公开(公告)号：US08599890B2

公开(公告)日：2013-12-03

申请号：US12054811

申请日：2008-03-25

Applicant: Yunlong Sun ,  Feng Chang

Inventor： Yunlong Sun ,  Feng Chang

IPC: H01S3/13

CPC classification number: H01S3/0941 ,  H01S3/042 ,  H01S3/094076 ,  H01S3/10046 ,  H01S3/10069 ,  H01S3/1024 ,  H01S3/1068 ,  H01S3/117 ,  H01S3/1306

Abstract: Systems and methods provide laser pulse equalization at different pulse repetition frequencies (PRFs). After initially pumping a lasing medium from a first pumping level to a peak pumping level, a controller may cause a pump source to continue pumping the lasing medium according to a pulse equalization pumping curve. The equalization pumping curve may be determined based on testing laser pulse parameters at different PRFs to achieve an optimal equalization result of the pulse parameters. The optimization metric used to evaluate various equalization pumping curves may include a consistency of the pulse energy level, peak power level, and/or pulse width of the laser under different PRFs. The equalization pumping curve may be a descending curve from the peak pumping level to the first pumping level. The equalization pumping curve may be a linearly declining curve, a substantially exponentially declining curve, a parametrically declining curve, or any other curve type.

Abstract translation: 系统和方法提供不同脉冲重复频率（PRF）的激光脉冲均衡。 在初始将激光介质从第一泵浦电平泵送到峰值泵浦电平之后，控制器可以使泵浦源根据脉冲均衡泵送曲线继续泵浦激光介质。 可以基于在不同PRF下测试激光脉冲参数来确定均衡泵送曲线，以实现脉冲参数的最佳均衡结果。 用于评估各种均衡泵送曲线的优化度量可以包括不同PRF下的激光器的脉冲能级，峰值功率电平和/或脉冲宽度的一致性。 均衡泵送曲线可以是从峰值泵送电平到第一泵浦电平的下降曲线。 均衡泵送曲线可以是线性下降曲线，基本上呈指数下降曲线，参数下降曲线或任何其它曲线类型。

公开(公告)号：US20120250707A1

公开(公告)日：2012-10-04

申请号：US13076970

申请日：2011-03-31

Applicant: Fuyuan Lu ,  Feng Chang ,  Haisheng Wu ,  Yunlong Sun

Inventor： Fuyuan Lu ,  Feng Chang ,  Haisheng Wu ,  Yunlong Sun

IPC: H01S3/10

CPC classification number: H01S3/10015 ,  B23K26/0622 ,  B23K26/355 ,  B23K26/389 ,  H01S3/0064 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/06754 ,  H01S3/1618 ,  H01S3/1673 ,  H01S3/2316 ,  H01S3/2375 ,  H01S5/0428 ,  H01S5/06216 ,  H01S5/0622 ,  H01S5/0654

Abstract: A programmable tailored laser pulse generator including a pulsed seed laser source, a laser amplifier, and an optical power amplifier produces high power tailored laser pulses shaped in response to a programmable analog tailored pulse signal applied to a seed laser (first embodiment) or an external modulator of continuous-wave seed laser output (second embodiment). The programmable analog tailored pulse signal is generated by combining multiple individually programmable analog pulses generated by a multi-channel signal generator. A bias applied to the pulsed seed laser source generates pre-lasing prior to producing a tailored laser pulse so that the seed laser source spectral line and line width stabilize within a narrow gain line width of a solid-state laser amplifier, thereby to impart pulse peak stability of the laser output. The tailored laser pulse generator allows for generating harmonics at shorter wavelengths and provides an economical, reliable laser source for a variety of micromachining applications.

Abstract translation: 包括脉冲种子激光源，激光放大器和光功率放大器的可编程定制的激光脉冲发生器产生响应于施加到种子激光器的可编程模拟定制脉冲信号（第一实施例）或外部 连续波种子激光输出调制器（第二实施例）。 可编程模拟定制的脉冲信号通过组合由多通道信号发生器产生的多个单独可编程的模拟脉冲来产生。 施加到脉冲种子激光源的偏压在产生定制的激光脉冲之前产生预激光，使得种子激光源光谱线和线宽度稳定在固态激光放大器的窄增益线宽内，从而赋予脉冲 激光输出的峰值稳定性。 定制的激光脉冲发生器允许在较短波长处产生谐波，并为各种微加工应用提供经济可靠的激光源。

公开(公告)号：US20090245300A1

公开(公告)日：2009-10-01

申请号：US12054811

申请日：2008-03-25

Applicant: Yunlong Sun ,  Feng Chang

Inventor： Yunlong Sun ,  Feng Chang

IPC: H01S3/10

CPC classification number: H01S3/0941 ,  H01S3/042 ,  H01S3/094076 ,  H01S3/10046 ,  H01S3/10069 ,  H01S3/1024 ,  H01S3/1068 ,  H01S3/117 ,  H01S3/1306

Abstract: Systems and methods provide laser pulse equalization at different pulse repetition frequencies (PRFs). After initially pumping a lasing medium from a first pumping level to a peak pumping level, a controller may cause a pump source to continue pumping the lasing medium according to a pulse equalization pumping curve. The equalization pumping curve may be determined based on testing laser pulse parameters at different PRFs to achieve an optimal equalization result of the pulse parameters. The optimization metric used to evaluate various equalization pumping curves may include a consistency of the pulse energy level, peak power level, and/or pulse width of the laser under different PRFs. The equalization pumping curve may be a descending curve from the peak pumping level to the first pumping level. The equalization pumping curve may be a linearly declining curve, a substantially exponentially declining curve, a parametrically declining curve, or any other curve type.

Abstract translation: 系统和方法提供不同脉冲重复频率（PRF）的激光脉冲均衡。 在初始将激光介质从第一泵浦电平泵送到峰值泵浦电平之后，控制器可以使泵浦源根据脉冲均衡泵送曲线继续泵浦激光介质。 可以基于在不同PRF下测试激光脉冲参数来确定均衡泵送曲线，以实现脉冲参数的最佳均衡结果。 用于评估各种均衡泵送曲线的优化度量可以包括不同PRF下的激光器的脉冲能级，峰值功率电平和/或脉冲宽度的一致性。 均衡泵送曲线可以是从峰值泵送电平到第一泵浦电平的下降曲线。 均衡泵送曲线可以是线性下降曲线，基本上呈指数下降曲线，参数下降曲线或任何其它曲线类型。

公开(公告)号：US07741131B2

公开(公告)日：2010-06-22

申请号：US11754214

申请日：2007-05-25

Applicant: Yunlong Sun ,  Steve Harris

Inventor： Yunlong Sun ,  Steve Harris

IPC: H01L21/00

CPC classification number: H01L21/268 ,  H01L22/12

Abstract: A solution to an interference effect problem associated with laser processing of target structures entails adjusting laser pulse energy or other laser beam parameter, such as laser pulse temporal shape, based on light reflection information of the target structure and passivation layers stacked across a wafer surface or among multiple wafers in a group of wafers. Laser beam reflection measurements on a target link measurement structure and in a neighboring passivation layer area unoccupied by a link enable calculation of the laser pulse energy adjustment for a more consistent processing result without causing damage to the wafer. For thin film trimming on a wafer, similar reflection measurement information of the laser beam incident on the thin film structure and the passivation layer structure with no thin film present can also deliver the needed information for laser parameter selection to ensure better processing quality.

Abstract translation: 与目标结构的激光处理相关的干扰效应问题的解决方案需要基于目标结构的光反射信息和层叠在晶片表面上的钝化层来调整激光脉冲能量或其他激光束参数，例如激光脉冲时间形状，或者 在一组晶片中的多个晶片之间。 在目标链路测量结构上的激光束反射测量以及由链路未占据的相邻钝化层区域中的激光束反射测量使得能够计算激光脉冲能量调节以获得更一致的处理结果而不会损坏晶片。 对于晶片上的薄膜修整，入射到薄膜结构上的激光束的类似反射测量信息和不存在薄膜的钝化层结构也可以提供激光参数选择所需的信息，以确保更好的处理质量。

公开(公告)号：US20090245302A1

公开(公告)日：2009-10-01

申请号：US12060076

申请日：2008-03-31

Applicant: Brian W. Baird ,  Clint R. Vandergiessen ,  Steve Swaringen ,  Robert Hainsey ,  Yunlong Sun ,  Kelly J. Bruland ,  Andrew Hooper

Inventor： Brian W. Baird ,  Clint R. Vandergiessen ,  Steve Swaringen ,  Robert Hainsey ,  Yunlong Sun ,  Kelly J. Bruland ,  Andrew Hooper

IPC: H01S3/10

CPC classification number: H01S3/1305 ,  B23K26/0622 ,  H01S3/0057 ,  H01S3/102

Abstract: Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. The temporal pulse profile includes a first portion that defines a first time duration, and a second portion that defines a second time duration. A method includes generating a laser pulse based on laser system input parameters configured to shape the laser pulse according to the temporal pulse profile, detecting the generated laser pulse, comparing the generated laser pulse to the temporal pulse profile, and adjusting the laser system input parameters based on the comparison.

Abstract translation: 使用激光加工诸如半导体晶片或其他材料的工件包括选择对应于与预定义的时间脉冲轮廓相关联的目标类别的目标。 时间脉冲分布包括限定第一持续时间的第一部分和限定第二持续时间的第二部分。 一种方法包括：基于激光系统输入参数产生激光脉冲，所述激光系统输入参数被配置为根据时间脉冲分布来形成激光脉冲，检测所产生的激光脉冲，将所产生的激光脉冲与时间脉冲分布进行比较，以及调整激光系统输入参数 基于比较。

公开(公告)号：US07482551B2

公开(公告)日：2009-01-27

申请号：US11286132

申请日：2005-11-23

Applicant: Yunlong Sun ,  Edward J. Swenson ,  Richard S. Harris

Inventor： Yunlong Sun ,  Edward J. Swenson ,  Richard S. Harris

IPC: B23K26/02 ,  B23K26/08 ,  H01L21/77

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

Abstract translation: 使用一组（50）激光脉冲（52）来切断存储器或其它IC芯片中的导电链路（22）。 组（50）的持续时间优选短于1,000ns; 并且组（50）内的每个激光脉冲（52）的脉冲宽度优选在约0.1ps至30ns的范围内。 传统的激光定位系统（62）可将组（50）视为单个“脉冲”，以便在激光系统（60）激发一组（50）激光脉冲（50） 52）。 可以使用传统的IR波长或它们的谐波。

公开(公告)号：US20080296273A1

公开(公告)日：2008-12-04

申请号：US11757253

申请日：2007-06-01

Applicant: Weisheng Lei ,  Hisashi Matsumoto ,  Gregg Hardy ,  Yunlong Sun

Inventor： Weisheng Lei ,  Hisashi Matsumoto ,  Gregg Hardy ,  Yunlong Sun

IPC: B23K26/38

CPC classification number: B23K26/384 ,  B23K26/389 ,  B23K2101/36 ,  H05K3/0035 ,  H05K2201/09827

Abstract: A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO2 laser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.

Abstract translation: 用于在多层电子电路中钻出具有可选锥度的盲孔的方法和装置允许在层之间形成电连接，同时保持质量和生产量。 该方法依赖于识别定义锥度的通孔的顶部直径和通孔的底部直径是两个单独的方程组的函数。 这些方程的同时解决方案产生一个解空间，可以优化吞吐量，同时使用具有相同脉冲参数的临时未修改的Q开关CO2激光脉冲保持选定的锥度和质量。 不需要实时脉冲裁剪; 因此，系统复杂性和成本可能会降低。

公开(公告)号：US07241669B2

公开(公告)日：2007-07-10

申请号：US10887662

申请日：2004-07-09

Applicant: Edward J. Swenson ,  Yunlong Sun ,  Manoj Kumar Sammi ,  Jay Christopher Johnson ,  Doug Garcia ,  Rupendra M. Anklekar

Inventor： Edward J. Swenson ,  Yunlong Sun ,  Manoj Kumar Sammi ,  Jay Christopher Johnson ,  Doug Garcia ,  Rupendra M. Anklekar

IPC: H01L21/00

CPC classification number: B23K26/0622 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/52 ,  B28D5/0011 ,  H01L2224/16 ,  H01L2924/0102 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/09701 ,  Y10S438/94

Abstract: A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic or ceramic-like substrate such that a portion of the thickness of the substrate is removed. The UV laser beam forms a scribe line in the substrate without appreciable substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the substrate. Consequently, multiple depthwise cracks propagate into the thickness of the substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean fracture of the substrate into separate circuit components. The formation of this region facilitates higher precision fracture of the substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.

Abstract translation: 形成具有尖锐捕捉线的划线的方法需要沿着陶瓷或陶瓷状衬底引导UV激光束，使得去除衬底厚度的一部分。 UV激光束在衬底中形成划线，而没有明显的衬底熔化，使得明确限定的捕捉线形成延伸到衬底厚度的高应力集中区域。 因此，响应于施加到划线的任一侧的断裂力，多个深度裂纹在高应力集中区域中传播到基板的厚度中，以使基板清洁断裂成单独的电路部件。 该区域的形成促进了基板的高精度断裂，同时在施加破损力的同时保持了每个部件的内部结构的完整性。

公开(公告)号：US20060141680A1

公开(公告)日：2006-06-29

申请号：US11359216

申请日：2006-02-21

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: H01L21/82

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

Abstract translation: 使用一组（50）激光脉冲（52）来切断存储器或其它IC芯片中的导电链路（22）。 组（50）的持续时间优选短于1,000ns; 并且组（50）内的每个激光脉冲（52）的脉冲宽度优选在约0.1ps至30ns的范围内。 传统的激光定位系统（62）可将组（50）视为单个“脉冲”，以便在激光系统（60）激发一组（50）激光脉冲（50） 52）。 可以使用传统的IR波长或它们的谐波。

公开(公告)号：US20060138107A1

公开(公告)日：2006-06-29

申请号：US11360094

申请日：2006-02-22

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: B23K26/16

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.