control gate line for even row cells and a second column control gate line for odd row cells. Each row of memory cells includes a row source line. In another embodiment, each column of memory cells includes a column bit line and a column source line. Each row of memory cells includes a row control gate line. In yet another embodiment, each column of memory cells includes a column bit line and a column erase gate line. Each row of memory cells includes a row source line, a row control gate line, and a row select gate line.
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37.
公开(公告)号:US20190088329A1
公开(公告)日:2019-03-21
申请号:US16107282
申请日:2018-08-21
Applicant: Silicon Storage Technology, Inc
Inventor: Vipin Tiwari , Nhan Do
IPC: G11C16/04 , H01L27/11521 , G06N3/06
Abstract: A memory array with memory cells arranged in rows and columns. Each memory cell includes source and drain regions with a channel region there between, a floating gate disposed over a first channel region portion, and a second gate disposed over a second channel region portion. A plurality of bit lines each extends along one of the columns and is electrically connected to the drain regions of a first group of one or more of the memory cells in the column and is electrically isolated from the drain regions of a second group of one or more of the memory cells in the column. A plurality of source lines each is electrically connected to the source regions memory cells in one of the columns or rows. A plurality of gate lines each is electrically connected to the second gates of memory cells in one of the columns or rows.
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38.
公开(公告)号:US10217850B2
公开(公告)日:2019-02-26
申请号:US15474879
申请日:2017-03-30
Applicant: Silicon Storage Technology, Inc.
Inventor: Feng Zhou , Xian Liu , Chien-Sheng Su , Nhan Do , Chunming Wang
IPC: H01L29/66 , H01L29/788 , H01L27/07 , H01L29/08 , H01L29/423 , H01L21/28
Abstract: A simplified method for forming pairs of non-volatile memory cells using two polysilicon depositions. A first polysilicon layer is formed on and insulated from the semiconductor substrate in a first polysilicon deposition process. A pair of spaced apart insulation blocks are formed on the first polysilicon layer. Exposed portions of the first poly silicon layer are removed while maintaining a pair of polysilicon blocks of the first polysilicon layer each disposed under one of the pair of insulation blocks. A second polysilicon layer is formed over the substrate and the pair of insulation blocks in a second polysilicon deposition process. Portions of the second polysilicon layer are removed while maintaining a first polysilicon block (disposed between the pair of insulation blocks), a second polysilicon block (disposed adjacent an outer side of one insulation block), and a third polysilicon block (disposed adjacent an outer side of the other insulation block).
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公开(公告)号:US20180268912A1
公开(公告)日:2018-09-20
申请号:US15987735
申请日:2018-05-23
Inventor: Xinjie Guo , Farnood Merrikh Bayat , Dmitri Strukov , Nhan Do , Hieu Van Tran , Vipin Tiwari
IPC: G11C16/34 , H01L27/11558 , H01L27/11521 , G11C16/26 , G11C16/10 , G11C16/14
CPC classification number: G11C16/3431 , G11C7/18 , G11C8/14 , G11C16/0483 , G11C16/10 , G11C16/14 , G11C16/26 , G11C16/3427 , H01L27/11521 , H01L27/11524 , H01L27/11558 , H01L29/7881
Abstract: A memory device that provides individual memory cell read, write and erase. In an array of memory cells arranged in rows and columns, each column of memory cells includes a column bit line, a first column control gate line for even row cells and a second column control gate line for odd row cells. Each row of memory cells includes a row source line. In another embodiment, each column of memory cells includes a column bit line and a column source line. Each row of memory cells includes a row control gate line. In yet another embodiment, each column of memory cells includes a column bit line and a column erase gate line. Each row of memory cells includes a row source line, a row control gate line, and a row select gate line.
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公开(公告)号:US20180145253A1
公开(公告)日:2018-05-24
申请号:US15727776
申请日:2017-10-09
Applicant: Silicon Storage Technology, Inc.
Inventor: Feng Zhou , Xian Liu , Steven Lemke , Santosh Hariharan , Hieu Van Tran , Nhan Do
IPC: H01L45/00
CPC classification number: H01L45/1608 , H01L45/04 , H01L45/1233 , H01L45/1253 , H01L45/146 , H01L45/16 , H01L45/1675
Abstract: A method of forming a memory device includes forming a first layer of conductive material having opposing upper and lower surfaces, forming a layer of amorphous silicon on the upper surface of the first layer of conductive material, stripping away the layer of amorphous silicon, wherein some of the amorphous silicon remains in the upper surface of the first layer of conductive material, forming a layer of transition metal oxide material on the upper surface of the first layer of conductive material, and forming a second layer of conductive material on the layer of transition metal oxide material. The method smoothes the upper surface of the bottom electrode, and also provides an bottom electrode upper surface with stable material that is hard to oxidize.
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