Semiconductor device having localized insulated block in bulk substrate and related method
    31.
    发明授权
    Semiconductor device having localized insulated block in bulk substrate and related method 有权
    半导体器件在本体衬底中具有局部绝缘块及相关方法

    公开(公告)号:US07829429B1

    公开(公告)日:2010-11-09

    申请号:US11901688

    申请日:2007-09-18

    IPC分类号: H01L21/76 H01L29/00

    CPC分类号: H01L27/1207 H01L21/76264

    摘要: One or more trenches can be formed around a first portion of a semiconductor substrate, and an insulating layer can be formed under the first portion of the semiconductor substrate. The one or more trenches and the insulating layer electrically isolate the first portion of the substrate from a second portion of the substrate. The insulating layer can be formed by forming a buried layer in the substrate, such as a silicon germanium layer in a silicon substrate. One or more first trenches through the substrate to the buried layer can be formed, and open spaces can be formed in the buried layer (such as by using an etch selective to silicon germanium over silicon). The one or more first trenches and the open spaces can optionally be filled with insulative material(s). One or more second trenches can be formed and filled to isolate the first portion of the substrate.

    摘要翻译: 可以在半导体衬底的第一部分周围形成一个或多个沟槽,并且可以在半导体衬底的第一部分之下形成绝缘层。 一个或多个沟槽和绝缘层将衬底的第一部分与衬底的第二部分电隔离。 可以通过在硅衬底中的诸如硅锗层的衬底中形成掩埋层来形成绝缘层。 可以形成通过衬底到掩埋层的一个或多个第一沟槽,并且可以在掩埋层中形成开放空间(例如通过使用对硅上的硅锗的选择性蚀刻)。 一个或多个第一沟槽和开放空间可以可选地用绝缘材料填充。 可以形成并填充一个或多个第二沟槽以隔离衬底的第一部分。

    Semiconductor laser device and method of manufacture
    33.
    发明授权
    Semiconductor laser device and method of manufacture 有权
    半导体激光器件及其制造方法

    公开(公告)号:US06356571B1

    公开(公告)日:2002-03-12

    申请号:US09641003

    申请日:2000-08-17

    IPC分类号: H01B500

    摘要: A Vertical Cavity Surface Emitting Laser (VCSEL) (10) and a method for manufacturing the VCSEL (10). The VCSEL (10) includes a ridge structure (34), a first confinement layer (36) disposed adjacent to a portion of the ridge structure (34), and a second confinement layer (37) disposed on the first confinement layer (36) and disposed adjacent to a portion of the ridge structure (32). Carriers injected into the ridge structure (34) are confined by the first confinement layer (36).

    摘要翻译: 垂直腔面发射激光器(VCSEL)(10)和VCSEL(10)的制造方法。 VCSEL(10)包括脊结构(34),与脊结构(34)的一部分相邻设置的第一限制层(36)和设置在第一限制层(36)上的第二限制层(37) 并且邻近所述脊结构(32)的一部分设置。 注入到脊结构(34)中的载体被第一限制层(36)限制。

    Long wavelength vertical cavity surface emitting laser with
photodetector for automatic power control and method of fabrication
    34.
    发明授权
    Long wavelength vertical cavity surface emitting laser with photodetector for automatic power control and method of fabrication 失效
    长波长垂直腔表面发射激光器,具有用于自动功率控制的光电检测器和制造方法

    公开(公告)号:US5943357A

    公开(公告)日:1999-08-24

    申请号:US912605

    申请日:1997-08-18

    摘要: A long wavelength VCSEL with a photodetector, wherein the VCSEL includes a first and second stack of DBRs disposed on a first surface of a first substrate element, having an active region sandwiched therebetween, and a PIN photodetector including a first doped region disposed on a second substrate element, a undoped region disposed on the first doped region, and a second doped region disposed on the undoped region. The PIN photodetector is mounted to an opposed surface of the first substrate element, thereby monitoring a back VCSEL emission. The device is fabricated to allow for automatic power control (APC) of the VCSEL.

    摘要翻译: 一种具有光电检测器的长波长VCSEL,其中所述VCSEL包括布置在第一衬底元件的第一表面上的第一和第二堆叠DBR,所述第一和第二叠层的DBR具有夹在其间的有源区和PIN光检测器,所述PIN光检测器包括设置在第二衬底元件上的第一掺杂区域 衬底元件,设置在第一掺杂区域上的未掺杂区域,以及设置在未掺杂区域上的第二掺杂区域。 PIN光检测器安装在第一衬底元件的相对表面上,从而监测反向VCSEL发射。 该器件被制造成允许VCSEL的自动功率控制(APC)。

    Reliable near IR VCSEL
    35.
    发明授权
    Reliable near IR VCSEL 失效
    靠近IR VCSEL可靠

    公开(公告)号:US5832017A

    公开(公告)日:1998-11-03

    申请号:US616419

    申请日:1996-03-15

    IPC分类号: H01S5/183 H01S3/19 H01L21/20

    摘要: A near IR VCSEL including a mirror stack positioned on a substrate, formed of a plurality of pairs of relatively high and low index of refraction layers a second mirror stack formed of a plurality of pairs of relatively high and low index of refraction layers, an active region sandwiched between the first stack and the second stack, the active region being formed of active layers of GaInAsP having barrier layers of GaAlAs sandwiched therebetween.

    摘要翻译: 近红外VCSEL,包括位于基板上的反射镜堆叠,由多对相对较高和较低的折射率层组成,第二反射镜叠层由多对相对较高和较低的折射率折射率层组成,主动 区域夹在第一堆叠和第二堆叠之间,有源区域由具有夹在其间的GaAlAs阻挡层的GaInAsP的有源层形成。

    Method of growing gallium nitride on a spinel substrate
    36.
    发明授权
    Method of growing gallium nitride on a spinel substrate 失效
    在尖晶石衬底上生长氮化镓的方法

    公开(公告)号:US5741724A

    公开(公告)日:1998-04-21

    申请号:US774819

    申请日:1996-12-27

    摘要: A method of growing gallium nitride on a spinel substrate by providing a supporting substrate having a surface, and disposing a plurality of buffer layers on the surface of the supporting substrate. The plurality of buffer layers including a first buffer layer of aluminum oxynitride having a low percentage of mismatch to the spinel substrate. The second buffer layer is disposed on the first buffer layer and includes a plurality of layers of a graded aluminum oxynitride having a low dislocation density. A third buffer layer of aluminum nitride is disposed on the second buffer layer. A fourth buffer layer of gallium nitride is disposed on the third buffer layer. Subsequently, a photonic device structure, such as a laser, LED or detector, an electronic device structure, such as a field effect transistor or modulation doped field effect transistor, or an optical waveguide is fabricated on the fourth buffer layer.

    摘要翻译: 一种通过提供具有表面的支撑衬底在尖晶石衬底上生长氮化镓的方法,并且在支撑衬底的表面上设置多个缓冲层。 多个缓冲层包括与尖晶石衬底失配百分比低的氮氧化铝的第一缓冲层。 第二缓冲层设置在第一缓冲层上,并且包括具有低位错密度的多层梯度的氮氧化铝。 氮化铝的第三缓冲层设置在第二缓冲层上。 氮化镓的第四缓冲层设置在第三缓冲层上。 随后,在第四缓冲层上制造诸如激光,LED或检测器之类的光子器件结构,诸如场效应晶体管或调制掺杂场效应晶体管的电子器件结构或光波导。

    Short wavelength VCSEL
    37.
    发明授权
    Short wavelength VCSEL 失效
    短波长VCSEL

    公开(公告)号:US5638392A

    公开(公告)日:1997-06-10

    申请号:US441270

    申请日:1995-05-15

    摘要: A short wavelength vertical cavity surface emitting laser (101) is provided. A substrate (102) having a surface (103), wherein the substrate (102) includes gallium arsenide phosphide is formed. A first stack of mirrors (106) overlying the first surface (103) of the substrate (102) is formed. A first cladding region (107) is formed overlying the first stack of mirrors (106). An active region (108) is formed overlying the first cladding region (107). A second cladding region (109) is formed overlying the active region (108). A second stack of mirrors (110) is formed overlying the second cladding region (109). A contact region (126) is formed overlying the second stack of mirrors (110).

    摘要翻译: 提供了一种短波长垂直腔面发射激光器(101)。 具有表面(103)的基板(102),其中形成基板(102)包括砷化镓磷化物。 形成覆盖衬底(102)的第一表面(103)的第一叠反射镜(106)。 第一包层区域(107)形成在第一反射镜叠层(106)上。 在第一包层区(107)上形成有源区(108)。 第二包层区域(109)形成在有源区域(108)上。 在第二包层区域(109)上形成第二层反射镜(110)。 接触区域(126)形成在第二反射镜叠层(110)上。

    Short wavelength VCSEL with Al-free active region
    38.
    发明授权
    Short wavelength VCSEL with Al-free active region 失效
    具有无Al活性区域的短波长VCSEL

    公开(公告)号:US5633886A

    公开(公告)日:1997-05-27

    申请号:US520061

    申请日:1995-08-28

    摘要: A short wavelength VCSEL including a mirror stack positioned on a substrate, formed of a plurality of pairs of relatively high and low index of refraction layers a second mirror stack formed of a plurality of pairs of relatively high and low index of refraction layers, an active region sandwiched between the first stack and the second stack, the active region being formed of quantum well layers of GaAsP having barrier layers of GaInP sandwiched therebetween, the quantum well and barrier layers having substantially equal and opposite lattice mismatch.

    摘要翻译: 一种短波长VCSEL,其包括位于基板上的反射镜堆叠,由多对相对较高和较低的折射率折射率层组成,第二反射镜叠层由多对相对较高和较低的折射率折射率层组成, 区域夹在第一堆叠和第二堆叠之间,有源区域由GaAsP的量子阱层形成,其中GaInP的阻挡层夹在其间,量子阱和势垒层具有基本相等且相反的晶格失配。

    Composite wafer for fabrication of semiconductor devices
    39.
    发明授权
    Composite wafer for fabrication of semiconductor devices 有权
    用于制造半导体器件的复合晶片

    公开(公告)号:US08940620B2

    公开(公告)日:2015-01-27

    申请号:US13374206

    申请日:2011-12-15

    IPC分类号: H01L21/00

    CPC分类号: H01L21/2007 Y10T428/2495

    摘要: A composite wafer includes a first substrate having a first vertical thickness and a top surface, the top surface being prepared in a state for subsequent semiconductor material epitaxial deposition. A carrier substrate is disposed beneath the first substrate. The carrier substrate has a second vertical thickness greater than the first vertical thickness. An interlayer bonds the first substrate to the carrier substrate.

    摘要翻译: 复合晶片包括具有第一垂直厚度和顶表面的第一基板,该顶表面准备在随后的半导体材料外延沉积的状态。 载体基板设置在第一基板的下方。 载体衬底具有大于第一垂直厚度的第二垂直厚度。 中间层将第一衬底粘结到载体衬底上。