DEVICE FOR REDUCING AND HOMOGENIZING RESIDUAL STRESS OF A METAL FRAME

    公开(公告)号:US20220025500A1

    公开(公告)日:2022-01-27

    申请号:US17380090

    申请日:2021-07-20

    IPC分类号: C22F3/00 B06B1/02

    摘要: A device for reducing and homogenizing residual stress of a metal frame including a substrate, a frame fixing device and ultrasonic vibrators. A groove with an upward opening is provided in the middle of the substrate, and a shape enclosed by vertical side walls of the groove matches a shape of an outer frame of a metal frame to be processed. A plurality of through holes that are horizontally diverged are arranged around the side walls of the groove, and the through holes are vertically intersected with the groove. The ultrasonic vibrators are provided on the substrate and front ends of the ultrasonic vibrators extend into respective through holes to abut against the metal frame in the groove. The frame fixing device is also arranged in the groove where the metal frame is located, after the metal frame to be processed is placed in the groove.

    NICKEL-BASED BRAZING FOIL AND PROCESS FOR BRAZING

    公开(公告)号:US20190061033A1

    公开(公告)日:2019-02-28

    申请号:US16175598

    申请日:2018-10-30

    摘要: A process for producing an amorphous ductile brazing foil is provided. According to one example embodiment, the method includes providing a molten mass, and rapidly solidifying the molten mass on a moving cooling surface with a cooling speed of more than approximately 105° C./sec to produce an amorphous ductile brazing foil. A process for joining two or more parts is also provided. The process includes inserting a brazing foil between two or more parts to be joined, wherein the parts to be joined have a higher melting temperature than that the brazing foil to form a solder joint and the brazing foil comprises an amorphous, ductile Ni-based brazing foil; heating the solder joint to a temperature above the liquidus temperature of the brazing foil to form a heated solder joint; and cooling the heated solder joint, thereby forming a brazed joint between the parts to be joined.

    METHOD FOR REDUCING THE SPEED OF PROPAGATION OF A CRACK IN A METAL SUBSTRATE
    40.
    发明申请
    METHOD FOR REDUCING THE SPEED OF PROPAGATION OF A CRACK IN A METAL SUBSTRATE 审中-公开
    降低金属基体中裂纹传播速度的方法

    公开(公告)号:US20160348223A1

    公开(公告)日:2016-12-01

    申请号:US15153091

    申请日:2016-05-12

    IPC分类号: C22F1/04 C22F3/00 B23K26/035

    摘要: A method for reducing the speed of propagation of a crack in a metal substrate by means of laser heat treatment can include heating the metal substrate with a laser heat treatment at one or more crack ends, wherein the laser beam is guided over the substrate surface so that it defines the form of an oval, an arc or a curve. Alternatively, the substrate can be treated by means of laser heat treatment before a crack arises. For example, areas at risk of cracking are identified in a metal substrate and the metal substrate is then heated by means of laser heat treatment in these areas, wherein the laser beam is guided over the substrate surface so that it defines the form of an oval, an arc or a curve. Also disclosed herein are metal substrates produced by the method and the use thereof.

    摘要翻译: 通过激光热处理来降低金属基板中的裂纹传播速度的方法可以包括在一个或多个裂纹端处用激光热处理来加热金属基板,其中激光束被引导到基板表面上 它定义了椭圆形,弧形或曲线的形式。 或者,可以在产生裂纹之前通过激光热处理来处理基板。 例如,在金属基板中识别有破裂危险的区域,然后通过在这些区域中的激光热处理来加热金属基板,其中激光束被引导到基板表面上,使得其限定椭圆形 ,弧或曲线。 本文还公开了通过该方法及其用途制造的金属基底。