公开(公告)号：US07877873B2

公开(公告)日：2011-02-01

申请号：US12109307

申请日：2008-04-24

Applicant: Meng-Han Lee ,  Hung-En Hsu ,  Wei-Wen Lan ,  Yun-Hsiang Pai

Inventor： Meng-Han Lee ,  Hung-En Hsu ,  Wei-Wen Lan ,  Yun-Hsiang Pai

IPC: H01K3/10

CPC classification number: H05K3/243 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/28 ,  H05K3/42 ,  H05K2201/09881 ,  H05K2203/0723 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A method for forming a wire bonding substrate is disclosed. A substrate comprising a first surface and a second surface is provided. A through hole is formed in the substrate. A conductive layer is formed on the first surface and the second surface of the substrate and covers a sidewall of the through hole. The conductive layer on the first surface of the substrate is patterned to form at least a first conductive pad, and the conductive layer on the second surface of the substrate is patterned to form at least a second conductive pad. An insulating layer is formed on the first surface and the second surface of the substrate and covers the first conductive pad and the second conductive pad. The insulating layer is recessed until top surfaces of the first conductive pad and the second conductive pad are exposed. A first metal layer is electroplated on the first conductive pad by applying current from the second conductive pad to the first conductive pad through the conductive layer passing the through hole.

Abstract translation: 公开了一种用于形成引线键合衬底的方法。 提供了包括第一表面和第二表面的基底。 在基板上形成通孔。 在基板的第一表面和第二表面上形成导电层并且覆盖通孔的侧壁。 将衬底的第一表面上的导电层图案化以形成至少第一导电焊盘，并且将衬底的第二表面上的导电层图案化以形成至少第二导电焊盘。 在基板的第一表面和第二表面上形成绝缘层，并覆盖第一导电焊盘和第二导电焊盘。 绝缘层凹入，直到第一导电焊盘和第二导电焊盘的顶表面露出。 通过通过通孔的导电层将来自第二导电焊盘的电流施加到第一导电焊盘，使第一金属层电镀在第一导电焊盘上。

公开(公告)号：US20100098988A1

公开(公告)日：2010-04-22

申请号：US12358089

申请日：2009-01-22

Applicant: Wei-Kai Chang ,  Ming-Chou Tsai ,  Ching-Sen Yang ,  Chiang-Wen Lai

Inventor： Wei-Kai Chang ,  Ming-Chou Tsai ,  Ching-Sen Yang ,  Chiang-Wen Lai

IPC: H01M8/10 ,  H01M4/04

CPC classification number: H01M8/0273 ,  H01M8/028 ,  H01M8/0286 ,  H01M2008/1095 ,  Y10T29/49114

Abstract: A membrane electrode module is provided. The membrane electrode module includes a membrane electrode assembly, a first fixing element and a second fixing element. The membrane electrode assembly includes an exchange-membrane, a first electrode and a second electrode. The exchange-membrane includes a first surface and a second surface. The first electrode is disposed on the first surface. The second electrode is disposed on the second surface. The first fixing element contacts the first surface. The second fixing element contacts the second surface, wherein the first fixing element and the second fixing element are joined to the exchange-membrane via heat-pressing to be fixed to the exchange-membrane.

Abstract translation: 提供了膜电极模块。 膜电极模块包括膜电极组件，第一固定元件和第二固定元件。 膜电极组件包括交换膜，第一电极和第二电极。 交换膜包括第一表面和第二表面。 第一电极设置在第一表面上。 第二电极设置在第二表面上。 第一固定元件接触第一表面。 第二固定元件接触第二表面，其中第一固定元件和第二固定元件通过热压接合到交换膜以固定到交换膜。

公开(公告)号：US08469753B2

公开(公告)日：2013-06-25

申请号：US13304545

申请日：2011-11-25

Applicant: Shih-Tsung Lin ,  Yu-Shi Wong ,  Tzu-Yuan Hsu ,  Yu-Wei Chen

Inventor： Shih-Tsung Lin ,  Yu-Shi Wong ,  Tzu-Yuan Hsu ,  Yu-Wei Chen

IPC: H01R4/02

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A pin for a semiconductor device is disclosed. A connection head includes a plurality of curved protruded ribs and a plurality of recessed grooves. The curved protruded ribs and recessed grooves are alternately arranged. The curved protruded ribs radially extend from the center of the connection head. A pin stem is connected to the connection head.

Abstract translation: 公开了一种用于半导体器件的引脚。 连接头包括多个弯曲的突出肋和多个凹槽。 弯曲的突出肋和凹槽交替布置。 弯曲的突出肋从连接头的中心径向延伸。 销杆连接到连接头。

公开(公告)号：US08378225B2

公开(公告)日：2013-02-19

申请号：US12563975

申请日：2009-09-21

Applicant: Hsien-Chieh Lin

Inventor： Hsien-Chieh Lin

IPC: H05K1/03

CPC classification number: H05K3/3457 ,  H05K1/116 ,  H05K3/3452 ,  H05K3/4092 ,  H05K3/4644 ,  H05K2201/0397 ,  H05K2201/092 ,  H05K2201/09436 ,  H05K2201/09781 ,  H05K2203/043

Abstract: The invention provides a printed circuit board and method for fabricating the same. The printed circuit board includes a substrate having an internal circuit structure. An additional circuit structure is disposed on the substrate, electrically connected to the internal circuit structure. A solder mask insulating layer having an opening is disposed on the additional circuit structure. A conductive bump pattern is disposed in the solder mask insulating layer, wherein the conductive bump pattern extends into the opening horizontally, wherein a side, a portion of an upper surface and a portion of a lower surface of the conductive bump pattern are exposed from the opening. A solder ball is formed in the opening, wherein the solder ball is electrically connected to the additional circuit structure.

Abstract translation: 本发明提供一种印刷电路板及其制造方法。 印刷电路板包括具有内部电路结构的基板。 附加的电路结构设置在基板上，电连接到内部电路结构。 具有开口的焊接掩模绝缘层设置在附加电路结构上。 导电凸块图案设置在焊料掩模绝缘层中，其中导电凸块图案水平地延伸到开口中，其中导电凸块图案的一侧，上表面的一部分和下表面的一部分从 开放 在开口中形成焊球，其中焊球与附加电路结构电连接。

公开(公告)号：US20120043127A1

公开(公告)日：2012-02-23

申请号：US12956724

申请日：2010-11-30

Applicant: Hsien-Chieh LIN ,  Tung-Yu Chang

Inventor： Hsien-Chieh LIN ,  Tung-Yu Chang

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/0203 ,  H01L23/473 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2924/15153 ,  H05K1/0272 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/1469 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: The invention provides a printed circuit board and a method for fabricating the same. The printed circuit board includes a core substrate having a first surface and an opposite second surface. A first through hole and a second through hole are formed through a portion of the core substrate, respectively from the first surface and second surfaces, wherein the first and second through holes are laminated vertically and connect to each other. A first guide rail and a second guide rail are, respectively, formed through a portion of the core substrate and connected to the second through hole, so that a fluid flows sequentially from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board.

Abstract translation: 本发明提供一种印刷电路板及其制造方法。 印刷电路板包括具有第一表面和相对的第二表面的芯基板。 分别从第一表面和第二表面穿过芯基板的一部分形成第一通孔和第二通孔，其中第一和第二通孔垂直地层叠并且彼此连接。 第一导轨和第二导轨分别通过芯基板的一部分形成并连接到第二通孔，使得流体从印刷电路板的外部依次流过第一导轨， 第二通孔和第二导轨，连接到印刷电路板的外部。

公开(公告)号：US08058567B2

公开(公告)日：2011-11-15

申请号：US12175094

申请日：2008-07-17

Applicant: Meng-Han Lee ,  Wei-Wen Lan ,  Ching-Ming Chuang ,  Shi-Shyan James Shang

Inventor： Meng-Han Lee ,  Wei-Wen Lan ,  Ching-Ming Chuang ,  Shi-Shyan James Shang

IPC: H05K1/11

CPC classification number: H05K3/427 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2203/0554 ,  Y10T29/49165

Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).

Abstract translation: 本发明提供一种高密度封装基板及其制造方法。 提供含有上铜箔和下铜箔的双面铜箔层压板。 底部焊盘设置在下铜箔上，与通孔的预定位置对准。 通孔是通过激光钻孔穿过上铜箔和衬底形成的，而不是通过底垫。 种子层被形成为保形地衬在通孔上，并且通过电镀在种子层上形成金属层以形成电镀通孔（PTH）。

公开(公告)号：US08042445B2

公开(公告)日：2011-10-25

申请号：US12131753

申请日：2008-06-02

Applicant: Yu-Lun Lin ,  Chih-Ming Lin ,  Sung-Feng Yeh ,  Yu-Min Chen

Inventor： Yu-Lun Lin ,  Chih-Ming Lin ,  Sung-Feng Yeh ,  Yu-Min Chen

IPC: B26D3/08 ,  B26D7/06 ,  B26D5/08

CPC classification number: H05K3/4691 ,  H05K3/0044 ,  H05K3/4652 ,  H05K2201/09127 ,  H05K2203/0228 ,  Y10T83/0333 ,  Y10T83/2133 ,  Y10T83/8694

Abstract: A cutting mold for removing two opposite superfluous rigid circuit boards from a rigid-flexible circuit board. A first cutter is connected to a first moldboard. A first barricade is connected to the first moldboard. The maximum vertical distance from the first barricade to the first moldboard exceeds that from the first cutter to the first moldboard. A second moldboard is opposite the first moldboard. The first and second moldboards move with respect to each other. A second cutter is connected to the second moldboard and corresponds to the first cutter. A second barricade is connected to the second moldboard and detachably abuts the first barricade. The maximum vertical distance from the second barricade to the second moldboard exceeds that from the second cutter to the second moldboard. The first and second cutters cut the superfluous rigid circuit boards when the first and second moldboards move toward each other.

Abstract translation: 用于从刚性柔性电路板移除两个相对的多余刚性电路板的切割模具。 第一切割器连接到第一切割板。 第一个路障连接到第一个铺板。 从第一路障到第一刨花板的最大垂直距离超过从第一切割器到第一刨花板的垂直距离。 第二个刨花板与第一个刨花板相对。 第一和第二剥离板相对于彼此移动。 第二切割器连接到第二模板并对应于第一切割器。 第二路障连接到第二移动板并且可拆卸地邻接第一路障。 从第二轨道到第二模板的最大垂直距离超过从第二切割器到第二模板的垂直距离。 第一和第二切割器在第一和第二移印板朝向彼此移动时切割多余的刚性电路板。

公开(公告)号：US20100098976A1

公开(公告)日：2010-04-22

申请号：US12408983

申请日：2009-03-23

Applicant: Chien-Ping Yeh ,  Yu-Chun Ko ,  Chiang-Wen Lai

Inventor： Chien-Ping Yeh ,  Yu-Chun Ko ,  Chiang-Wen Lai

IPC: H01M8/00 ,  H01M8/04

CPC classification number: H01M8/04201 ,  H01M8/04552 ,  H01M8/04679 ,  H01M8/04753

Abstract: A fuel cell system and a method for checking for hydrogen leakage are provided. The fuel cell system includes a fuel cell module having at least one fuel cell. The fuel cell system further includes a valve coupled to the fuel cell module and a hydrogen source for allowing hydrogen to be passed to the fuel cell module or blocking hydrogen from being passed to the fuel cell module. The fuel cell system further includes a controller board coupled to the valve and the fuel cell module for checking output voltage of the at least one fuel cell to determine whether there is hydrogen leak. The control board controls the valve for blocking hydrogen from being passed to the fuel cell module when the control board determines that there is a hydrogen leak.

Abstract translation: 提供了一种用于检查氢气泄漏的燃料电池系统和方法。 燃料电池系统包括具有至少一个燃料电池的燃料电池模块。 燃料电池系统还包括联接到燃料电池模块的阀和用于允许氢气通过燃料电池模块或阻止氢气被传递到燃料电池模块的氢源。 燃料电池系统还包括联接到阀和燃料电池模块的控制器板，用于检查至少一个燃料电池的输出电压以确定是否存在氢气泄漏。 当控制板确定存在氢气泄漏时，控制板控制阀门阻止氢气传递到燃料电池模块。

公开(公告)号：US20090283315A1

公开(公告)日：2009-11-19

申请号：US12175094

申请日：2008-07-17

Applicant: Meng-Han Lee ,  Wei-Wen Lan ,  Ching-Ming Chuang ,  Shi-Shyan James Shang

Inventor： Meng-Han Lee ,  Wei-Wen Lan ,  Ching-Ming Chuang ,  Shi-Shyan James Shang

IPC: H05K3/42 ,  H05K1/02

CPC classification number: H05K3/427 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2203/0554 ,  Y10T29/49165

Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).

Abstract translation: 本发明提供一种高密度封装基板及其制造方法。 提供含有上铜箔和下铜箔的双面铜箔层压板。 底部焊盘设置在下铜箔上，与通孔的预定位置对准。 通孔是通过激光钻孔穿过上铜箔和衬底形成的，而不是通过底垫。 种子层被形成为保形地衬在通孔上，并且通过电镀在种子层上形成金属层以形成电镀通孔（PTH）。

公开(公告)号：US20090206487A1

公开(公告)日：2009-08-20

申请号：US12109307

申请日：2008-04-24

Applicant: Meng-Han Lee ,  Hung-En Hsu ,  Wei-Wen Lan ,  Yun-Hsiang Pai

Inventor： Meng-Han Lee ,  Hung-En Hsu ,  Wei-Wen Lan ,  Yun-Hsiang Pai

IPC: H01L23/49 ,  H01L21/44

CPC classification number: H05K3/243 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/28 ,  H05K3/42 ,  H05K2201/09881 ,  H05K2203/0723 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A method for forming a wire bonding substrate is disclosed. A substrate comprising a first surface and a second surface is provided. A through hole is formed in the substrate. A conductive layer is formed on the first surface and the second surface of the substrate and covers a sidewall of the through hole. The conductive layer on the first surface of the substrate is patterned to form at least a first conductive pad, and the conductive layer on the second surface of the substrate is patterned to form at least a second conductive pad. An insulating layer is formed on the first surface and the second surface of the substrate and covers the first conductive pad and the second conductive pad. The insulating layer is recessed until top surfaces of the first conductive pad and the second conductive pad are exposed. A first metal layer is electroplated on the first conductive pad by applying current from the second conductive pad to the first conductive pad through the conductive layer passing the through hole.

Abstract translation: 公开了一种用于形成引线键合衬底的方法。 提供了包括第一表面和第二表面的基底。 在基板上形成通孔。 在基板的第一表面和第二表面上形成导电层并且覆盖通孔的侧壁。 将衬底的第一表面上的导电层图案化以形成至少第一导电焊盘，并且将衬底的第二表面上的导电层图案化以形成至少第二导电焊盘。 在基板的第一表面和第二表面上形成绝缘层，并覆盖第一导电焊盘和第二导电焊盘。 绝缘层凹入，直到第一导电焊盘和第二导电焊盘的顶表面露出。 通过通过通孔的导电层将来自第二导电焊盘的电流施加到第一导电焊盘，使第一金属层电镀在第一导电焊盘上。