公开(公告)号：US09991996B2

公开(公告)日：2018-06-05

申请号：US15006191

申请日：2016-01-26

Applicant: STMicroelectronics, Inc.

Inventor： Liwen Chu ,  George A. Vlantis

IPC: H04L5/00 ,  H04L1/16 ,  H04W72/12 ,  H04W72/04 ,  H04W74/08 ,  H04W84/12

CPC classification number: H04L5/003 ,  H04L1/16 ,  H04L1/1607 ,  H04L1/1854 ,  H04L5/0007 ,  H04L5/0037 ,  H04W72/04 ,  H04W72/121 ,  H04W72/1289 ,  H04W74/0816 ,  H04W84/12

Abstract: An access point (AP) contends for a medium during a contention period in order to obtain exclusive control of the medium for a certain time period that may include one or more transmission opportunities. The AP and client stations (STAs) communicate during the time period using orthogonal frequency division multiple access (OFDMA) techniques with scheduled use (i.e., allocation) of sub-channels of the medium. The AP controls this scheduling for down-link and up-link communications by sending control signaling to inform the STAs of the resource allocation schedule which specifies STAs involved in the OFDMA communications along with the sub-channel identification bandwidth allocated to each STA. The control signaling may be a combination of physical layer (PHY) and medium access control layer (MAC) communicated information.

公开(公告)号：US09983353B2

公开(公告)日：2018-05-29

申请号：US14933095

申请日：2015-11-05

Applicant: STMicroelectronics, Inc.

Inventor： Qing Liu

IPC: G02B6/10 ,  G02B6/136 ,  G02B6/122 ,  C30B29/06 ,  C30B23/04 ,  C30B25/04 ,  G02B6/13 ,  G02B6/12 ,  G02B6/032

CPC classification number: G02B6/107 ,  C30B23/04 ,  C30B25/04 ,  C30B29/06 ,  G02B6/032 ,  G02B6/122 ,  G02B6/131 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12173 ,  G02B2006/12176

Abstract: A strip of sacrificial semiconductor material is formed on top of a non-sacrificial semiconductor material substrate layer. A conformal layer of the non-sacrificial semiconductor material is epitaxially grown to cover the substrate layer and the strip of sacrificial semiconductor material. An etch is performed to selectively remove the strip of sacrificial semiconductor material and leave a hollow channel surrounded by the conformal layer and the substrate layer. Using an anneal, the conformal layer and the substrate layer are reflowed to produce an optical waveguide structure including the hollow channel.

公开(公告)号：US20180144991A1

公开(公告)日：2018-05-24

申请号：US15874813

申请日：2018-01-18

Applicant: STMICROELECTRONICS, INC.

Inventor： Nicolas Loubet ,  Pierre Morin ,  Yann Mignot

IPC: H01L21/8238 ,  H01L29/417 ,  H01L29/78

CPC classification number: H01L21/823821 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/76224 ,  H01L21/823807 ,  H01L21/823878 ,  H01L27/0922 ,  H01L27/0924 ,  H01L29/0649 ,  H01L29/165 ,  H01L29/41791 ,  H01L29/4916 ,  H01L29/7842 ,  H01L29/785

Abstract: Integrated circuits are disclosed in which the strain properties of adjacent pFETs and nFETs are independently adjustable. The pFETs include compressive-strained SiGe on a silicon substrate, while the nFETs include tensile-strained silicon on a strain-relaxed SiGe substrate. Adjacent n-type and p-type FinFETs are separated by electrically insulating regions formed by a damascene process. During formation of the insulating regions, the SiGe substrate supporting the n-type devices is permitted to relax elastically, thereby limiting defect formation in the crystal lattice of the SiGe substrate.

公开(公告)号：US20180138898A1

公开(公告)日：2018-05-17

申请号：US15351542

申请日：2016-11-15

Applicant: STMicroelectronics, Inc.

Inventor： Pavan Nallamothu

IPC: H03K3/012 ,  H03K17/687 ,  G05F1/575

CPC classification number: H03K3/012 ,  G05F1/575 ,  H03K17/687

Abstract: A voltage generator circuit uses a feedback loop to regulate an output voltage at an output node. A pair of opposite conductivity source-follower transistors are coupled to the output node. A first one of the source-follower transistors operates to provide a fast current transient for charging a capacitive load that is switchably connected to the output node. A second one of the source-follower transistor operate under feedback control to regulate the voltage level at the output node.

公开(公告)号：US20180130767A1

公开(公告)日：2018-05-10

申请号：US15863079

申请日：2018-01-05

Applicant: STMICROELECTRONICS, INC.

Inventor： Jefferson Talledo

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L24/85 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49544 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00015

Abstract: A method is for making a semiconductor device. The method may include providing a lead frame having a recess, forming a sacrificial material in the recess of the lead frame, and mounting an IC on the lead frame. The method may include encapsulating the IC and the lead frame, removing portions of the lead frame to define lead frame contacts for the IC, and removing the sacrificial material to define for each lead frame contact a solder anchoring tab extending outwardly at a lower region and defining a sidewall recess between opposing portions of the solder anchoring tab and the encapsulation material.

公开(公告)号：US20180130623A1

公开(公告)日：2018-05-10

申请号：US15866552

申请日：2018-01-10

Applicant: STMicroelectronics, Inc.

Inventor： Thomas L. Hopkins

IPC: H01H35/02 ,  H01H35/14 ,  D06F75/26 ,  G05B9/02

CPC classification number: H01H35/02 ,  D06F75/26 ,  G05B9/02 ,  H01H35/14 ,  H01H2231/012

Abstract: A protective circuit for an apparatus includes an accelerometer having an output and a microcontroller coupled to the output of the accelerometer. The protective circuit also includes a switch for controlling the apparatus coupled to an output of the microcontroller and a load coupled to the switch. A power source is coupled to the load and the switch. In operation the microcontroller is cable of sending a signal to the switch to turn of power to the load when a dangerous condition as detected from the accelerometer data has occurred.

公开(公告)号：US09964777B2

公开(公告)日：2018-05-08

申请号：US14976937

申请日：2015-12-21

Applicant: STMicroelectronics, Inc.

Inventor： Mark A. Lysinger ,  Chih-Hung Tai ,  James L. Worley ,  Pavan Nallamothu

IPC: G02B27/64 ,  H02K41/035 ,  H02P7/025

CPC classification number: G02B27/646 ,  H02K41/0356 ,  H02P7/025

Abstract: Various embodiments provide an optical image stabilization circuit including a drive circuit having a power waveform generator and a power waveform conversion circuit. The power waveform generator generates a power waveform. The power waveform conversion circuit converts the power waveform to a power drive signal. An actuator is then driven by the power drive signal to move a lens accordingly and compensate for any movements and vibrations of a housing of the lens.

公开(公告)号：US20180096923A1

公开(公告)日：2018-04-05

申请号：US15281800

申请日：2016-09-30

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo

IPC: H01L23/498 ,  H01L23/495 ,  H01L21/48

CPC classification number: H01L23/49805 ,  H01L21/481 ,  H01L21/4825 ,  H01L21/4828 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49558 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The present disclosure is directed to a semiconductor die on a tapeless leadframe and covered in encapsulant. The semiconductor package includes leads formed from the leadframe and electrically coupled to the semiconductor die, the leads being accessible through electrical contacts embedded in the encapsulant. Openings between the leads and the leadframe are formed from etching recesses from opposing sides of the leadframe. The resulting openings have non-uniform sidewalls. The leadframe is further electrically or thermally coupled to electrical contacts embedded in the encapsulant. The embedded electrical contacts forming a land grid array.

公开(公告)号：US20180091324A1

公开(公告)日：2018-03-29

申请号：US15830167

申请日：2017-12-04

Applicant: STMicroelectronics, Inc.

Inventor： Oleg Logvinov ,  Bo Zhang ,  Huijuan Liu ,  Michael John Macaluso ,  James D. Allen

IPC: H04L12/18 ,  H04L12/40 ,  H04B3/54 ,  B60R16/023 ,  H04L29/08

Abstract: A powerline communications apparatus includes a transceiver communicating over an electrical power distribution wiring of a vehicle and a communications interface carrying a first and second PLC message in a first communication protocol having a PLC automotive network delimiter type, a PLCAN variant field comprising a number of users, user identifications, payload length, payload data, and a repetition number corresponding to a number of times the first PLC message is transmitted over the electrical power distribution wiring, and a first payload for a first user. The PLC apparatus also includes a processor and a non-transitory computer-readable medium storing programming for execution by the processor. The programming includes instructions for transmitting the first PLC message using the transceiver, determining if the vehicle is in motion, and switching between the first and the second communication protocol based on whether the vehicle is determined to be in motion.

公开(公告)号：US20180089848A1

公开(公告)日：2018-03-29

申请号：US15476100

申请日：2017-03-31

Applicant: STMicroelectronics (Research & Development) Limited ,  STMicroelectronics, Inc.

Inventor： Xiaoyong YANG ,  Neale DUTTON

IPC: G06T7/55 ,  G06T7/521 ,  G06T7/73 ,  H04N5/235

CPC classification number: G06T7/55 ,  G01S7/48 ,  G01S7/4802 ,  G01S7/497 ,  G01S17/023 ,  G01S17/026 ,  G01S17/89 ,  G06K9/00255 ,  G06T7/521 ,  G06T7/74 ,  G06T2207/10028 ,  G07C9/00158 ,  H04N5/2354

Abstract: An apparatus includes time of flight single-photon avalanche diode (ToF SPAD) circuitry. The ToF SPAD circuitry generates indications of distance between the apparatus and an object within a field of view. A processor receives the indications of distance and controls at least one image sensor, such as a camera, to capture at least one image based on at least one indication of distance. The processor determines whether an image is a true representation of an expected object by comparing multiple indications of distance associated with the object to an expected object distance profile and comparing the image to at least one expected object image.