公开(公告)号：US07652384B2

公开(公告)日：2010-01-26

申请号：US11680600

申请日：2007-02-28

Applicant: Gabriel Matus ,  Vlad Novotny

Inventor： Gabriel Matus ,  Vlad Novotny

IPC: H01L23/29

CPC classification number: G03F7/0035 ,  B81C1/00619 ,  B81C2201/032 ,  B81C2203/0109 ,  B81C2203/019

Abstract: A micro structure includes a seed electrode layer on a substrate and a plurality of conductive layers on the seed electrode layer. The combined thickness of the seed electrode layer and the plurality of conductive layers can be more than 0.1 mm and the lateral dimensions of the seed electrode layer and the plurality of conductive layers vary less than 20% along the direction normal to a surface of the substrate and the micro structure has striations on an outer surface.

Abstract translation: 微结构包括在基底上的种子电极层和种子电极层上的多个导电层。 种子电极层和多个导电层的组合厚度可以大于0.1mm，并且种子电极层和多个导电层的横向尺寸沿着垂直于衬底表面的方向变化小于20％ 并且微结构在外表面上具有条纹。

公开(公告)号：US20080230390A1

公开(公告)日：2008-09-25

申请号：US11927309

申请日：2007-10-29

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US07384530B2

公开(公告)日：2008-06-10

申请号：US10841001

申请日：2004-05-07

Applicant: Adam L. Cohen ,  Dennis R. Smalley

Inventor： Adam L. Cohen ,  Dennis R. Smalley

IPC: C25D5/02 ,  C25D5/48

CPC classification number: B81C1/00126 ,  B33Y10/00 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/032 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: The invention includes methods of fabrication and apparatuses. In at least some embodiments of the applicants' invention, the methods include processes of: maskless selective deposition of non-layered structures, selective etching and/or deposition without use of a separate mask and/or lithography techniques, retaining selected portions of sacrificial material during removal (e.g. etching) of other portions of sacrificial material, depositing materials other than the structural and sacrificial materials, including more than one type of structural and/or sacrificial material, and fabrication of interlacing elements. Embodiments of the methods of the invention provide increased capabilities, properties, flexibility and in the fabrication of three-dimensional structures by electro-deposition or other techniques. In certain embodiments, the apparatuses of the invention include structures having non-layered elements, retained sacrificial materials, three or more different deposited materials, and interlaced elements.

Abstract translation: 本发明包括制造方法和装置。 在申请人的发明的至少一些实施例中，所述方法包括以下过程：无掩模地选择性沉积非分层结构，选择性蚀刻和/或沉积，而不使用单独的掩模和/或光刻技术，保留牺牲材料的选定部分 在牺牲材料的其它部分的去除（例如蚀刻）期间，沉积除结构和牺牲材料之外的材料，包括多于一种类型的结构和/或牺牲材料，以及制造隔行元件。 本发明的方法的实施例通过电沉积或其他技术提供增强的能力，性质，柔性和制造三维结构。 在某些实施例中，本发明的装置包括具有非层状元件，保留的牺牲材料，三种或更多种不同沉积材料和隔行元件的结构。

公开(公告)号：US20080110857A1

公开(公告)日：2008-05-15

申请号：US11927342

申请日：2007-10-29

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C23F1/00 ,  B23H3/00

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US07238429B2

公开(公告)日：2007-07-03

申请号：US10946051

申请日：2004-09-21

Applicant: Bruce Allan Cook ,  Yun Tian ,  Joel Lee Harringa ,  Alan Paul Constant ,  Alan Mark Russell ,  Palaniappa A. Molian

Inventor： Bruce Allan Cook ,  Yun Tian ,  Joel Lee Harringa ,  Alan Paul Constant ,  Alan Mark Russell ,  Palaniappa A. Molian

IPC: B32B15/20 ,  C23C14/34 ,  C23C14/16 ,  C22C21/00

CPC classification number: C23C14/067 ,  B81B3/0075 ,  B81C2201/032 ,  C23C14/28 ,  Y10S428/938 ,  Y10T428/12736 ,  Y10T428/1275 ,  Y10T428/31678

Abstract: Performance and reliability of microelectromechanical system (MEMS) components enhanced dramatically through the incorporation of protective thin film coatings. Current-generation MEMS devices prepared by the LIGA technique employ transition metals such as Ni, Cu, Fe, or alloys thereof, and hence lack stability in oxidizing, corrosive, and/or high temperature environments. Fabrication of a superhard, self-lubricating coating based on a ternary boride compound AlMgB14 is described in this letter as a potential breakthrough in protective coating technology for LIGA microdevices. Nanoindentation tests show that hardness of AlMgB14 films prepared by pulsed laser deposition ranges from 45 GPa to 51 GPa, when deposited at room temperature and 573 K, respectively. Extremely low friction coefficients of 0.04-0.05, which are thought to result from a self-lubricating effect, have also been confirmed by nanoscratch tests on the AlMgB14 films. Transmission electron microscopy studies show that the as-deposited films are amorphous, regardless of substrate temperature; however, analysis of FTIR spectra suggests that the higher substrate temperature facilitates formation of the B12 icosahedral framework, therefore leading to the higher hardness.

Abstract translation: 微机电系统（MEMS）组件的性能和可靠性通过并入保护性薄膜涂层而显着提高。 通过LIGA技术制备的当前一代MEMS器件采用过渡金属如Ni，Cu，Fe或其合金，因此在氧化，腐蚀性和/或高温环境中缺乏稳定性。 在本文中描述了基于三元硼化物AlMgB 14的超硬自润滑涂层的制造，作为LIGA微型器件的保护涂层技术的潜在突破。 纳米压痕测试显示，当分别在室温和573K下沉积时，通过脉冲激光沉积制备的AlMgB 14 N膜的硬度范围为45GPa至51GPa。 认为是由自润滑效应引起的非常低的摩擦系数0.04-0.05也已经通过AlMgB 14膜的纳米尺度试验证实。 透射电子显微镜研究表明，沉积膜是无定形的，不管基底温度如何; 然而，FTIR光谱的分析表明较高的底物温度有助于形成B 12二十面体骨架，因此导致更高的硬度。

公开(公告)号：US20060055090A1

公开(公告)日：2006-03-16

申请号：US10542613

申请日：2004-01-16

Applicant: Seung-seob Lee ,  Sang-Joon Moon

Inventor： Seung-seob Lee ,  Sang-Joon Moon

IPC: B29C35/08

CPC classification number: B81C99/0085 ,  A61B5/14514 ,  A61M37/0015 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C2201/032 ,  G03F7/00 ,  G03F7/0035

Abstract: The present invention relates to a method for manufacturing a micro needle array with an X-ray process. The present invention provides a method for manufacturing a micro needle array, comprising the steps of preparing an X-ray mask by forming an absorber having a configuration of the micro needle array on a substrate; preparing a PMMA cast for the micro needle array by exposing PMMA to vertical and inclined X-rays using the X-ray mask; preparing a flexible PDMS mold having a configuration opposite to that of the PMMA cast by pouring PDMS on the PMMA cast; filling an upper surface of the PDMS mold with a gel type of polymer to obtain a desired thickness of the polymer; patterning a desired configuration of a hole by irradiating UV rays on the polymer; and separating the PDMS mold to complete the polymer micro needle array. The micro needle array of the present invention is made of a polymer material and can be used for drawing blood from or injecting a medicine into the skin.

Abstract translation: 本发明涉及一种利用X射线处理制造微针阵列的方法。 本发明提供一种微针阵列的制造方法，其特征在于，包括以下步骤：在基板上形成具有微针阵列构造的吸收体，制作X射线掩模; 通过使用X射线掩模将PMMA暴露于垂直和倾斜的X射线，为微针阵列制备PMMA铸件; 通过将PDMS浇注在PMMA铸件上，制备具有与PMMA铸件相反的构型的柔性PDMS模具; 用凝胶型聚合物填充PDMS模具的上表面以获得所需的聚合物厚度; 通过在聚合物上照射紫外线来图案化所需的孔构型; 并分离PDMS模具以完成聚合物微针阵列。 本发明的微针阵列由聚合物材料制成，可用于将血液从药物中吸取或注入皮肤。

公开(公告)号：US20050100748A1

公开(公告)日：2005-05-12

申请号：US10946051

申请日：2004-09-21

Applicant: Bruce Cook ,  Yun Tian ,  Joel Harringa ,  Alan Constant ,  Alan Russell ,  Palaniappa Molian

Inventor： Bruce Cook ,  Yun Tian ,  Joel Harringa ,  Alan Constant ,  Alan Russell ,  Palaniappa Molian

IPC: B32B15/04 ,  B81B3/00 ,  B81B7/00 ,  C23C14/06 ,  C23C14/28 ,  C23C16/00

CPC classification number: C23C14/067 ,  B81B3/0075 ,  B81C2201/032 ,  C23C14/28 ,  Y10S428/938 ,  Y10T428/12736 ,  Y10T428/1275 ,  Y10T428/31678

Abstract: Performance and reliability of microelectromechanical system (MEMS) components enhanced dramatically through the incorporation of protective thin film coatings. Current-generation MEMS devices prepared by the LIGA technique employ transition metals such as Ni, Cu, Fe, or alloys thereof, and hence lack stability in oxidizing, corrosive, and/or high temperature environments. Fabrication of a superhard, self-lubricating coating based on a ternary boride compound AlMgB14 is described in this letter as a potential breakthrough in protective coating technology for LIGA microdevices. Nanoindentation tests show that hardness of AlMgB14 films prepared by pulsed laser deposition ranges from 45 GPa to 51 GPa, when deposited at room temperature and 573 K, respectively. Extremely low friction coefficients of 0.04-0.05, which are thought to result from a self-lubricating effect, have also been confirmed by nanoscratch tests on the AlMgB14 films. Transmission electron microscopy studies show that the as-deposited films are amorphous, regardless of substrate temperature; however, analysis of FTIR spectra suggests that the higher substrate temperature facilitates formation of the B12 icosahedral framework, therefore leading to the higher hardness.

Abstract translation: 微机电系统（MEMS）组件的性能和可靠性通过并入保护性薄膜涂层而显着提高。 通过LIGA技术制备的当前一代MEMS器件采用过渡金属如Ni，Cu，Fe或其合金，因此在氧化，腐蚀性和/或高温环境中缺乏稳定性。 在本文中描述了基于三元硼化物AlMgB 14的超硬自润滑涂层的制造，作为LIGA微型器件的保护涂层技术的潜在突破。 纳米压痕测试显示，当分别在室温和573K下沉积时，通过脉冲激光沉积制备的AlMgB 14 N膜的硬度范围为45GPa至51GPa。 认为是由自润滑效应引起的非常低的摩擦系数0.04-0.05也已经通过AlMgB 14膜的纳米尺度试验证实。 透射电子显微镜研究表明，沉积膜是无定形的，不管基底温度如何; 然而，FTIR光谱的分析表明较高的底物温度有助于形成B 12二十面体骨架，因此导致更高的硬度。

公开(公告)号：US20050023144A1

公开(公告)日：2005-02-03

申请号：US10841001

申请日：2004-05-07

Applicant: Adam Cohen ,  Dennis Smalley

Inventor： Adam Cohen ,  Dennis Smalley

IPC: B81B3/00 ,  G01P15/08 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/18 ,  H01P11/00 ,  H05K3/46 ,  H01L21/00 ,  C25D5/02

CPC classification number: B81C1/00126 ,  B33Y10/00 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/032 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: The invention includes methods of fabrication and apparatuses. In at least some embodiments of the applicants' invention, the methods include processes of: maskless selective deposition of non-layered structures, selective etching and/or deposition without use of a separate mask and/or lithography techniques, retaining selected portions of sacrificial material during removal (e.g. etching) of other portions of sacrificial material, depositing materials other than the structural and sacrificial materials, including more than one type of structural and/or sacrificial material, and fabrication of interlacing elements. Embodiments of the methods of the invention provide increased capabilities, properties, flexibility and in the fabrication of three-dimensional structures by electro-deposition or other techniques. In certain embodiments, the apparatuses of the invention include structures having non-layered elements, retained sacrificial materials, three or more different deposited materials, and interlaced elements.

Abstract translation: 本发明包括制造方法和装置。 在申请人的发明的至少一些实施例中，所述方法包括以下过程：无掩模地选择性沉积非分层结构，选择性蚀刻和/或沉积，而不使用单独的掩模和/或光刻技术，保留牺牲材料的选定部分 在牺牲材料的其它部分的去除（例如蚀刻）期间，沉积除结构和牺牲材料之外的材料，包括多于一种类型的结构和/或牺牲材料，以及制造隔行元件。 本发明的方法的实施例通过电沉积或其他技术提供增强的能力，性质，柔性和制造三维结构。 在某些实施例中，本发明的装置包括具有非层状元件，保留的牺牲材料，三种或更多种不同沉积材料和隔行元件的结构。

公开(公告)号：US06790377B1

公开(公告)日：2004-09-14

申请号：US09493496

申请日：2000-01-28

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C03C1500

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法包括形成层，所述层的形成包括：a）使基底与第一制品接触，所述第一制品包括以支持物的形式设置的支撑体和适形掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述衬底上，所述第一图案对应于所述适形掩模图案的所述补体; 以及c）从所述基底中去除所述第一制品。 该方法还可以包括以下一个或多个：（1）选择性地沉积或非选择性地沉积一种或多种附加材料以完成层的形成，（2）在每次沉积之后或在所有沉积之后平坦化沉积的材料，以及/ 或（3）形成与先前形成的层相邻的层，以从多个附着层建立结构。 还公开了电镀制品和电镀装置。

公开(公告)号：US20010014409A1

公开(公告)日：2001-08-16

申请号：US09823034

申请日：2001-03-29

Inventor： Adam L. Cohen

IPC: B21C037/00 ,  C25D001/00 ,  C25D001/10

CPC classification number: C25D1/003 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12431

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ion onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。