公开(公告)号：USRE43487E1

公开(公告)日：2012-06-26

申请号：US12350767

申请日：2009-01-08

Applicant: James N. O'Brien ,  Lian-Cheng Zou ,  Yunlong Sun ,  Kevin P. Fahey ,  Michael J. Wolfe ,  Brian W. Baird ,  Richard S. Harris

Inventor： James N. O'Brien ,  Lian-Cheng Zou ,  Yunlong Sun ,  Kevin P. Fahey ,  Michael J. Wolfe ,  Brian W. Baird ,  Richard S. Harris

IPC: B23K26/04 ,  C04B41/91

CPC classification number: B23K26/0622 ,  B23K26/032 ,  B23K26/066 ,  B23K26/073 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/364 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 μm to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 (112) where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.

Abstract translation: 通过将长切割路径（112）分割成约10微米至1mm的短段（122）来提高通过硅等材料的UV激光切割吞吐量。 激光输出（32）在第一短段（122）内扫描预定数量的通过，然后移动到第二短段（122）内并在第二短段（122）内扫描预定次数的通过次数。 可以操纵咬合尺寸，段尺寸（126）和段重叠（136）以最小化沟槽回填的数量和类型。 采用实时监测来减少已经完成切割的切割路径112（112）的重新扫描部分。 激光输出（32）的极化方向也与切割方向相关，以进一步提高吞吐量。 该技术可用于切割具有各种不同激光和波长的各种材料。 多步骤过程可以优化每个单独层的激光工艺。

公开(公告)号：US08116341B2

公开(公告)日：2012-02-14

申请号：US11756507

申请日：2007-05-31

Applicant: Weisheng Lei ,  Yunlong Sun ,  Yasu Osako ,  John Davignon ,  Glenn Simenson ,  Hisashi Matsumoto

Inventor： Weisheng Lei ,  Yunlong Sun ,  Yasu Osako ,  John Davignon ,  Glenn Simenson ,  Hisashi Matsumoto

IPC: H01S3/109 ,  H01S3/10 ,  B23K26/38

CPC classification number: H05K3/0038 ,  B23K26/389 ,  H01S3/0092 ,  H01S3/082 ,  H01S3/107 ,  H01S3/109 ,  H01S3/117 ,  H05K1/0366 ,  H05K3/0035 ,  H05K2203/108

Abstract: Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.

Abstract translation: 优选地衍生自单个激光束的双光束激光输出提高了在包括纤维增强树脂的目标材料（例如印刷电路板）中钻出的通孔的侧壁质量。 两个实施例各自使用两个激光输出部件来从工件的目标材料位置移除目标材料的一部分，并以材料去除速率快速地清洁与目标材料位置下方的金属层粘合的残留物。 第一实施例需要引导入射到目标材料位置处的目标材料的一部分，处理激光输出具有由相应的第一和第二波长表征的第一和第二分量。 第二实施例需要引导在目标材料位置处的目标材料的一部分上的入射，该处理激光输出具有由相应的第一和第二脉冲宽度表征的第一和第二分量。

公开(公告)号：US20100246611A1

公开(公告)日：2010-09-30

申请号：US12413350

申请日：2009-03-27

Applicant: Yunlong Sun

Inventor： Yunlong Sun

IPC: H01S3/098 ,  H01S3/10

CPC classification number: B23K26/0624 ,  B23K26/0622 ,  B23K26/40 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52

Abstract: A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location.

Abstract translation: 一系列激光脉冲束或脉冲串用于微加工目标结构。 每个脉冲串包括具有小于约1纳秒的时间脉冲宽度的短激光脉冲。 激光微加工方法包括产生脉冲串脉冲并调整用于处理目标位置的激光脉冲的脉冲串的包络线。 该方法包括通过基于目标位置处的第一特征的处理特性选择性地将脉冲串内的一个或多个第一激光脉冲选择性地调整到第一振幅来调整脉冲串包络，以及选择性地调整脉冲串内的一个或多个第二激光脉冲至 基于目标位置处的第二特征的处理特性的第二幅度。 该方法还包括将激光脉冲的幅度调整脉冲引导到目标位置。

公开(公告)号：US20090245300A1

公开(公告)日：2009-10-01

申请号：US12054811

申请日：2008-03-25

Applicant: Yunlong Sun ,  Feng Chang

Inventor： Yunlong Sun ,  Feng Chang

IPC: H01S3/10

CPC classification number: H01S3/0941 ,  H01S3/042 ,  H01S3/094076 ,  H01S3/10046 ,  H01S3/10069 ,  H01S3/1024 ,  H01S3/1068 ,  H01S3/117 ,  H01S3/1306

Abstract: Systems and methods provide laser pulse equalization at different pulse repetition frequencies (PRFs). After initially pumping a lasing medium from a first pumping level to a peak pumping level, a controller may cause a pump source to continue pumping the lasing medium according to a pulse equalization pumping curve. The equalization pumping curve may be determined based on testing laser pulse parameters at different PRFs to achieve an optimal equalization result of the pulse parameters. The optimization metric used to evaluate various equalization pumping curves may include a consistency of the pulse energy level, peak power level, and/or pulse width of the laser under different PRFs. The equalization pumping curve may be a descending curve from the peak pumping level to the first pumping level. The equalization pumping curve may be a linearly declining curve, a substantially exponentially declining curve, a parametrically declining curve, or any other curve type.

Abstract translation: 系统和方法提供不同脉冲重复频率（PRF）的激光脉冲均衡。 在初始将激光介质从第一泵浦电平泵送到峰值泵浦电平之后，控制器可以使泵浦源根据脉冲均衡泵送曲线继续泵浦激光介质。 可以基于在不同PRF下测试激光脉冲参数来确定均衡泵送曲线，以实现脉冲参数的最佳均衡结果。 用于评估各种均衡泵送曲线的优化度量可以包括不同PRF下的激光器的脉冲能级，峰值功率电平和/或脉冲宽度的一致性。 均衡泵送曲线可以是从峰值泵送电平到第一泵浦电平的下降曲线。 均衡泵送曲线可以是线性下降曲线，基本上呈指数下降曲线，参数下降曲线或任何其它曲线类型。

公开(公告)号：US20090236323A1

公开(公告)日：2009-09-24

申请号：US12054115

申请日：2008-03-24

Applicant: Yunlong Sun ,  Weisheng Lei ,  Hisashi Matsumoto ,  Brian Johansen ,  Gregg Hardy ,  Brian Baird

Inventor： Yunlong Sun ,  Weisheng Lei ,  Hisashi Matsumoto ,  Brian Johansen ,  Gregg Hardy ,  Brian Baird

IPC: B23K26/38

CPC classification number: B23K26/0622 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  H05K3/0035

Abstract: An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailored pulse is a laser pulse that features a power spike having a peak power 10% higher than the average power of the pulse and lasting less than 50% of the duration of the pulse. Methods and apparatuses for creating tailored pulses by slicing longer duration pulses are shown.

Abstract translation: 提出了一种用于在具有激光脉冲的电子衬底中钻通孔的改进方法和装置，其使用一个或多个定制脉冲来减少残留在通孔中的残留物，同时保持系统吞吐量并避免损坏衬底。 定制脉冲是一种激光脉冲，其特征在于具有比脉冲的平均功率高10％的峰值功率并持续小于脉冲持续时间的50％的功率尖峰。 示出了通过切片更长持续时间脉冲来创建裁剪脉冲的方法和装置。

公开(公告)号：US20080296272A1

公开(公告)日：2008-12-04

申请号：US11756507

申请日：2007-05-31

Applicant: Weisheng Lei ,  Yunlong Sun ,  Yasu Osako ,  John Davignon ,  Glenn Simenson ,  Hisashi Matsumoto

Inventor： Weisheng Lei ,  Yunlong Sun ,  Yasu Osako ,  John Davignon ,  Glenn Simenson ,  Hisashi Matsumoto

IPC: B23K26/38

CPC classification number: H05K3/0038 ,  B23K26/389 ,  H01S3/0092 ,  H01S3/082 ,  H01S3/107 ,  H01S3/109 ,  H01S3/117 ,  H05K1/0366 ,  H05K3/0035 ,  H05K2203/108

Abstract: Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.

Abstract translation: 优选地衍生自单个激光束的双光束激光输出提高了在包括纤维增强树脂的目标材料（例如印刷电路板）中钻出的通孔的侧壁质量。 两个实施例各自使用两个激光输出部件来从工件的目标材料位置移除目标材料的一部分，并以材料去除速率快速地清洁与目标材料位置下方的金属层粘合的残留物。 第一实施例需要引导入射到目标材料位置处的目标材料的一部分，处理激光输出具有由相应的第一和第二波长表征的第一和第二分量。 第二实施例需要引导在目标材料位置处的目标材料的一部分上的入射，该处理激光输出具有由相应的第一和第二脉冲宽度表征的第一和第二分量。

公开(公告)号：US07301981B2

公开(公告)日：2007-11-27

申请号：US11067319

申请日：2005-02-25

Applicant: Yunlong Sun ,  Lei Sun

Inventor： Yunlong Sun ,  Lei Sun

IPC: H01S3/082

CPC classification number: H01S3/082 ,  B23K26/0622 ,  H01S3/07 ,  H01S3/0805 ,  H01S3/08086 ,  H01S3/083 ,  H01S3/10038 ,  H01S3/10046 ,  H01S3/109 ,  H01S3/117 ,  H01S3/127 ,  H01S3/1611

Abstract: A plurality of subresonators (12, 14), having different design configurations, share a common resonator section (18) such that the lasing action can be substantially synchronized to provide coherent laser pulses that merge the different respective pulse energy profile and/or pulse width characteristics imparted by the configurations of the subresonators (12, 14). The subresonators (12, 14) may share a laser medium (42) in the common section, or each distinct subresonator section (28, 36) may have its own laser medium (42). Exemplary long and short subresonators (12, 14) generate specially tailored laser pulses having a short rise time and a long pulse width at one wavelength or two different wavelengths that may be beneficial for a variety of laser and micromachining applications including memory link processing.

Abstract translation: 具有不同设计配置的多个子共振器（12,14）共享公共谐振器部分（18），使得激光作用可以基本上同步，以提供合并不同的相应脉冲能量分布和/或脉冲宽度的相干激光脉冲 通过子共振器（12,14）的构造赋予的特性。 子共振器（12,14）可以在公共部分中共享激光介质（42），或者每个不同的子谐振器部分（28,36）可以具有其自己的激光介质（42）。 示例性的长和短子谐振器（12,14）产生特定定制的激光脉冲，其具有在一个波长或两个不同波长处具有短的上升时间和长脉冲宽度，这可能对于包括存储器链路处理的各种激光和微加工应用有利。

公开(公告)号：US20070133627A1

公开(公告)日：2007-06-14

申请号：US11567150

申请日：2006-12-05

Applicant: Yunlong Sun

Inventor： Yunlong Sun

IPC: H01S3/11 ,  H01S3/098

CPC classification number: H01S3/1118 ,  B23K26/0624 ,  B23K26/083 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  H01S3/0602 ,  H01S3/0816 ,  H01S3/09415 ,  H01S3/11 ,  H01S3/117 ,  H01S3/1643

Abstract: A simultaneously mode-locked, Q-switched laser is configured to prevent loss of mode lock during laser operation. A preferred embodiment prevents loss of mode lock by operating the laser between the Q-switched pulses with a residual level of laser power sufficient to maintain a mode-locked state. The residual laser power output can be blocked by a pulse picking device.

Abstract translation: 同时锁模的Q开关激光器被配置为防止激光器操作期间模式锁定的损失。 优选实施例通过在具有足以维持锁模状态的激光功率的剩余水平的Q开关脉冲之间操作激光来防止模式锁定的损失。 剩余激光功率输出可以被脉冲拾取装置阻挡。

公开(公告)号：US20060131286A1

公开(公告)日：2006-06-22

申请号：US11291529

申请日：2005-11-30

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: B23K26/16 ,  B23K26/00 ,  B23K26/18 ,  B23K26/14

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060126678A1

公开(公告)日：2006-06-15

申请号：US11067319

申请日：2005-02-25

Applicant: Yunlong Sun ,  Lei Sun

Inventor： Yunlong Sun ,  Lei Sun

IPC: H01S3/13

CPC classification number: H01S3/082 ,  B23K26/0622 ,  H01S3/07 ,  H01S3/0805 ,  H01S3/08086 ,  H01S3/083 ,  H01S3/10038 ,  H01S3/10046 ,  H01S3/109 ,  H01S3/117 ,  H01S3/127 ,  H01S3/1611

Abstract: A plurality of subresonators (12, 14), having different design configurations, share a common resonator section (18) such that the lasing action can be substantially synchronized to provide coherent laser pulses that merge the different respective pulse energy profile and/or pulse width characteristics imparted by the configurations of the subresonators (12, 14). The subresonators (12, 14) may share a laser medium (42) in the common section, or each distinct subresonator section (28, 36) may have its own laser medium (42). Exemplary long and short subresonators (12, 14) generate specially tailored laser pulses having a short rise time and a long pulse width at one wavelength or two different wavelengths that may be beneficial for a variety of laser and micromachining applications including memory link processing.

Abstract translation: 具有不同设计配置的多个子共振器（12,14）共享公共谐振器部分（18），使得激光作用可以基本上同步，以提供合并不同的相应脉冲能量分布和/或脉冲宽度的相干激光脉冲 通过子共振器（12,14）的构造赋予的特性。 子共振器（12,14）可以在公共部分中共享激光介质（42），或者每个不同的子谐振器部分（28,36）可以具有其自己的激光介质（42）。 示例性的长和短子谐振器（12,14）产生特定定制的激光脉冲，其具有在一个波长或两个不同波长处具有短的上升时间和长脉冲宽度，这可能对于包括存储器链路处理的各种激光和微加工应用有利。