公开(公告)号：US09199578B2

公开(公告)日：2015-12-01

申请号：US14006800

申请日：2012-03-23

申请人： Takashi Nagao ,  Hiroyuki Mori ,  Zhengtai Yu

发明人： Takashi Nagao ,  Hiroyuki Mori ,  Zhengtai Yu

IPC分类号： B60R5/04

CPC分类号： B60R5/047

摘要： A tonneau cover device moves a tonneau cover, which is coupled to a hatchback door of a vehicle, between an extension position and a storage position. The tonneau cover device includes a detection unit and a controller. The detection unit detects whether a pre-operation for opening the hatchback door has been performed. The controller permits movement of the tonneau cover to the extension position when a courtesy switch, which is arranged in the vehicle, detects that the hatchback door is closed and the detection unit does not detect that the pre-operation has been performed. The controller restricts movement of the tonneau cover to the extension position when the courtesy switch detects that the hatchback door is closed and the detection unit detects that the pre-operation has been performed.

摘要翻译： 吨位盖装置移动在延伸位置和储存位置之间联接到车辆的两厢门的吨位盖。 该吨位覆盖装置包括检测单元和控制器。 检测单元检测是否执行了用于打开两厢门的预操作。 当布置在车辆中的礼貌开关检测到两厢车门关闭并且检测单元没有检测到已经执行了预操作时，控制器允许吨位盖移动到延伸位置。 当礼宾开关检测到掀背门关闭并且检测单元检测到已经执行了预操作时，控制器限制吨位盖的移动到延伸位置。

公开(公告)号：US09061633B2

公开(公告)日：2015-06-23

申请号：US14004026

申请日：2012-03-23

申请人： Takashi Nagao ,  Hiroyuki Mori

发明人： Takashi Nagao ,  Hiroyuki Mori

IPC分类号： B60R5/04

CPC分类号： B60R5/04 ,  B60R5/047

摘要： A tonneau cover device includes a tonneau cover attached to a hatchback door. A movable guide is arranged on the tonneau cover and is guided by a fixed guide, which is arranged in a vehicle. The tonneau cover moves to an extension position when the hatchback door closes and a storage position when the hatchback door opens. A detector detects whether movement of the tonneau cover is obstructed due to contact with an object. A controller moves the tonneau cover to where the movable guide can come into contact with the fixed guide in a state in which the hatchback door is open when the detector detects that the movement of the tonneau cover to the storage position has been obstructed.

摘要翻译： 一种吨位盖装置包括附接到两厢门的吨罩。 可动引导件设置在吨位盖上，并由布置在车辆中的固定引导件引导。 当两厢车门关闭时，吨位盖移动到延伸位置，当两厢车门打开时，该舱盖移动到延伸位置。 检测器检测到由于与物体的接触而阻碍了吨位盖的移动。 当检测器检测到该吨位盖的运动已经被阻挡时，控制器将舷窗盖移动到可动引导件可以在两舷门打开的状态下与固定引导件接触的位置。

公开(公告)号：US08681881B2

公开(公告)日：2014-03-25

申请号：US13134022

申请日：2011-05-26

申请人： Kazuhisa Ishimaru ,  Hiroyuki Mori ,  Tomohisa Kishigami

发明人： Kazuhisa Ishimaru ,  Hiroyuki Mori ,  Tomohisa Kishigami

IPC分类号： H04B3/00

CPC分类号： H04L25/0278 ,  H04L25/028

摘要： The communication signal generating device is for use in a communication system where communication signals each of which is set at a first level or a second level are exchanged among a plurality of communication apparatuses through a communication line. The communication signal generating device includes a switching element provided in a communication line to connect the communication line to a ground or a constant voltage source, and a driving means to generate a first communication signal at the first level by turning on the switching element to thereby pass a certain current to the communication line, and generate a second communication signal at the second level by turning off the switching element to thereby pass no current to the communication line. The driving means is configured to gradually increase an output impedance of the switching element during one bit time of the first communication signal.

摘要翻译： 通信信号生成装置用于通信系统，其中通过通信线路在多个通信装置之间交换通信信号，其中每个通信信号被设置在第一电平或第二电平。 通信信号发生装置包括：设置在通信线路中的开关元件，用于将通信线路连接到地或恒压源;以及驱动装置，用于通过接通开关元件来产生第一电平的第一通信信号，从而 通过一定的电流到通信线路，并且通过关断开关元件而产生第二电平的第二通信信号，从而不通过通信线路的电流。 驱动装置被配置为在第一通信信号的一个比特时间期间逐渐增加开关元件的输出阻抗。

公开(公告)号：US08674710B2

公开(公告)日：2014-03-18

申请号：US13306168

申请日：2011-11-29

申请人： Masayoshi Satake ,  Hiroyuki Mori ,  Kouji Ootaka ,  Hajime Nakagawa ,  Toshihiro Hattori ,  Noboru Maeda

发明人： Masayoshi Satake ,  Hiroyuki Mori ,  Kouji Ootaka ,  Hajime Nakagawa ,  Toshihiro Hattori ,  Noboru Maeda

IPC分类号： G01R27/26

CPC分类号： B60N2/002

摘要： A capacitive occupant detection apparatus comprising a sensor unit and a control unit is disclosed. The sensor unit includes a detection electrode and a periphery guard electrode. The control unit includes: a signal application circuit for applying an oscillation signal to the detection electrode; an operational amplifier for applying to the guard electrode a signal having the same phase and potential as the oscillation signal applied to the detection electrode; and a control circuit for receiving current and voltage values supplied to the detection and for determining a mounting state on a seat based on the inputted current and voltage values (including phase information). The periphery guard electrode is located to surround the detection electrode when viewed from an upper side of the detection electrode.

摘要翻译： 公开了一种包括传感器单元和控制单元的电容乘员检测装置。 传感器单元包括检测电极和外围保护电极。 控制单元包括：信号施加电路，用于向检测电极施加振荡信号; 运算放大器，用于向保护电极施加与施加到检测电极的振荡信号具有相同相位和电位的信号; 以及控制电路，用于基于输入的电流和电压值（包括相位信息）接收提供给检测的电流和电压值，以及用于确定座椅上的安装状态。 当从检测电极的上侧观察时，外围保护电极被定位成围绕检测电极。

公开(公告)号：US20140038868A1

公开(公告)日：2014-02-06

申请号：US14110782

申请日：2012-04-12

申请人： Hiroyuki Mori ,  Munehisa Matsui ,  Keiji Hayashi ,  Yoshio Fuwa ,  Takatoshi Shinyoshi ,  Satoshi Jinno ,  Kenji Shimoda ,  Satoshi Hirota ,  Koichiro Akari ,  Hirotaka Ito

发明人： Hiroyuki Mori ,  Munehisa Matsui ,  Keiji Hayashi ,  Yoshio Fuwa ,  Takatoshi Shinyoshi ,  Satoshi Jinno ,  Kenji Shimoda ,  Satoshi Hirota ,  Koichiro Akari ,  Hirotaka Ito

IPC分类号： F16N1/00 ,  C10M135/32

CPC分类号： F16N1/00 ,  C10M135/32 ,  C23C14/0635 ,  C23C14/3492 ,  C23C14/352 ,  C23C14/505 ,  C23C28/042 ,  C23C28/044 ,  C23C28/42 ,  F02F3/10 ,  Y10T428/265 ,  Y10T428/31678

摘要： A sliding member includes: a substrate which has a sliding surface sliding under the presence of lubricating oil; and a film which is fixed to at least a part of the sliding surface. The film contains carbon (C), titanium (Ti), and boron (B), is obtained by repeatedly and alternately layering a first layer containing amorphous carbon as a principal component and a second layer containing C and Ti as principal components, and has hardness of 18 GPa or more.

摘要翻译： 滑动构件包括：在润滑油的存在下滑动表面滑动的基板; 以及固定在滑动面的至少一部分上的膜。 通过重复交替层叠含有无定形碳作为主要成分的第一层和含有C和Ti作为主要成分的第二层而获得含有碳（C），钛（Ti）和硼（B）的膜，并且具有 硬度18GPa以上。

公开(公告)号：US20130341950A1

公开(公告)日：2013-12-26

申请号：US14004026

申请日：2012-03-23

申请人： Takashi Nagao ,  Hiroyuki Mori

发明人： Takashi Nagao ,  Hiroyuki Mori

IPC分类号： B60R5/04

CPC分类号： B60R5/04 ,  B60R5/047

摘要： A tonneau cover device includes a tonneau cover attached to a hatchback door. A movable guide is arranged on the tonneau cover and is guided by a fixed guide, which is arranged in a vehicle. The tonneau cover moves to an extension position when the hatchback door closes and a storage position when the hatchback door opens. A detector detects whether movement of the tonneau cover is obstructed due to contact with an object. A controller moves the tonneau cover to where the movable guide can come into contact with the fixed guide in a state in which the hatchback door is open when the detector detects that the movement of the tonneau cover to the storage position has been obstructed.

摘要翻译： 一种吨位盖装置包括附接到两厢门的吨罩。 可动引导件设置在吨位盖上，并由布置在车辆中的固定引导件引导。 当两厢车门关闭时，吨位盖移动到延伸位置，当两厢车门打开时，该舱盖移动到延伸位置。 检测器检测到由于与物体的接触而阻碍了吨位盖的移动。 当检测器检测到该吨位盖的运动已经被阻挡时，控制器将舷窗盖移动到可动引导件可以在两舷门打开的状态下与固定引导件接触的位置。

公开(公告)号：US08421803B2

公开(公告)日：2013-04-16

申请号：US12692012

申请日：2010-01-22

申请人： Kazuto Kojitani ,  Keiji Otaka ,  Hiroyuki Mori

发明人： Kazuto Kojitani ,  Keiji Otaka ,  Hiroyuki Mori

IPC分类号： G06T11/20

CPC分类号： H05K13/083 ,  H05K13/0815

摘要： This invention facilitates monitoring operation for checking whether or not quality of a substrate deteriorates as well as operation for identifying a cause of deterioration in quality. Identification information of constituent elements related to measurement target sections (pads) on a component-mounted substrate is arranged into hierarchal structure data. A first axis is arranged with the measurement target sections associated with this arrangement. A second axis is arranged with information (identification information of lots and squeegees) representing production conditions of the substrates according to an order of the substrates being processed. A two-dimensional area defined by the first axis and the second axis is set. A color map is generated, in which measured data of the measurement target sections on the substrates are arranged in colors at corresponding positions within the two-dimensional area. Specifically, in the respective measured data, values in a preferable range is displayed in white, values larger than the preferable range is displayed in red-like color, and values smaller than the preferable range is displayed in blue-like color.

摘要翻译： 本发明便于检查基板的质量劣化以及用于确定质量劣化的原因的操作的监视操作。 与组件安装基板上的测量目标部分（焊盘）相关的构成元件的识别信息被布置成层次结构数据。 第一轴被布置成与测量目标部分相关联。 第二轴被布置有根据正在处理的基板的顺序的表示基板的生产条件的信息（批次和刮板的识别信息）。 设置由第一轴和第二轴限定的二维区域。 产生颜色图，其中基板上的测量目标部分的测量数据在二维区域内的对应位置处以颜色排列。 具体地，在各测量数据中，优​​选范围中的值以白色显示，大于优选范围的值以红色显示，并且小于优选范围的值以蓝色显示。

公开(公告)号：US08373276B2

公开(公告)日：2013-02-12

申请号：US13365616

申请日：2012-02-03

申请人： Hiroyuki Mori ,  Kazushige Kawasaki

发明人： Hiroyuki Mori ,  Kazushige Kawasaki

IPC分类号： H01L23/528

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/16 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/205 ,  H05K3/421 ,  H05K3/4682 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/0574 ,  Y10T29/49124 ,  Y10T29/49162 ,  H01L2924/00012 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2224/05671

摘要： Embodiments of the present invention provide a printed wiring board in which solder bumps of a mounted semiconductor chip are less prone to be ruptured. The printed wiring board includes a dielectric layer having a main surface and a connecting pad embedded in the dielectric layer. The connecting pad is shaped like a brimmed hat. That is, the connecting pad includes a plate portion whose diameter is larger than that of a contact portion. The main surface of the contact portion is exposed at the main surface of the dielectric layer. Diameter of the contact portion is substantially the same as diameter of an under bump metal at the semiconductor chip side, when mechanical stress is applied, the stress disperses evenly to both of the connecting pad and the under bump metal, and thus rupture is less prone to occur.

摘要翻译： 本发明的实施例提供了一种印刷线路板，其中安装的半导体芯片的焊料凸块不容易破裂。 印刷电路板包括具有主表面的电介质层和嵌入电介质层中的连接焊盘。 连接垫的形状像一顶帽子。 也就是说，连接焊盘包括其直径大于接触部分的直径的板部分。 接触部分的主表面在电介质层的主表面露出。 接触部的直径与半导体芯片侧的凸块状金属的直径基本相同，当施加机械应力时，应力均匀地分散到连接焊盘和下凸块金属两者上，因此破裂不容易 发生。

公开(公告)号：US08309297B2

公开(公告)日：2012-11-13

申请号：US11868328

申请日：2007-10-05

申请人： Yoshiki Hishiro ,  Scott Sills ,  Hiroyuki Mori ,  Troy Gugel ,  Paul D. Shirley ,  Lijing Gou ,  Adam Olson

发明人： Yoshiki Hishiro ,  Scott Sills ,  Hiroyuki Mori ,  Troy Gugel ,  Paul D. Shirley ,  Lijing Gou ,  Adam Olson

IPC分类号： G03F7/22

CPC分类号： G03F7/2022 ,  G03F7/203

摘要： A method of lithographically patterning a substrate that has photoresist having removal areas and non-removal areas includes first exposing at least the non-removal areas to radiation effective to increase outer surface roughness of the photoresist in the non-removal areas at least post-develop but ineffective to change photoresist solubility in a developer for the photoresist to be cleared from the non-removal areas upon develop with the developer. Second exposing of radiation to the removal areas is conducted to be effective to change photoresist solubility in the developer for the photoresist to be cleared from the removal areas upon develop with the developer. The photoresist is developed with the developer effective to clear photoresist from the removal areas and to leave photoresist in the non-removal areas that has outer surface roughness in the non-removal areas which is greater than that before the first exposing. Other implementations and embodiments are contemplated.

摘要翻译： 光刻图案化具有去除区域和非去除区域的光致抗蚀剂的基板的方法包括首先将至少不去除区域暴露于有效地增加非去除区域中的光致抗蚀剂的外表面粗糙度至少后显影 但是在用显影剂显影时，光致抗蚀剂的显影剂中的光致抗蚀剂溶解度无法改变，以从非去除区域中清除。 进行辐射到去除区域的第二次曝光是有效的，以改变光致抗蚀剂在显影剂中的溶解度，以使光致抗蚀剂在用显影剂显影时从除去区域中清除。 用显影剂显影光致抗蚀剂有效地从去除区域清除光致抗蚀剂，并且在非去除区域中留下光致抗蚀剂，其在非去除区域中的外表面粗糙度大于第一次曝光之前的表面粗糙度。 预期其他实现和实施例。

公开(公告)号：US08209856B2

公开(公告)日：2012-07-03

申请号：US12573395

申请日：2009-10-05

申请人： Hiroyuki Mori ,  Kazushige Kawasaki

发明人： Hiroyuki Mori ,  Kazushige Kawasaki

IPC分类号： H05K3/00

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/16 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/205 ,  H05K3/421 ,  H05K3/4682 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/0574 ,  Y10T29/49124 ,  Y10T29/49162 ,  H01L2924/00012 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2224/05671

摘要： Embodiments of the present invention provide a printed wiring board in which solder bumps of a mounted semiconductor chip are less prone to be ruptured. The printed wiring board includes a coreless substrate which includes: a dielectric layer having a main surface and a connecting pad embedded in the dielectric layer. The connecting pad is shaped like a brimmed hat. That is, the connecting pad includes a plate portion whose diameter φ1 is about 95 μm and a contact portion whose diameter φc is about 75 μm. The main surface of the contact portion is exposed at the main surface of the dielectric layer. Since diameter φc of the contact portion is substantially the same as diameter φ2 of an under bump metal at the semiconductor chip side, even if mechanical stress is applied in a direction in which the semiconductor chip is peeled off from the coreless substrate, the stress disperses evenly to both of the connecting pad and the under bump metal, and thus rupture is less prone to occur.

摘要翻译： 本发明的实施例提供了一种印刷线路板，其中安装的半导体芯片的焊料凸块不容易破裂。 印刷电路板包括无芯基板，其包括：具有主表面的电介质层和嵌入在电介质层中的连接焊盘。 连接垫的形状像一顶帽子。 也就是说，连接焊盘包括直径为约95μm的板部分和直径为约75μm的接触部分。 接触部分的主表面在电介质层的主表面露出。 由于接触部的直径＆phcc与半导体芯片侧的凸块下部的直径＆lt; 2＆gt; 2相同，所以即使在半导体芯片从无芯基板剥离的方向上施加机械应力 ，应力均匀地分散到连接焊盘和下凸块金属两者上，因此不容易发生破裂。