摘要:
In the manufacture of a semiconductor device having a high-performance and high-reliability, a silicon nitride film 17 for self alignment, which film is formed to cover the gate electrode of a MISFET, is formed at a substrate temperature of 400° C. or greater by plasma CVD using a raw material gas including monosilane and nitrogen. A silicon nitride film 44 constituting a passivation film is formed at a substrate temperature of about 350° C. by plasma CVD using a raw material gas including monosilane, ammonia and nitrogen. The hydrogen content contained in the silicon nitride film 17 is smaller than that contained in the silicon nitride film 44, making it possible to suppress hydrogen release from the silicon nitride film 17.
摘要:
In the manufacture of a semiconductor device having a high-performance and high-reliability, a silicon nitride film 17 for self alignment, which film is formed to cover the gate electrode of a MISFET, is formed at a substrate temperature of 400° C. or greater by plasma CVD using a raw material gas including monosilane and nitrogen. A silicon nitride film 44 constituting a passivation film is formed at a substrate temperature of about 350° C. by plasma CVD using a raw material gas including monosilane, ammonia and nitrogen. The hydrogen content contained in the silicon nitride film 17 is smaller than that contained in the silicon nitride film 44, making it possible to suppress hydrogen release from the silicon nitride film 17.
摘要:
Provided are a semiconductor device comprising a semiconductor substrate, a first insulating film formed thereover, interconnects formed over the first insulating film and having copper as a main component, a second insulating film formed over the upper surface and side surfaces of each of the interconnects and over the first insulating film and having a function of suppressing or preventing copper diffusion, and a third insulating film formed over the second insulating film and having a dielectric constant lower than that of the second insulating film; and a method of manufacturing the semiconductor device. This invention makes it possible to improve dielectric breakdown strength between copper interconnects and reduce capacitance between the copper interconnects.
摘要:
It is desirable to prevent breakage and separation of wiring of a semiconductor integrated circuit device, such as a bit-line of a DRAM. To accomplish this, a high density plasma silicon oxide film is deposited on a bit-line that is connected to the source and drain region of a memory cell selection MISFET of a DRAM memory cell by means of a high density plasma CVD technique, and the structure is subjected to RTA (heat treatment) at 750° C. The surface is polished, and then a capacitor, to be connected to the other of the source and drain region of the memory cell selection MISFET, is formed. As a result, even when a tantalum oxide film, that serves as a capacitance insulating film of the capacitor, is subjected to heat treatment, the film stress exerted on the bit-line is reduced, and breakage and separation of the bit-line are prevented.
摘要:
A two-way CATV system having a substantial number of terminals incorporates a central processor and transmitter system which continually interrogates the terminals at high speed, monitoring changes of usage of premium programs and other data while also permitting central control of access to restricted premium programs. For inexpensive but reliable intercommunication, short, fixed word length digital messages are frequency multiplexed onto the cable in both upstream and downstream directions, and subscriber groups are controllably selected in turn, with each subscriber being scanned in what may be an arbitrary order by transmission of unique private messages which are recognized at the terminal and in response to which previously prepared fixed length messages are immediately transmitted in return. By employing both upstream and downstream messages which are initiated by a series of synchronizing bits and non-ambiguously related subsequent data sequences, and by the provision of means to initiate both downstream and upstream messages of short length without delay, rapid but reliable data interchange is effected despite differences in transmission and response times with different subscribers. Concurrently, terminal status and various special conditions including security alarms are remotely processed at each terminal, and short upstream messages are assembled containing priority selected data to be transmitted in response to an interrogation. The system incorporates additional means for monitoring power status, program selection and authorization and other operating conditions at each terminal effectively to provide accurate and reliable accounting information while preventing unauthorized or improper usage of restricted premium programs.
摘要:
A device for massaging the sole of foot comprises a plurality of rows of projection rollers having projections extending in substantially radial directions of the respective rollers. The positions of the rollers and the lengths of the projections are so determined that a surface connecting the uppermost points of the projections is raised at the central portion thereof. Such arrangement of the rollers renders the projections as a whole into conformity with the soles of feet, particularly to the arches of feet. One may place both feet on the device and move the feet back and forth in a direction perpendicular to the rows to conduct press massaging on the soles of feet.
摘要:
In a CATV system, a received signal band containing video channels and a data signal at a selected frequency is successively converted in frequency so as to provide a chosen video signal at the frequency of a selected channel. After the first conversion a residual fundamental of the data signal carrier is bandpass filtered, amplified and then demodulated to extract the data signal. The needed filtering and signal processing can thereby be more economically accomplished without adverse effects on adjacent video signal channels.
摘要:
A center-channel protector for a vehicle sash door is arranged between a main sash and a center channel. A body of the protector has an H-shaped upper-end surface which is compatible to cover the upper end of the center channel. The body integrally includes a pair of branch covering portions corresponding to a pair of branch portions constituting the center channel and a middle covering portion disposed between the branch covering portions so as to connect the both branch covering portions therewith. An engaging portion is provided with the body and is mechanically engaged, in a direction intersecting a vertical direction, with an engaged portion which is provided with a center channel side. In collaboration with the engaged portion, the engaging portion constitutes a fastening mechanism by which the protector is fastened on the center channel.
摘要:
A center-channel protector for a vehicle sash door is arranged between a main sash and a center channel. A body of the protector has an H-shaped upper-end surface which is compatible to cover the upper end of the center channel. The body integrally includes a pair of branch covering portions corresponding to a pair of branch portions constituting the center channel and a middle covering portion disposed between the branch covering portions so as to connect the both branch covering portions therewith. An engaging portion is provided with the body and is mechanically engaged, in a direction intersecting a vertical direction, with an engaged portion which is provided with a center channel side. In collaboration with the engaged portion, the engaging portion constitutes a fastening mechanism by which the protector is fastened on the center channel.
摘要:
A structure obtaining a desired integrated circuit by sticking together a plurality of semiconductor substrates and electrically connecting integrated circuits formed on semiconductor chips of the respective semiconductor substrates is provided, and a penetrating electrode penetrating between a main surface and a rear surface of each of the semiconductor substrates and a penetrating separation portion separating the penetrating electrode are separately arranged. Thereby, after forming an insulation trench portion for formation of the penetrating separation portion on the semiconductor substrate, a MIS·FET is formed, and then, a conductive trench portion for formation of the penetrating electrode can be formed. Therefore, element characteristics of a semiconductor device having a three-dimensional structure can be improved.