公开(公告)号：US07531895B2

公开(公告)日：2009-05-12

申请号：US11552803

申请日：2006-10-25

申请人： Bernhard Lange ,  William David Boyd

发明人： Bernhard Lange ,  William David Boyd

IPC分类号： H01L23/49 ,  H01L23/495

CPC分类号： H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.

摘要翻译： 一种包括引线框架的集成电路（IC）封装。 引线框架具有欠压部分和引线。 凹陷部分具有被配置为远离安装板的外表面和被配置为面向安装板的内表面。 引线从外表面弯曲，并且每个引线具有联接到IC的第一端和被配置为穿过延伸穿过安装板的多个安装孔中的一个的第二端。 IC耦合到内表面。

公开(公告)号：US20070034993A1

公开(公告)日：2007-02-15

申请号：US11204645

申请日：2005-08-15

申请人： Bernhard Lange

发明人： Bernhard Lange

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/49548 ,  H01L23/645 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device comprising a semiconductor chip (110) having a side edge (111) and a plurality of metal bond pads (120, 121) near the edge; the pads are aligned to form rows (130, 131) parallel to the edge. The device further includes a leadframe (100) having leads (140 . . . ) oriented with one end (140a . . . ) towards the chip edge and spaced from it by a gap (150); the chip is attached to the leadframe. Ends of selected leads are connected by a metal cross bar (160) parallel to the chip edge. Substantially parallel bond wires (170) are crossing the gap to connect each chip pad either to the crossbar or to a non-selected lead end. In a preferred lead arrangement, the selected leads alternate with non-selected leads.

摘要翻译： 一种装置，包括具有侧边缘（111）和靠近边缘的多个金属接合焊盘（120,121）的半导体芯片（110） 衬垫对齐以形成平行于边缘的行（130,131）。 所述装置还包括引线框架（100），所述引线框架（100）具有朝向所述芯片边缘并且由间隙（150）与所述引线框架（100）间隔开的引线（140 ...）。 芯片连接到引线框。 所选导线的端部通过平行于芯片边缘的金属横杆（160）连接。 基本上平行的接合线（170）正在穿过间隙，以将每个芯片焊盘连接到横杆或未选择的引线端。 在优选的引线装置中，所选择的引线与未选择的引线交替。

公开(公告)号：US20060211175A1

公开(公告)日：2006-09-21

申请号：US11439609

申请日：2006-05-24

申请人： Bernhard Lange

发明人： Bernhard Lange

IPC分类号： H01L21/00

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package comprising a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die. The package further comprises a thermally-conductive material abutting the die and a heatsink abutting the thermally-conductive material, said heatsink facing a direction opposite from the lead frame die pad.