公开(公告)号：US5372891A

公开(公告)日：1994-12-13

申请号：US991287

申请日：1992-12-16

申请人： Tsai-An Yu ,  Jing-Pin Pan ,  Han-Lung Chen ,  Jinn-Shing King ,  Tsung-Hsiung Wang

发明人： Tsai-An Yu ,  Jing-Pin Pan ,  Han-Lung Chen ,  Jinn-Shing King ,  Tsung-Hsiung Wang

IPC分类号： C08G73/10 ,  C09J179/08 ,  H05K1/03 ,  B32B15/08

CPC分类号： C08G73/101 ,  C09J179/08 ,  C09J179/085 ,  H05K1/0346 ,  Y10T428/31681 ,  Y10T428/31721

摘要： An improved polyimide-based coating composition comprising a polyimide upper layer and a polyimide-modified bismaleimide lower layer for use as a coating on metal substrate, such as an electrolytic copper foil. The polyimide are prepared from reactions between diamines, such as p-phenylene diamine and 4-4'-diaminodiphenyl ether, and dianhydrides, such as 3,3',4,4'-benzophenone tetracarboxylic dianhydride and biphenyl-3,3',4,4'-tetracarboxylic dianhydride. The modified bismaleimide can be prepared from reacting an N,N',4,4'-diphenyl bismaleimide with a barbituric acid or its derivative. A double-layered extrusion coating technique having a double-layered extrusion die is utilized to apply the coating composition onto the metal substrate. The final laminated products show improved peel strength between the polyimide coating and the substrate, as well as improved dimensional stability and surface flatness thereof.

摘要翻译： 一种改进的聚酰亚胺基涂料组合物，其包含聚酰亚胺上层和用作金属基底如电解铜箔上的涂层的聚酰亚胺改性双马来酰亚胺下层。 聚酰亚胺由二胺如对苯二胺和4-4'-二氨基二苯基醚之间的反应制备，二酐如3,3'，4,4'-二苯甲酮四羧酸二酐和联苯-3,3' 4,4'-四羧酸二酐。 改性双马来酰亚胺可以通过使N，N'，4,4'-二苯基双马来酰亚胺与巴比妥酸或其衍生物反应来制备。 使用具有双层挤出模头的双层挤出涂布技术将涂料组合物施加到金属基材上。 最终的层压产品显示出聚酰亚胺涂层和基材之间的改善的剥离强度，以及改进的尺寸稳定性和表面平整度。

公开(公告)号：US07626657B2

公开(公告)日：2009-12-01

申请号：US11131247

申请日：2005-05-18

申请人： Yue-Shih Jeng ,  Yuh-Shyang Chen ,  Wei-Chih Liu ,  Tsung-Hsiung Wang ,  Yu-Hsun Wu

发明人： Yue-Shih Jeng ,  Yuh-Shyang Chen ,  Wei-Chih Liu ,  Tsung-Hsiung Wang ,  Yu-Hsun Wu

IPC分类号： G02F1/1335

CPC分类号： G02B5/305 ,  G02F2001/133565

摘要： A multi-function integrated polarizer/optical film structure and manufacturing method thereof solves the disadvantages of O type or E type polarizers that cannot simultaneously have high polarizing efficiency and high transmittance. The present invention utilizes optical design for a polarizer/optical film having a plurality of material layers on substrates. The present invention is a multi-function integrated polarizer/optical film structure and manufacturing method thereof, that allows an LCD image to have high polarizing efficiency, high transmittance, wide-angle, high contrast and super-film characteristics simultaneously.

摘要翻译： 多功能集成偏振片/光学膜结构及其制造方法解决了不能同时具有高偏振效率和高透射率的O型或E型偏振器的缺点。 本发明利用光学设计用于在衬底上具有多个材料层的偏振器/光学膜。 本发明是一种多功能集成偏振片/光学膜结构及其制造方法，其可以使LCD图像同时具有高的偏振效率，高透射率，广角度，高对比度和超薄膜特性。

公开(公告)号：US20060103781A1

公开(公告)日：2006-05-18

申请号：US11131247

申请日：2005-05-18

申请人： Yue-Shih Jeng ,  Yuh-Shyang Chen ,  Wei-Chih Liu ,  Tsung-Hsiung Wang ,  Yu-Hsun Wu

发明人： Yue-Shih Jeng ,  Yuh-Shyang Chen ,  Wei-Chih Liu ,  Tsung-Hsiung Wang ,  Yu-Hsun Wu

IPC分类号： G02F1/1335

CPC分类号： G02B5/305 ,  G02F2001/133565

摘要： A multi-function integrated polarizer/optical film structure and manufacturing method thereof solves the disadvantages of O type or E type polarizers that cannot simultaneously have high polarizing efficiency and high transmittance. The present invention utilizes optical design to a polarizer/optical film having a plurality of material layers on substrates. The present invention is a multi-function integrated polarizer/optical film structure and manufacturing method thereof, that allows an LCD image to have high polarizing efficiency, high transmittance, wide-angle, high contrast and super-film characteristics simultaneously.

摘要翻译： 多功能集成偏振片/光学膜结构及其制造方法解决了不能同时具有高偏振效率和高透射率的O型或E型偏振器的缺点。 本发明将光学设计应用于在基板上具有多个材料层的偏振器/光学膜。 本发明是一种多功能集成偏振片/光学膜结构及其制造方法，其可以使LCD图像同时具有高的偏振效率，高透射率，广角度，高对比度和超薄膜特性。

公开(公告)号：US5342736A

公开(公告)日：1994-08-30

申请号：US821632

申请日：1992-01-16

申请人： Ker-Ming Chen ,  Tsung-Hsiung Wang ,  Shing-Shing King ,  Tzong-Ming Lee

发明人： Ker-Ming Chen ,  Tsung-Hsiung Wang ,  Shing-Shing King ,  Tzong-Ming Lee

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  G03C1/93

CPC分类号： H05K3/002 ,  H05K1/0346 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2201/09845 ,  H05K3/4644 ,  H05K3/4676

摘要： A method of wet etching of polyimide comprising the steps of(a) cleaning a substrate for coating;(b) coating a polyamic acid varnish onto said cleaned substrate;(c) thermal curing the varnish in (b) to form a polyimide layer on the substrate;(d) coating a polyamide-imide varnish onto the layer in (c);(e) curing the varnish in (d),(f) coating a layer of photoresist onto the coated substrate;(g) masked exposing;(h) image developing on said substrate; and(i) wet etching the unprotected portion in the layers of polyimide and polyamide-imide to form a staircase pattern on the substrate.

摘要翻译： 一种湿法蚀刻聚酰亚胺的方法，包括以下步骤：（a）清洗用于涂布的基材; （b）将聚酰胺酸清漆涂布在所述清洁的基材上; （c）（b）中的清漆热固化以在基材上形成聚酰亚胺层; （d）在（c）中的层上涂布聚酰胺 - 酰亚胺清漆; （e）在（d）中固化清漆，（f）将一层光致抗蚀剂涂覆在涂覆的基材上; （g）屏蔽曝光; （h）在所述衬底上显影; 和（i）湿式蚀刻聚酰亚胺和聚酰胺 - 酰亚胺层中的未保护部分以在基材上形成阶梯图案。

公开(公告)号：US20080221325A1

公开(公告)日：2008-09-11

申请号：US12005347

申请日：2007-12-27

申请人： Jing-Ping Pan ,  Tsung-Hsiung Wang ,  Jung-Mu Hsu ,  Peter P. Chu ,  Chien-Shun Wu ,  Bo-Jun Liu

发明人： Jing-Ping Pan ,  Tsung-Hsiung Wang ,  Jung-Mu Hsu ,  Peter P. Chu ,  Chien-Shun Wu ,  Bo-Jun Liu

IPC分类号： C07D239/02 ,  C07D207/444 ,  C07D257/00

CPC分类号： C08J5/2256 ,  C08G65/48 ,  C08G2650/40 ,  C08J2371/12

摘要： An exchange membrane containing modified maleimide oligomers comprising sulfonated poly(aryl ether ketone) (S-PAEK) and modified maleimide oligomers. The exchange membrane uses the modified maleimide oligomers having a hyper-branched architecture as matrix, and introduces them into S-PAEK to constitute semi-interpenetration network (semi-IPN), so as to intensify water holding capacity, chemical resistance, the electrochemical stability and thermal resistance of the ionic/proton exchange membrane. The exchange membrane can be used to fabricate the membrane electrode assemblies, fuel cells, and be applied them to the fields of seawater desalination, heavy water and sewage treatment, and biomass-energy resources.

摘要翻译： 含有磺化聚（芳基醚酮）（S-PAEK）和改性马来酰亚胺低聚物的改性马来酰亚胺低聚物的交换膜。 交换膜使用具有超支化结构的改性马来酰亚胺低聚物作为基质，并将其引入到S-PAEK中以构成半互穿网络（semi-interenetration network（semi-IPN）），以增强保水能力，耐化学性，电化学稳定性 和离子/质子交换膜的热阻。 交换膜可用于制造膜电极组件，燃料电池，并将其应用于海水淡化，重水和污水处理以及生物质能源资源领域。

公开(公告)号：US20070024776A1

公开(公告)日：2007-02-01

申请号：US11312933

申请日：2005-12-21

申请人： Yue-Shih Jeng ,  Yuh-Shyang Chen ,  Wei-Chih Liu ,  Tsung-Hsiung Wang ,  Yu-Hsun Wu ,  Wei-Yi Chien

发明人： Yue-Shih Jeng ,  Yuh-Shyang Chen ,  Wei-Chih Liu ,  Tsung-Hsiung Wang ,  Yu-Hsun Wu ,  Wei-Yi Chien

IPC分类号： G02F1/1335

CPC分类号： G02B5/3058 ,  G02F1/133528 ,  G02F2001/133548

摘要： An integrated type optical film with a wire grid polarizer structure and a manufacturing method thereof solves the optical matching problem of conventional optical film and integrates an optical effectiveness with all layers by using non-linear optical theory to redistribute integral polarizing efficiency and transmittance in all layers. The integrated type optical film includes two types of polarizers, a reflective type wire grid polarizer and an absorbing type polarizer. The reflective type wire grid polarizer can reflect an incident polarizing light parallel with a metal grid thereof, and transform and transmit polarizing light perpendicular to the polarizer with secondary transmitting efficiency, so that multi-layered structures are integrated into a polarizer with high polarizing efficiency, high transmittance and light-reflective efficiency.

摘要翻译： 具有线栅偏振器结构的集成型光学膜及其制造方法解决了传统光学膜的光学匹配问题，并且通过使用非线性光学理论将所有层的光学效能与所有层集成，以重新分布整体偏振效率和所有层中的透射率 。 集成型光学膜包括两种类型的偏振器，反射型线栅偏振器和吸收型偏振器。 反射型线栅偏振器可以反射与其金属栅格平行的入射偏振光，并且以二次透射效率将与偏振器垂直的偏振光变换并透射，从而将多层结构集成到具有高偏振效率的偏振片中， 透光率高，反光效率高。

公开(公告)号：US20060176422A1

公开(公告)日：2006-08-10

申请号：US11159316

申请日：2005-06-23

申请人： Yue-Shih Jeng ,  Yuh-Shyang Chen ,  Wei-Chih Liu ,  Tsung-Hsiung Wang ,  Yu-Hsun Wu ,  Wei-Yi Chien

发明人： Yue-Shih Jeng ,  Yuh-Shyang Chen ,  Wei-Chih Liu ,  Tsung-Hsiung Wang ,  Yu-Hsun Wu ,  Wei-Yi Chien

IPC分类号： G02F1/1335

CPC分类号： G02B5/305

摘要： A brightness-enhancing integral polarizer and optical film structure and manufacture are described. The brightness-enhancing integral polarizer and optical film have an absorptive polarizer and a reflective polarizer. The reflective polarizer generates a reflective light source effect, and uses a nonlinear optic design to coat a brightness-enhancing integral polarizer and optical film with a different dye on at least one substrate and produce the effects of brightness enhancement, high polarization, high transmittance, wide viewing angle and high contrast for the brightness-enhancing integral polarizer and optical film structure and manufacturing method.

摘要翻译： 描述了亮度增强整体偏振器和光学膜结构和制造。 增亮型积分偏振片和光学膜具有吸收型偏振片和反射型偏振片。 反射型偏振片产生反射光源效应，并使用非线性光学设计，在至少一个基板上涂上不同染料的亮度增强整体偏光镜和光学膜，产生亮度增强，高极化，高透光率， 宽视角和高对比度的亮度增强整体偏光镜和光学膜结构及制造方法。

公开(公告)号：US6119338A

公开(公告)日：2000-09-19

申请号：US44969

申请日：1998-03-19

申请人： Tsung-Hsiung Wang ,  Man-Lin Chen ,  Chuang-Shin Chiou ,  Ming-Shun Chan ,  Pei-Wen Ding

发明人： Tsung-Hsiung Wang ,  Man-Lin Chen ,  Chuang-Shin Chiou ,  Ming-Shun Chan ,  Pei-Wen Ding

IPC分类号： H05K3/00 ,  H05K3/04 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/421 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0554 ,  H05K2203/085 ,  H05K3/0035 ,  H05K3/0094 ,  H05K3/045 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method for making high-density multilayer printed circuit boards is disclosed. It includes the steps of: (a) forming a pair of first conductive layers on top and bottom sides of a dielectric substrate; (b) forming first via holes through one of the first electrically conductive layers; (c) forming a blind hole through the dielectric substrate using a conformal laser drilling technique and filling the blind hole with an electrically conductive material; (d) forming a circuit pattern from the first electrically conductive layer; (e) forming a first electrically insulating layer on the first electrically conductive layer; (f) forming second via holes through the first electrically insulating layer using a non-conformal laser drilling technique; (g) forming a second electrically conductive layer covering the top surface of the circuit pattern, the first electrically insulating layer, and the side surface of the second via holes by electroplating; (h) forming a second electrically insulating layer on the first electrically conductive layer and filling the second via hole with the same electrically insulating material; (i) removing the second electrically insulating layer and the second electrically conductive layer above the second via hole; (j) forming a third electrically conductive layer on the first electrically insulating layer, wherein the third electrically conductive layer is in contact with the top edges of the second electrically conductive layer remaining on the cylindrical surface of the second via; (k) forming another circuit pattern on the third electrically conductive layer. Steps(e) through (k) can be repeated for more circuit patterns.

摘要翻译： 公开了一种制造高密度多层印刷电路板的方法。 它包括以下步骤：（a）在电介质基片的顶面和底面上形成一对第一导电层; （b）通过所述第一导电层之一形成第一通孔; （c）使用共形激光钻孔技术通过介电基片形成盲孔，并用导电材料填充盲孔; （d）从第一导电层形成电路图案; （e）在第一导电层上形成第一电绝缘层; （f）使用非共形激光钻孔技术通过所述第一电绝缘层形成第二通孔; （g）通过电镀形成覆盖电路图案的顶表面，第一电绝缘层和第二通孔的侧表面的第二导电层; （h）在所述第一导电层上形成第二电绝缘层并用相同的电绝缘材料填充所述第二通孔; （i）在所述第二通孔上方去除所述第二电绝缘层和所述第二导电层; （j）在所述第一电绝缘层上形成第三导电层，其中所述第三导电层与残留在所述第二通孔的圆柱形表面上的所述第二导电层的顶部边缘接触; （k）在第三导电层上形成另一个电路图案。 可以重复步骤（e）至（k）以获得更多的电路图案。

公开(公告)号：US20080160411A1

公开(公告)日：2008-07-03

申请号：US11984282

申请日：2007-11-15

申请人： Pin-Chi Chiang ,  Tsung-Hsiung Wang ,  Chang-Rung Yang

发明人： Pin-Chi Chiang ,  Tsung-Hsiung Wang ,  Chang-Rung Yang

IPC分类号： H01M4/62 ,  H01M4/50 ,  H01M4/52

CPC分类号： H01M4/624 ,  H01M4/131 ,  H01M4/525 ,  H01M4/622 ,  H01M4/625 ,  H01M4/661

摘要： A conductive-structured electrode is proposed. The proposed conductive-structured electrode includes a tubular 3D electron passage structure made of one or more first-type conductive additives for conducting electrodes; a connecting/continuous conductive 3D structure made of one or more second-type conductive additives for adhering active substances and framing the tubular 3D electron passage structure; and a 3D porous structure formed by the first-type and second-type conductive additives for adhering active substances and framing the tubular 3D electron passage structure. The interior of the stated network-like 3D structure formed by the tubular 3D electron passage structure and the connecting/continuous conductive 3D structure can be used as an ion passage. The network structure itself can increase adhesion of active substances on substrates, and the conductive passage can facilitate rapid conduction of electrons. Thus, the invention is suitable for making batteries, which have increased C-rate performance.

摘要翻译： 提出了导电结构电极。 所提出的导电结构电极包括由用于导电电极的一种或多种第一类型导电添加剂制成的管状3D电子通道结构; 由一种或多种用于粘附活性物质并构成管状3D电子通道结构的第二类导电添加剂制成的连接/连续导电3D结构; 以及由用于粘附活性物质的第一类和第二类导电添加剂形成的3D多孔结构，并且构成管状3D电子通道结构。 由管状3D电子通道结构和连接/连续导电3D结构形成的所述网状3D结构的内部可用作离子通道。 网络结构本身可以增加活性物质在基底上的粘附，并且导电通道可以促进电子的快速传导。 因此，本发明适用于制造具有提高C速率性能的电池。

公开(公告)号：US06204089B1

公开(公告)日：2001-03-20

申请号：US09312288

申请日：1999-05-14

申请人： Tsung-Hsiung Wang

发明人： Tsung-Hsiung Wang

IPC分类号： H01L2144

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/01074 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method for forming a flip chip package by using cone-shaped solder bumps and a package formed by such method are disclosed. In the method, an integrated circuit chip is first provided with a plurality of cone-shaped solder bumps formed on a plurality of bond pads. The cone-shaped solder bumps are equipped with sharp-pointed tip portions such that they penetrate an electrically insulating material layer that is positioned between the solder bumps on the IC chip and a substrate to be bonded thereto. When a lamination process is conducted on the IC chip and the substrate with the electrically insulating material layer thereinbetween, electrical communication between the plurality of bond pads and a plurality of conductive elements on the surface of the substrate is established when the cone-shaped solder bumps penetrate the electrically insulating material layer and form ohmic contact with the conductive elements on the substrate. The present invention novel method therefore eliminates many processing steps that are required in a conventional flip chip bonding process and provides an improved method that saves both costs and time.

摘要翻译： 公开了一种通过使用锥形焊料凸块形成倒装芯片封装的方法和通过这种方法形成的封装。 在该方法中，集成电路芯片首先设置有形成在多个接合焊盘上的多个锥形焊料凸点。 锥形焊料凸块配备尖锐尖端部分，使得它们穿过位于IC芯片上的焊料凸块与待粘合的基板之间的电绝缘材料层。 当在IC芯片和其中具有电绝缘材料层的基板上进行层压处理时，当锥形焊料凸起时，多个接合焊盘与基板表面上的多个导电元件之间的电连通被建立 穿透电绝缘材料层并与衬底上的导电元件形成欧姆接触。 因此，本发明的新颖方法消除了传统的倒装芯片接合工艺中所需的许多处理步骤，并提供了节省成本和时间的改进方法。