公开(公告)号：US08396925B2

公开(公告)日：2013-03-12

申请号：US12562711

申请日：2009-09-18

申请人： Yoshihiro Yoneda ,  Naoki Miyabayashi ,  Isao Soma ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Kazuo Takada

发明人： Yoshihiro Yoneda ,  Naoki Miyabayashi ,  Isao Soma ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Kazuo Takada

IPC分类号： G06F15/16

CPC分类号： H04W8/183 ,  H04L67/34 ,  H04L69/24 ,  H04M1/7253 ,  H04W4/023 ,  H04W4/50 ,  H04W4/80

摘要： An information processing device includes: a first receiving unit to receive, from a first other information processing device, equipment information of a second other information processing device that differs from the first other information processing device, via a first communication and first connecting information useful for connecting with the second other information processing device by a second communication that differs from the first communication; a first transmitting unit to transmit second connection information that is useful for connecting with the device itself by the second communication to the first other information processing device, via the first communication; and a second receiving unit to receive content data transmitted from the second other information processing device by the second communication, based on the first connection information and the second connection information.

摘要翻译： 一种信息处理设备，包括：第一接收单元，用于经由第一通信和第一连接信息从第一其他信息处理设备接收与第一其他信息处理设备不同的第二其他信息处理设备的设备信息， 通过与第一通信不同的第二通信与第二其他信息处理设备连接; 第一发送单元，经由所述第一通信，向所述第一其他信息处理设备发送对于通过所述第二通信与所述设备本身的连接有用的第二连接信息; 以及第二接收单元，基于第一连接信息和第二连接信息，接收通过第二通信从第二其他信息处理设备发送的内容数据。

公开(公告)号：US20120220278A1

公开(公告)日：2012-08-30

申请号：US13463457

申请日：2012-05-03

申请人： Isao Soma ,  Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Kazuo Takada

发明人： Isao Soma ,  Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Kazuo Takada

IPC分类号： H04W4/00

CPC分类号： H04W88/04 ,  G06Q30/02 ,  H04W4/80 ,  H04W76/14 ,  H04W76/30

摘要： There is provided an information processing system including a service provider unit, a communication terminal and an information processing unit. The communication terminal includes a terminal first communication section, a terminal second communication section to communicate with the information processing unit through a first communication channel, a terminal third communication section to communicate with the information processing unit through a second communication channel, and a terminal communication control section. The information processing unit includes a unit first communication section to communicate with the communication terminal through the first communication channel, a unit second communication section to communicate with the communication terminal through the second communication channel, a unit communication control section to switch communication channels with the communication terminal from the first communication channel to the second communication channel, and a unit processing section to perform service processing with the service provider unit.

摘要翻译： 提供了一种包括服务提供者单元，通信终端和信息处理单元的信息处理系统。 通信终端包括终端第一通信部，通过第一通信信道与信息处理部通信的终端第二通信部，通过第二通信信道与信息处理部通信的终端第三通信部，以及终端通信 控制部分。 信息处理单元包括通过第一通信信道与通信终端进行通信的单元第一通信部，通过第二通信信道与通信终端通信的单位第二通信部，与通信终端通过第二通信信道进行通信的单元通信控制部， 通信终端从第一通信信道到第二通信信道，以及单元处理部，用于与服务提供者单元进行服务处理。

公开(公告)号：US07875946B2

公开(公告)日：2011-01-25

申请号：US11259196

申请日：2005-10-27

申请人： Nami Yasuoka ,  Haruhiko Kuwatsuka ,  Toru Uchida ,  Yoshihiro Yoneda

发明人： Nami Yasuoka ,  Haruhiko Kuwatsuka ,  Toru Uchida ,  Yoshihiro Yoneda

IPC分类号： H01L31/107

CPC分类号： H01L31/1864 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/035281 ,  H01L31/107 ,  H01L31/1075

摘要： In order to improve reliability by preventing edge breakdown in a semiconductor photodetector having a mesa structure such as a mesa APD, the semiconductor photodetector includes a mesa structure formed on a first semiconductor layer of the first conduction type formed on a semiconductor substrate, the mesa structure including a light absorbing layer for absorbing light, an electric field buffer layer for dropping an electric field intensity, an avalanche multiplication layer for causing avalanche multiplication to occur, and a second semiconductor layer of the second conduction type, wherein the thickness of the avalanche multiplication layer at the portion in the vicinity of the side face of the mesa structure is made thinner than the thickness at the central portion of the mesa structure.

摘要翻译： 为了通过防止具有诸如台面APD的台面结构的半导体光电检测器中的边缘破坏来提高可靠性，半导体光电检测器包括形成在形成在半导体基板上的第一导电类型的第一半导体层上的台面结构，台面结构 包括用于吸收光的光吸收层，用于降低电场强度的电场缓冲层，用于引起雪崩倍增的雪崩倍增层和第二导电类型的第二半导体层，其中雪崩倍增 在台面结构的侧面附近的部分的层的厚度比台面结构的中央部的厚度薄。

公开(公告)号：US20100009711A1

公开(公告)日：2010-01-14

申请号：US12502760

申请日：2009-07-14

申请人： Kazuo Takada ,  Isao Soma ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Yoshihiro Yoneda ,  Naoki Miyabayashi

发明人： Kazuo Takada ,  Isao Soma ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Yoshihiro Yoneda ,  Naoki Miyabayashi

IPC分类号： H04B7/00

CPC分类号： H04W36/0016 ,  H04L63/18 ,  H04M1/72597 ,  H04W4/80 ,  H04W12/06 ,  H04W36/0038 ,  H04W68/02

摘要： There is provided a communication apparatus including: a first communication unit having a first communication range; a second communication unit having a second communication range wider than the first communication range; a control unit which transmits a request signal for starting communication via the second communication unit from the first communication unit to another communication apparatus, and transmits authentication information from the second communication unit to the another communication apparatus in the case where it is determined that communication with the another communication apparatus via the second communication unit is possible based on a response signal after the first communication unit receives the response signal in response to the request signal; and a notification unit which notifies a user after the second communication unit receives a result of authentication based on the authentication information.

摘要翻译： 提供一种通信装置，包括：具有第一通信范围的第一通信单元; 第二通信单元，具有比第一通信范围宽的第二通信范围; 控制单元，其经由第二通信单元从第一通信单元向另一通信设备发送用于开始通信的请求信号，并且在确定与第二通信单元的通信的情况下，将认证信息从第二通信单元发送到另一通信设备 基于第一通信单元响应于该请求信号接收到响应信号的响应信号，经由第二通信单元的另一通信装置是可能的; 以及通知单元，其在所述第二通信单元基于所述认证信息接收到认证结果之后通知用户。

公开(公告)号：US20090253417A1

公开(公告)日：2009-10-08

申请号：US12412067

申请日：2009-03-26

申请人： Isao Soma ,  Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Kazuo Takada

发明人： Isao Soma ,  Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Kazuo Takada

IPC分类号： H04W4/00

CPC分类号： H04W88/04 ,  G06Q30/02 ,  H04W4/80 ,  H04W76/14 ,  H04W76/30

摘要： There is provided an information processing system including a service provider unit, a communication terminal and an information processing unit. The communication terminal includes a terminal first communication section, a terminal second communication section to communicate with the information processing unit through a first communication channel, a terminal third communication section to communicate with the information processing unit through a second communication channel, and a terminal communication control section. The information processing unit includes a unit first communication section to communicate with the communication terminal through the first communication channel, a unit second communication section to communicate with the communication terminal through the second communication channel, a unit communication control section to switch communication channels with the communication terminal from the first communication channel to the second communication channel, and a unit processing section to perform service processing with the service provider unit.

摘要翻译： 提供了一种包括服务提供商单元，通信终端和信息处理单元的信息处理系统。 通信终端包括终端第一通信部，通过第一通信信道与信息处理部通信的终端第二通信部，通过第二通信信道与信息处理部通信的终端第三通信部，以及终端通信 控制部分。 信息处理单元包括通过第一通信信道与通信终端进行通信的单元第一通信部，通过第二通信信道与通信终端通信的单位第二通信部，与通信终端通过第二通信信道进行通信的单元通信控制部， 通信终端从第一通信信道到第二通信信道，以及单元处理部，用于与服务提供者单元进行服务处理。

公开(公告)号：US20090222659A1

公开(公告)日：2009-09-03

申请号：US12370994

申请日：2009-02-13

申请人： Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Isao Soma ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Kazuo Takada ,  Masahiro Sueyoshi

发明人： Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Isao Soma ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Kazuo Takada ,  Masahiro Sueyoshi

IPC分类号： H04L9/32

CPC分类号： H04L63/0428 ,  H04L9/3239 ,  H04L9/3263 ,  H04L63/0442 ,  H04L63/0823 ,  H04W12/04 ,  H04W12/06 ,  H04W84/18

摘要： A communication device for performing communication by employing first and second communication units, includes: a reception unit for receiving a communication packet including a random number generated for every connection with another communication device, a certificate calculated with the random number, and authentication method information indicating whether or not an authentication method at the second communication unit is compatible with the public key system, through the first communication unit; and a method determining unit for determining whether or not an originator of the communication packet accepts public key encryption based on the authentication method information included in the communication packet; wherein in a case of the method determining unit determining that the originator of the communication packet does not accept the public key system, the random number included in the communication packet is replied to the originator as the identification information of the device itself.

摘要翻译： 一种用于通过采用第一和第二通信单元进行通信的通信设备，包括：接收单元，用于接收包括与另一个通信设备的每个连接生成的随机数的通信分组，使用随机数计算的证书，以及指示 第二通信单元的认证方法是否通过第一通信单元与公开密钥系统兼容; 以及方法确定单元，用于基于包括在通信分组中的认证方法信息来确定通信分组的发起者是否接受公开密钥加密; 其中，在所述方法确定单元确定所述通信分组的发起者不接受所述公共密钥系统的情况下，将包括在所述通信分组中的随机数作为所述设备本身的识别信息作为所述发起者回复。

公开(公告)号：US06781221B2

公开(公告)日：2004-08-24

申请号：US10170365

申请日：2002-06-14

申请人： Yoshihiro Yoneda

发明人： Yoshihiro Yoneda

IPC分类号： H01L2302

CPC分类号： H05K3/244 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaging substrate for electronic elements comprises a first area for receiving an electronic element through flip chip bonding and a second area for receiving an electronic element through wire bonding. The first area has a bonding pad having applied on a surface thereof a coating of a solder material. The packaging substrate is used in the production of an electronic device having mounted thereon electronic elements such as semiconductor chips.

摘要翻译： 用于电子元件的封装基板包括用于通过倒装芯片接合接收电子元件的第一区域和用于通过引线接合来接收电子元件的第二区域。 第一区域具有在其表面上施加焊料材料的涂层的焊盘。 包装基板用于生产安装有诸如半导体芯片的电子元件的电子设备。

公开(公告)号：US06693337B2

公开(公告)日：2004-02-17

申请号：US10015681

申请日：2001-12-17

申请人： Yoshihiro Yoneda ,  Ikuo Hanawa

发明人： Yoshihiro Yoneda ,  Ikuo Hanawa

IPC分类号： H01L310232

CPC分类号： H01L31/1075 ,  H01L31/02161 ,  H01L31/022408 ,  H01L31/02327 ,  H01L31/1035 ,  H01L31/105

摘要： A semiconductor photodetection device includes a semiconductor structure including an optical absorption layer having a photo-incidence surface on a first side thereof, a dielectric reflecting layer formed on a second side of the semiconductor structure opposite to the first side, a contact electrode surrounding the dielectric reflecting layer and contacting with the semiconductor structure, and a close contact electrode covering the dielectric reflecting layer and contacting with the contact electrode and the dielectric reflecting layer, wherein the close contact electrode adheres to the dielectric reflecting layer more strongly than to the contact electrode.

公开(公告)号：US06229711B1

公开(公告)日：2001-05-08

申请号：US09257035

申请日：1999-02-25

申请人： Yoshihiro Yoneda

发明人： Yoshihiro Yoneda

IPC分类号： H05K702

CPC分类号： H01L24/81 ,  H01L23/49838 ,  H01L23/5386 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/1607 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/111 ,  H05K2201/09727 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A flip-chip mount board includes a circuit board provided with a plurality of conductor patterns to which a plurality of bumps provided on an electronic component can be connected via a connection medium provided on the conductor patterns. The conductor pattern includes at least one wiring pattern and a connection pad, the wiring pattern serves as an interconnection, the connection pad is provided at a position corresponding to one of the bumps, the at least one wiring pattern and the connection pad are provided in an integrated manner, and a width (W1) of the connection pad is formed so as to be greater than a width (W2) of the wiring pattern (W1>W2).

摘要翻译： 倒装芯片安装板包括设置有多个导体图案的电路板，经由设置在导体图案上的连接介质，可以将设置在电子部件上的多个凸块连接到多个导体图案。 所述导体图案包括至少一个布线图案和连接垫，所述布线图案用作互连，所述连接垫设置在与所述凸块中的一个对应的位置处，所述至少一个布线图案和所述连接垫设置在 一体地形成连接焊盘的宽度（W1），使其大于布线图案（W1> W2）的宽度（W2）。

公开(公告)号：US5615089A

公开(公告)日：1997-03-25

申请号：US505888

申请日：1995-07-24

申请人： Yoshihiro Yoneda ,  Takashi Ozawa

发明人： Yoshihiro Yoneda ,  Takashi Ozawa

IPC分类号： H01L21/3205 ,  H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/18

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181

摘要： A semiconductor device includes a first substrate carrying semiconductor chips on both upper and lower major surfaces thereof, a second substrate carrying the first substrate, and a resin package body having a first part for embedding the semiconductor chips on the upper major surface of the first substrate and a second part for embedding the semiconductor chips on the lower major surface of the first substrate, wherein the second substrate carries on a lower major surface thereof solder bumps forming a BGA structure.

摘要翻译： 半导体器件包括在其上表面和下主表面上承载半导体芯片的第一衬底，承载第一衬底的第二衬底和具有用于将半导体芯片嵌入第一衬底的上主表面上的第一部分的树脂封装体 以及第二部分，用于将半导体芯片嵌入在第一基板的下主表面上，其中第二基板在其下主表面上承载形成BGA结构的焊料凸块。