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公开(公告)号:US12112057B2
公开(公告)日:2024-10-08
申请号:US17861233
申请日:2022-07-10
Applicant: Micron Technology, Inc.
Inventor: Marco Sforzin , Daniele Balluchi
IPC: G06F3/06
CPC classification number: G06F3/0655 , G06F3/0604 , G06F3/0673
Abstract: Systems, apparatuses, and methods related to a flip-on-precharge disable operation are described herein. In an example, a flip-on-precharge disable operation can include activating a set of memory cells in a memory device to perform a memory access. The memory device can include a plurality of sets of memory cells corresponding to respective portions of an array of memory cells of the memory device. The flip-on-precharge disable operation can further include receiving signaling indicative of a command for a precharge operation on a set of the plurality of sets of memory cells. The signaling can include one or more bits that indicates whether to disable a randomly performed flip operation on the set of memory cells. The flip-on-precharge disable operation can include, in response to the one or more bits indicating to disable the flip operation, performing the precharge operation without randomly performing the flip operation on the set of memory cells.
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公开(公告)号:US12111781B2
公开(公告)日:2024-10-08
申请号:US18119576
申请日:2023-03-09
Applicant: Micron Technology, Inc.
Inventor: Eric N. Lee , Leonid Minz , Yoav Weinberg , Ali Feiz Zarrin Ghalam , Luigi Pilolli
CPC classification number: G06F13/30 , G06F13/1668
Abstract: A memory device includes a memory array and processing logic, operatively coupled with the memory array, to perform operations including causing a data burst to be initiated by toggling a logical level of a control pin from a first level corresponding to a data burst inactive mode to a second level corresponding to a data burst active mode, wherein the data burst corresponds to a data transfer across an interface bus, causing the data burst to be suspended by toggling the logical level of the control pin from the second level to a third level corresponding to a data burst suspend mode, and causing the data burst to be resumed by toggling the logical level of the control pin from the third level to the second level.
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公开(公告)号:US12111761B2
公开(公告)日:2024-10-08
申请号:US17688506
申请日:2022-03-07
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Luca Bert
IPC: G06F12/0808 , G06F12/0871
CPC classification number: G06F12/0808 , G06F12/0871 , G06F2212/50
Abstract: A first data item is programmed to a first memory page of a first block included in a cache that resides in a first portion of a memory device. The first data item is associated with a first processing thread. A second memory page including a second data item associated with the first processing thread is identified. The second memory page is contained by a second block of the cache. The first data item and the second data item are copied to a second portion of the memory device. The first memory page and each of the one or more second memory pages are designated as invalid.
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公开(公告)号:US12111724B2
公开(公告)日:2024-10-08
申请号:US17648395
申请日:2022-01-19
Applicant: Micron Technology, Inc.
Inventor: Chun Sum Yeung , Jonathan S. Parry , Deping He , Xiangang Luo , Reshmi Basu
CPC classification number: G06F11/1068 , G06F11/1076
Abstract: Methods, systems, and devices for redundant array management techniques are described. A memory system may include a volatile memory device, a non-volatile memory device, and one or more redundant arrays of independent nodes. The memory system may include a first redundant array controller and a second redundant array controller of a redundant array of independent nodes. The memory system may receive a write command associated with writing data to a type of memory cell. Based on the type of memory cell, the memory system may generate parity data corresponding to the data using one or both of the first redundant array controller and the second redundant array controller. In some examples, the first redundant array controller may be configured to generate parity data associated with a first type of failure and the second redundant array controller may be configured to generate parity data associated with a second type of failure.
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公开(公告)号:US20240332257A1
公开(公告)日:2024-10-03
申请号:US18734765
申请日:2024-06-05
Applicant: Micron Technology, Inc.
Inventor: Michael G. Placke , Tony Brewer
IPC: H01L25/065 , H01L23/00
CPC classification number: H01L25/0655 , H01L24/16
Abstract: A chiplet-based system comprises a substrate including conductive interconnect and multiple chiplets arranged on the interposer and interconnected using the conductive interconnect of the substrate. A chiplet includes multiple columns of multiple input-output (I/O) channels and the I/O channels are connected to a block of I/O pads and each side of the chiplet includes multiple blocks of the I/O pads. The multiple blocks of I/O pads on the side of the chiplet are arranged symmetrically relative to a centerline of the chiplet and each block of I/O pads on the side of the chiplet is at a common distance from any adjacent block of I/O pads on the side.
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公开(公告)号:US20240332179A1
公开(公告)日:2024-10-03
申请号:US18615285
申请日:2024-03-25
Applicant: Micron Technology, Inc.
Inventor: Rajasekhar Venigalla , Justin David Shepherdson , Hiroaki Iuchi , Vladimir Samara
IPC: H01L23/528 , G11C16/04 , H01L21/768 , H10B41/20 , H10B41/35 , H10B43/20 , H10B43/35
CPC classification number: H01L23/5283 , G11C16/0483 , H01L21/76843 , H10B41/20 , H10B41/35 , H10B43/20 , H10B43/35
Abstract: A method for making a vertical contact through levels of a memory device. A first liner is formed in an opening, and a second liner is formed over the first liner. The first liner is selectively removed from under the second liner to expose a first portion of the opening, such that the first liner remains intact over a second portion of the opening. The second liner is then removed, leaving the first liner overlying the second portion of the opening. A first portion of each of the layers of nitride materials in the first portion of the opening uncovered by the first liner is removed, the second portion of the first liner is removed, and a second portion of each of the layers of the nitride materials is removed in the second portion of the opening, wherein the second portion is less than the first portion.
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公开(公告)号:US20240331780A1
公开(公告)日:2024-10-03
申请号:US18738908
申请日:2024-06-10
Applicant: Micron Technology, Inc.
Inventor: Bruce A. LIIKANEN , Larry J. KOUDELE , Michael SHEPEREK
CPC classification number: G11C16/3404 , G11C5/04 , G11C11/5628 , G11C11/5642 , G11C16/3459 , G11C2211/5623 , G11C2211/5624 , G11C2211/5625
Abstract: A processing device determines a plurality of computing error metrics that are indicative of operational characteristics between programming distributions within the memory device. The processing device performs a program targeting operation on a memory cell of the memory device to calibrate one or more program verify (PV) targets associated with the programming distributions. Performing the program targeting operation comprises the processing device selecting a rule from a predefined set of rules based on the plurality of computing error metrics, wherein the predefined set of rules corresponds to an adjusting of a PV target of a last programming distribution. In addition, the processing device adjusts, based on the selected rule, the one or more PV targets of a plurality of PV targets associated with the programming distributions, wherein the one or more PV targets correspond to one or more respective voltage values for programming memory cells of the memory device.
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公开(公告)号:US20240331778A1
公开(公告)日:2024-10-03
申请号:US18744146
申请日:2024-06-14
Applicant: Micron Technology, Inc.
Inventor: Mustafa N. Kaynak , Patrick R. Khayat , Sivagnanam Parthasarathy
CPC classification number: G11C16/26 , G06F3/0604 , G06F3/0655 , G06F3/0679 , G11C16/3459 , G11C16/0483
Abstract: Embodiments disclosed can include selecting a target read window budget (RWB) increase and identifying a set of aggressor memory cells. They can also include generating a list of programming level states for the set of aggressor memory cells and identifying, in the list, an entry associated with a maximum RWB increase that is greater than or equal to the target RWB increase. They can further include responsive to identifying the entry with the total number of bits associated with a maximum RWB increase that is greater than or equal to the target RWB increase, modifying a parameter of the memory access operation with the adjustment associated with the identified entry.
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公开(公告)号:US20240331777A1
公开(公告)日:2024-10-03
申请号:US18615051
申请日:2024-03-25
Applicant: Micron Technology, Inc.
Inventor: Li-Te Chang , Charles S. Kwong , Murong Lang , Zhenming Zhou
CPC classification number: G11C16/26 , G06N20/00 , G11C16/0483
Abstract: Various embodiments use a cascade model to determine (e.g., predict or estimate) one or more read level voltage offsets used to read data from one or more memory cells of a memory device, which can be part of a memory sub-system.
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公开(公告)号:US20240331763A1
公开(公告)日:2024-10-03
申请号:US18591798
申请日:2024-02-29
Applicant: MICRON TECHNOLOGY, INC.
Inventor: TAKAMASA SUZUKI , NOBUO YAMAMOTO , IZUMI NAKAI
IPC: G11C11/4096 , G11C11/4074 , G11C11/4091
CPC classification number: G11C11/4096 , G11C11/4074 , G11C11/4091
Abstract: Apparatuses and methods for reducing standby current in memory array access circuits are disclosed. An example apparatus includes a activation voltage supply line and a sense amplifier coupled to the activation voltage supply line. The sense amplifier is configured to be activated by an activation voltage provided on the activation voltage supply line. A read-write circuit is coupled to a pair of local input/output lines and a pair of global input/output lines, and further coupled to the activation voltage supply line. The read-write circuit is configured to drive the pair global input/output lines based on voltages of the pair of local input/output lines when activated for a read operation and further configured to drive the pair of local input/output lines based on voltages of the pair of global input/output lines when activated for a write operation.
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