公开(公告)号：US20050051358A1

公开(公告)日：2005-03-10

申请号：US10499036

申请日：2003-09-04

申请人： Eiji Kawamoto ,  Masaaki Hayama ,  Masaaki Katsumata ,  Hiroki Yabe ,  Takeo Yasuho

发明人： Eiji Kawamoto ,  Masaaki Hayama ,  Masaaki Katsumata ,  Hiroki Yabe ,  Takeo Yasuho

IPC分类号： H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/34 ,  H05K3/46 ,  H05K9/00 ,  H05K7/06

CPC分类号： H05K3/284 ,  H01L2924/15311 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10636 ,  Y02P70/611

摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).

摘要翻译： 提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。 第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。 使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

公开(公告)号：US06544818B2

公开(公告)日：2003-04-08

申请号：US09801926

申请日：2001-03-09

申请人： Yuji Yagi ,  Takeo Yasuho

发明人： Yuji Yagi ,  Takeo Yasuho

IPC分类号： H01L2144

CPC分类号： H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The method of manufacturing a semiconductor device comprising: forming a wiring pattern on a substrate; forming a thermosetting resin layer on the substrate; aligning and adhering a semiconductor chip to the wiring pattern for electric connection via the thermosetting resin layer; and press-bonding an electrode of the chip onto the wiring pattern while the chip is being heated. During the press-bonding step, the substrate is cooled. By the cooling, the amount of thermal expansion of the substrate is suppressed and therefore comes closer to the thermal expansion of the chip. By mounting the chip on the substrate through the steps described above, the reliability of moisture resistance of the semiconductor device is greatly improved.

摘要翻译： 一种制造半导体器件的方法，包括：在衬底上形成布线图案; 在基板上形成热固性树脂层; 将半导体芯片对准并粘附到经由热固性树脂层进行电连接的布线图案; 并且在芯片被加热的同时将芯片的电极压接到布线图案上。 在压接步骤期间，将基板冷却。 通过冷却，抑制了基板的热膨胀量，因此接近芯片的热膨胀。 通过上述步骤将芯片安装在基板上，大大提高了半导体器件的耐湿性的可靠性。

公开(公告)号：US06218736B1

公开(公告)日：2001-04-17

申请号：US09332968

申请日：1999-06-15

申请人： Yuji Yagi ,  Takeo Yasuho

发明人： Yuji Yagi ,  Takeo Yasuho

IPC分类号： H01L2348

CPC分类号： H05K3/4647 ,  H01L21/4867 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/092 ,  H05K1/095 ,  H05K3/207 ,  H05K3/22 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4061 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/025 ,  H05K2203/0307 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49163 ,  H01L2924/00 ,  H01L2924/00014

摘要： A circuit board with protrusions at desired locations on a wiring pattern that on the surface of the board. The protrusions are made of the same conductive material used in the wiring pattern, and formed unitarily and simultaneously with the wiring pattern. Conductive material is filled into grooves having different depths and formed on a film. The filled conductive material is transferred onto the board, and then fired. Thus the circuit board is manufactured. Semiconductor devices and general-purpose components are mounted on the circuit board, whereby a semiconductor device can be manufactured with high reliability and at an inexpensive cost.

摘要翻译： 电路板，其在板的表面上的布线图案上的期望位置处具有突起。 突起由与布线图案相同的导电材料制成，并且与布线图案一体形成。 将导电材料填充到具有不同深度的凹槽中并形成在膜上。 将填充的导电材料转移到板上，然后烧制。 因此制造电路板。 半导体器件和通用部件安装在电路板上，由此可以以高可靠性和廉价的成本制造半导体器件。

公开(公告)号：US5528458A

公开(公告)日：1996-06-18

申请号：US344693

申请日：1994-11-18

申请人： Takeo Yasuho ,  Hayami Matunaga ,  Masao Iwata ,  Hitonobu Furukawa

发明人： Takeo Yasuho ,  Hayami Matunaga ,  Masao Iwata ,  Hitonobu Furukawa

IPC分类号： H01L23/12 ,  H01L21/58 ,  H01L23/31 ,  H01L23/498 ,  H05K7/20

CPC分类号： H01L24/83 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/4985 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181

摘要： An integrated circuit device is disclosed that comprises a bare integrated circuit chip, having an integrated circuit section and pad sections, said chip being mounted on an insulated surface of a substrate, and an electro-conductive circuit pattern wiring formed on said insulating surface along the periphery of said chip. Tape automated bonding wiring is used to electrically connect the pad sections of the chip to an end of the circuit pattern wiring. Terminals are electrically connected to the other end of the circuit pattern wiring for use in electrically connecting the integrated circuit device to electronic equipment.

摘要翻译： 公开了一种集成电路器件，其包括裸集成电路芯片，具有集成电路部分和焊盘部分，所述芯片安装在基板的绝缘表面上，以及形成在所述绝缘表面上的导电电路图案布线沿着 所述芯片的外围。 磁带自动接合线用于将芯片的焊盘部分电连接到电路图案布线的一端。 端子电连接到电路图案布线的另一端，用于将集成电路器件电连接到电子设备。