摘要:
An erasable programmable read-only memory (EPROM) with a NAND cell structure includes NAND cell blocks, each of which has a selection transistor connected to the corresponding bit line and memory cell transistors connected in series. Word lines are connected to control gates of the cell transistors. In a data write mode, a selection transistor of a certain cell block containing a selected cell is rendered conductive to connect the cell block to the corresponding bit line. A control circuit is provided for applying an "L" level voltage (approximately 0 V) to a word line connected to the selected cell, applying an "H" level voltage (approximately 20 V) to a word line or word lines positioned between the selected word line and a contact node connecting the cell block and a specific bit line associated therewith, applying a voltage corresponding to data to be written to the specific bit line, and applying an intermediate voltage between the "H" and "L" level voltages to non-selected bit lines, thereby writing the data in the selected cell by tunneling. If the data is logic "0" data, the intermediate voltage is applied also to the specific bit line.
摘要:
A NOR operation is performed on the address bit by bit by a NOR circuit, and when the final address in a page is detected from the result of the NOR operation by a final address detection circuit, a program starting circuit executes data writing to a memory cell. This can ensure detection of the final address in a page without using a counter circuit. It is therefore possible to simplify the structure of the final address detection circuit and reduce the circuit area occupying in a semiconductor memory device.
摘要:
An EEPROM includes an array of memory cells divided into a plurality of memory blocks in a semiconductor well region in a substrate. Each block includes series arrays of FATMOS transistors each acting as one memory cell, wherein binary information may be stored in a selected cell transistor by causing carriers to tunnel between the floating gate thereof and the well region. In each block, word lines are connected to the control gates of cell transistors; control lines are to select transistors provided in the series arrays of cell transistors, with which bit lines are associated. A block-erase operation is performed such that a desired one of the memory blocks is selected for erase, while forcing the remaining memory blocks to remain non-erased. To do this, a first voltage is applied to those of the word lines of the selected block, while applying a second voltage to the remaining word lines of the non-selected blocks, the control lines of all the blocks, and the well region.
摘要:
A NAND cell type EEPROM has parallel data transmission lines formed above a substrate, and a memory cell section including a plurality of NAND type cell units containing a NAND type cell unit that is associated with a certain bit line of the bit lines. This NAND type cell unit has a series-circuit of a preselected number of data storage transistors with control gates, and a selection transistor. A substrate voltage-stabilizing layer is insulatively provided above the substrate and positioned in the field area in adjacent to the certain bit line. The conductive layer is connected to the substrate by a contact portion so that the substrate voltage can be constantly set to a preselected voltage potential of a fixed value during the NAND type cell unit is being subjected to the write and erase modes.
摘要:
An electrically erasable programmable read-only memory has memory cell blocks, each of which has NAND type cell units associated with the bit lines respectively. Each cell unit has a series-circuit of floating gate type memory cell transistors and a selection transistor provided between the corresponding bit line and the series-circuit of memory cell transistors. A row decoder is provided in common to the memory cell blocks, for generating an "H" level voltage which is supplied to a selection gate control line connected to the selection transistor and to a selected word line or lines in a cell unit. A voltage boost circuit is provided for every memory cell block, for causing the "H" level voltage to increase up to a preselected potential level which is high enough to render the cell transistors conductive. The voltage boost circuit includes a first booster section for the selection gate control line, and a second section for the word lines. The second section operates in response to the output voltage of the first section.
摘要:
A semiconductor memory device includes a first comparative device, to which first and second voltages are input; a first capacitor, which accumulates the electrical potential of a first node; a power source, which outputs the first electric current to a second node; a resistor, which generates a third voltage in the second node; a second capacitor, which accumulates the electric potential of the second node; first switches, which make a common connection at a third node possible for the first node and the second node, to which the first capacitor and the second capacitor are connected respectively; and a second comparison device, which uses as an input voltage a fourth voltage, which is obtained as a result of the charge share between the first and the second capacitors and the electrical potential of a fourth node, and equalizes the electrical potential of the fourth node with the fourth voltage.
摘要:
A semiconductor storage device has a nonvolatile storage region, a voltage generating circuit that generates an operational voltage for the storage region, and a control circuit that sends the voltage generated by the voltage generating circuit to the storage region. The voltage generating circuit has a transistor, a first resistance element, a second resistance element, and a comparator. The first resistance element and the second resistance element have wiring structure for resistance. The resistance wiring in the wiring structure has the same line width as the finest line width in the wiring formed in the storage region.
摘要:
A semiconductor memory device comprises: a semiconductor substrate; a plurality of memory units provided on the semiconductor substrate and each including a plurality of memory cells that are stacked; and a plurality of bit lines formed above each of a plurality of the memory units aligned in a column direction, an alignment pitch in a row direction of the plurality of bit lines being less than an alignment pitch in the row direction of the memory units, and an end of each of the memory units aligned in the column direction being connected to one of the plurality of bit lines formed above the plurality of the memory units aligned in the column direction.
摘要:
A semiconductor device comprising a stacked layer memory block and associated peripheral circuits in stacked layer arrangements. Booster circuits in a variety of stacked layer arrangements are described. The booster circuit possesses plural rectifier cells that are series-connected and plural first capacitors. The plural first capacitors receive the first clock signal on one end, and the other ends are each connected to one end of different rectifier cells. The first capacitor is composed of capacities between plural first conductive layers that are arrayed with a set pitch perpendicularly to the substrate. One of the either even numbered or odd numbered first conductive layers is supplied with a first clock signal. The other of the either even numbered or odd numbered first conductive layers that line perpendicularly to the substrate is, individually, connected to one end of different rectifier cells.
摘要:
A nonvolatile semiconductor memory device comprises a cell array having plural memory cells arranged in matrix, each memory cell including a variable resistor having a resistance reversibly variable to store data corresponding to the resistance of the variable resistor; a selection circuit operative to select a memory cell from the cell array; and a write circuit operative to execute certain voltage or current supply to the memory cell selected by the selection circuit to vary the resistance of a variable resistor in the selected memory cell to erase or write data. The write circuit terminates the voltage or current supply to the selected memory cell in accordance with resistance variation situation of the variable resistor in the selected memory cell when current flowing in the selected memory cell reaches a certain level appeared after the data erase or write.