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公开(公告)号：US20240047981A1
公开(公告)日：2024-02-08
申请号：US18211629
申请日：2023-06-20
发明人： Daisuke UEO , Ryota TANABE , Yohei IMAI
CPC分类号： H02J7/00308 , H02J7/0068 , H02M3/155
摘要： Disclosed herein is a power supply device and a control method for the power supply device. The power supply device includes: a battery; an external interface electrically connected to the battery and electrically attachable to or detachable from an external device; a voltage converter provided between the battery and the external interface; a low-voltage circuit that branches from an interface connection circuit connecting the external interface and the voltage converter and is connected to a low-voltage load having a rated voltage lower than a voltage of the battery; an interrupt circuit provided in the low-voltage circuit and configured to electrically interrupt the low-voltage circuit and the interface connection circuit; and an electronic control unit configured to control operations of the voltage converter and the interrupt circuit. The electronic control unit operates the interrupt circuit when a voltage of the interface connection circuit exceeds the rated voltage of the low-voltage load.
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公开(公告)号：US11888393B2
公开(公告)日：2024-01-30
申请号：US17537595
申请日：2021-11-30
发明人： Muthusubramanian Venkateswaran , Rohit Narula , Preetam Charan Anand Tadeparthy , Matthew John Ascher Schurmann , Rajesh Venugopal
CPC分类号： H02M3/155 , H02M1/08 , H02M1/32 , H02M1/36 , H02M3/1586
摘要： A multiphase controller includes an integrator enable terminal, a pulse width modulator, an error integrator, an open drain driver, and an integrator enable circuit. The integrator enable terminal is adapted to be coupled to the integrator enable terminal of a different instance of the multiphase controller. The pulse width modulator is configured to modulate a power stage. The error integrator is configured to control the pulse width modulator. The open drain driver is coupled to the integrator enable circuit. The integrator enable circuit is coupled to the pulse width modulator, the error integrator, the open drain driver, and the integrator enable terminal. The integrator enable circuit is configured to activate the open drain driver responsive to generation of a power stage control pulse by the pulse width modulator, and activate the error integrator responsive to a logic low signal at the integrator enable terminal.
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33.发明授权公开(公告)号：US11880249B2
公开(公告)日：2024-01-23
申请号：US17766759
申请日：2020-09-30
摘要： Provided is a an electronic system (1) comprising a plurality of sub blocks (21, 22, . . . ), a differential amplifier (3), a voltage regulation loop comprising a first transistor (40) and a variable resistor (5), and a plurality of additional transistors (41, 42, . . . ). The input reference voltage (VRF) and the variable resistor are configured such that a first sub block (21) is supplied with its required power supply output voltage (VDD1) by the transistor to which it is connected. The amplifier is configured to output on each of its outputs a power supply reference voltage (VG1, VG2 . . . ) such that each sub block (22, . . . ) other than the first sub block is supplied with its required power supply output voltage (VDD2 . . . ) by the transistor to which it is connected.
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公开(公告)号：US11876449B2
公开(公告)日：2024-01-16
申请号：US16894701
申请日：2020-06-05
发明人： Akinori Hamada , Yoshimasa Yoshioka , Hayami Kudo , Shinji Yasuda
IPC分类号： H01F17/00 , H02M3/158 , G06F1/16 , G06F1/3296 , H01F1/03 , H01F27/255 , H01F27/28 , H01F27/29 , H01F27/32 , H02M3/155
CPC分类号： H02M3/158 , G06F1/1635 , G06F1/3296 , H01F1/0306 , H01F17/0013 , H01F27/255 , H01F27/2823 , H01F27/29 , H01F27/32 , H01F2017/0066 , H02M3/155
摘要： An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 μm, the wire pitch of the spiral wires is equal to or smaller than 10 μm, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 μm.
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公开(公告)号：US11876445B2
公开(公告)日：2024-01-16
申请号：US17062819
申请日：2020-10-05
发明人： Yong Zhou , Danny Clavette , Jens A. Ejury , Prasan Kasturi , Kushal Kshirsagar
CPC分类号： H02M3/155 , H02M1/32 , H02M1/0009
摘要： An apparatus such as a power supply includes a controller and multiple power converter phases. The controller controls operation of the multiple power converter phases to produce an output voltage that powers a load. The multiple power converter phases are coupled in parallel to convert an input voltage into an output voltage. The controller further controls a flow of current through a series circuit path connecting multiple windings of the multiple power converter phases to operate the power supply in different modes.
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公开(公告)号：US11862996B2
公开(公告)日：2024-01-02
申请号：US17811797
申请日：2022-07-11
发明人： Daniel M. Kinzer , Santosh Sharma , Ju Jason Zhang
IPC分类号： H02M3/158 , H02J7/00 , H01L23/495 , H01L27/02 , H01L23/62 , H02M1/088 , H03K3/012 , H01L29/20 , H03K17/10 , H03K19/0185 , H01L25/07 , H02M3/157 , H03K3/356 , H01L27/088 , H01L23/528 , H01L29/10 , H01L29/40 , H01L29/417 , H02M1/00 , H02M3/155
CPC分类号： H02J7/00 , H01L23/49503 , H01L23/49562 , H01L23/49575 , H01L23/528 , H01L23/62 , H01L25/072 , H01L27/0248 , H01L27/088 , H01L27/0883 , H01L29/1033 , H01L29/2003 , H01L29/402 , H01L29/41758 , H02M1/088 , H02M3/157 , H02M3/1584 , H02M3/1588 , H03K3/012 , H03K3/356017 , H03K17/102 , H03K19/018507 , H01L2924/00 , H01L2924/0002 , H02M1/0048 , H02M3/155 , Y02B40/00 , Y02B70/10 , H01L2924/0002 , H01L2924/00
摘要： GaN-based half bridge power conversion circuits employ control, support and logic functions that are monolithically integrated on the same devices as the power transistors. In some embodiments a low side GaN device communicates through one or more level shift circuits with a high side GaN device. Various embodiments of level shift circuits and their inventive aspects are disclosed.
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37.发明公开公开(公告)号：US20230421040A1
公开(公告)日：2023-12-28
申请号：US17851997
申请日：2022-06-28
申请人： Intel Corporation
发明人： Tamir Salus , Shunjiang Xu , Christopher Schaef
CPC分类号： H02M1/0043 , H02M1/088 , H02M3/155 , H02M1/0012
摘要： Techniques and mechanisms for facilitating a scalable delivery of current to an inductor of a voltage regulator. In an embodiment, a hardware interface of integrated circuit (IC) die accommodates coupling of the IC die to multiple inductors. The hardware interface comprises contacts which are each to couple the IC die to a respective one of the multiple inductors. A phase circuit of the IC die includes multiple cells which are each coupled to a different respective contact of a plurality of contacts of the hardware interface. A digital controller of the IC die is operable to select any of various combinations of the multiple cells each to conduct a respective current with a corresponding one of the plurality of contacts. In another embodiment, the plurality of contacts are arranged as a multi-row, multi-column array.
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公开(公告)号：US11835550B2
公开(公告)日：2023-12-05
申请号：US17399152
申请日：2021-08-11
发明人： Reynaldo Domingo
摘要： An apparatus includes a power supply monitor operative to monitor a status of multiple power converters. Based on the monitored status, the power supply monitor detects an event associated with a first power converter of the multiple power converters. The power supply monitor communicates a notification of the event to a management entity. The notification is encoded to include an identity of the first power converter experiencing the event as determined by the power supply monitor or other suitable entity.
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公开(公告)号：US20230386963A1
公开(公告)日：2023-11-30
申请号：US17828803
申请日：2022-05-31
IPC分类号： H01L23/373 , H01L23/66 , H01L23/12 , H01L23/498 , H02M3/155 , H01L25/18 , H01L23/00
CPC分类号： H01L23/3735 , H01L23/66 , H01L23/12 , H01L23/49811 , H02M3/155 , H01L25/18 , H01L24/48 , H01L2924/1033 , H01L2224/05567
摘要： A power converter module includes a substrate having a first surface and a second surface that opposes the first surface. The power converter module includes a thick printed copper (TPC) substrate on the first surface of the substrate. The TPC substrate includes a first layer having TPC patterned on the first surface of the substrate and a second layer with dielectric patterned on the first layer. The TPC substrate includes a third layer having TPC patterned on the second layer. The power converter module includes power transistors mounted on the TPC substrate and a control integrated circuit (IC) chip mounted on the TPC substrate.
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公开(公告)号：US11817780B2
公开(公告)日：2023-11-14
申请号：US17288957
申请日：2019-10-21
发明人： Kei Takahashi , Takeshi Aoki
IPC分类号： H02M3/155 , H02M1/00 , H01L27/12 , H01L29/786 , H10B12/00
CPC分类号： H02M3/155 , H01L27/124 , H01L27/1207 , H01L27/1225 , H01L27/1255 , H01L29/7869 , H01L29/78648 , H02M1/0009 , H10B12/00
摘要： A power supply circuit with a novel structure is provided. The power supply circuit includes a power converter circuit supplying power to a load; a current sensing circuit generating a first signal including data on a current flowing through the load; a voltage sensing circuit generating a second signal including data on a voltage applied to the load; a correction circuit that includes a digital filter, a digital-analog converter circuit to which a signal output from the digital filter is input, and a sample-and-hold circuit for retaining a signal output from the digital-analog converter circuit and generates a third signal obtained by correcting the second signal; a selection circuit selecting the first signal or the third signal; an output circuit generating an output signal for controlling the power converter circuit in accordance with the signal selected by the selection circuit; and a control signal generation circuit controlling switching between a first operation for generating the output signal in accordance with the first signal and generating the third signal and a second operation for generating the output signal in accordance with the third signal.
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