公开(公告)号：US20250118578A1

公开(公告)日：2025-04-10

申请号：US18484165

申请日：2023-10-10

Applicant: Applied Materials, Inc.

Inventor： Ajith Karonnan Ramapurath ,  Jian Li ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/66 ,  H01L21/683

Abstract: Exemplary substrate support assemblies may include a support plate that comprises a substrate support surface. The assemblies may include a support stem coupled with the support plate. A channel may be defined through at least a portion of a length of the support stem and extends through the substrate support surface. A temperature sensor assembly may be disposed within the channel. The temperature sensor assembly may include a light pipe disposed within the channel such that a top end of the light pipe extending through at least a portion of the support plate. The temperature sensor assembly may include a sensor that is coupled with a bottom end of the light pipe.

公开(公告)号：US20250118576A1

公开(公告)日：2025-04-10

申请号：US18391089

申请日：2023-12-20

Applicant: Applied Materials, Inc.

Inventor： Chen-Ying WU ,  Zuoming ZHU ,  Abhishek DUBE ,  Ala MORADIAN ,  Errol Antonio C. SANCHEZ ,  Martin Jeffrey SALINAS ,  Aniketnitin PATIL ,  Raja Murali DHAMODHARAN ,  Shu-Kwan LAU

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

Abstract: Embodiments of the present disclosure relate to chamber kits, processing chambers, and related methods and components for gas activation applicable for semiconductor manufacturing. In one or more embodiments, a processing chamber includes a chamber body and one or more heat sources configured to heat a processing volume of the chamber body. The chamber body includes one or more gas inject passages formed in the chamber body, and one or more gas exhaust passages formed in the chamber body. The processing chamber includes a first pre-heat ring that includes a first opaque surface, and a second pre-heat ring that includes a second opaque surface. The first pre-heat ring and the second pre-heat ring define a first gas flow path between the first opaque surface and the second opaque surface, and the first gas flow path in fluid communication with at least one of the one or more gas inject passages.

公开(公告)号：US20250117915A1

公开(公告)日：2025-04-10

申请号：US18482209

申请日：2023-10-06

Applicant: Applied Materials, Inc.

Inventor： Navneet Kumar Singh ,  Arun Ramaswamy Srivatsa ,  Sachin Dangayach ,  Zvi Hersh Goldshtein ,  Rahul Reddy Komatireddi ,  Sutapa Dutta ,  Arv Nagpal ,  Yen-Tien Wu

IPC: G06T7/00

Abstract: Implementations disclosed describe, among other things, a systems and techniques for perform efficient inspection of a semiconductor manufacturing sample. The techniques include collecting optical inspection data for training sample(s) that have a plurality of defects. The techniques further include generating, using the optical inspection data, a training data set that includes descriptions, images, and ground truth classifications for the defects. The techniques further include using the training data set to train a plurality of machine learning (ML) classifiers to generate predicted classifications for the defects in the training sample(s). The techniques further include selecting, using the predicted classifications and the ground truth classifications, one or more ML classifiers that meet one or more accuracy criteria, and using the selected ML classifier(s) to classify defects in the semiconductor manufacturing sample.

公开(公告)号：US20250117561A1

公开(公告)日：2025-04-10

申请号：US18482544

申请日：2023-10-06

Applicant: Applied Materials, Inc.

Inventor： Benjamin D. Briggs

IPC: G06F30/392 ,  G03F7/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/14 ,  H01L23/538

Abstract: A semiconductor device may include a substrate. The semiconductor device may also include a dielectric material characterized, at least in part, by a dielectric constant. The semiconductor device may include a metallic pathway formed in the dielectric material. The semiconductor device may include a region about the metallic pathway of the semiconductor device may include a plurality of air gaps within the dielectric material and arranged three-dimensionally throughout the region, where the region may include a lower dielectric constant than the dielectric constant of the dielectric material.

公开(公告)号：US20250117002A1

公开(公告)日：2025-04-10

申请号：US18481171

申请日：2023-10-04

Applicant: Applied Materials, Inc.

Inventor： Geethanzali Kamalanathan ,  Vivek Bharat Shah ,  John Poulose ,  Ghadeh Hadi

IPC: G05B19/418

Abstract: A method includes identifying a target substrate process operation start time. The start time corresponds to a time of initiation of one or more substrate process actions. The method further includes providing to a model first one or more parameters of a gas transfer system associated with the substrate process operation. The method further includes obtaining first output from the model. The first output includes an indication of a first preemptive time period for initiation of first one or more gas delivery actions. The method further includes updating a process recipe. The process recipe is updated in accordance with the first preemptive time period. Updating the process recipe is to cause the first one or more gas delivery actions to deliver a first process gas to a process chamber within a threshold time window of the substrate process operation start time.

公开(公告)号：US20250114908A1

公开(公告)日：2025-04-10

申请号：US18483070

申请日：2023-10-09

Applicant: Applied Materials, Inc.

Inventor： Nai-Chieh Huang ,  Akshay Aravindan ,  Shih-Haur Shen ,  Jianshe Tang ,  Jay Gurusamy ,  Chen-Wei Chang ,  Chih-Han Yang ,  Wei Lu

IPC: B24B53/017

Abstract: A system may include a gimbal defining a plurality of pockets, where each pocket may include a first portion and a second portion that extends between the first portion and a base of the pocket. The second portion may have a greater diameter than the first portion. The system may include a plurality of conditioning disks, where each conditioning disk is seated within the first portion of a respective pocket. The system may include a plurality of gaskets, where each gasket is seated within the second portion of a respective pocket. The system may include a plurality o-rings, each o-ring disposed between a peripheral edge of one of the plurality of conditioning disks and a lateral wall of one of the plurality of pockets. The system may include a plurality of shoulder screws for coupling the gimbal with one of the plurality of gaskets and a conditioning disk.

公开(公告)号：US20250114901A1

公开(公告)日：2025-04-10

申请号：US18377615

申请日：2023-10-06

Applicant: Applied Materials, Inc.

Inventor： Zhize Zhu ,  Brian J. Brown ,  Christopher Heung-Gyun Lee ,  Huyen Tran ,  Huanbo Zhang ,  Eric Lau ,  Ekaterina A. Mikhaylichenko

IPC: B24B37/26 ,  B24B37/04

Abstract: A method for chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, dispensing a polishing liquid onto the polishing pad, and oscillating the substrate laterally across the polishing pad. The polishing pad has a polishing-rate adjustment groove that is concentric with the axis of rotation, and a coolant, a dilutant, or both, is dispensed into the polishing-rate adjustment groove such that a polishing rate is reduced in an annular zone of the polishing pad that is positioned radially inward of the polishing-rate adjustment groove. The annular zone surrounds a central zone of the polishing pad in which a polishing rate is not substantially affected by the coolant, dilutant, or both.

公开(公告)号：US20250114898A1

公开(公告)日：2025-04-10

申请号：US18377599

申请日：2023-10-06

Applicant: Applied Materials, Inc.

Inventor： Zhize Zhu ,  Brian J. Brown ,  Christopher Heung-Gyun Lee ,  Huyen Tran ,  Huanbo Zhang ,  Eric Lau ,  Ekaterina A. Mikhaylichenko

IPC: B24B37/10 ,  B24B37/32 ,  B24B57/02

Abstract: A method for chemical mechanical polishing includes bringing a substrate into contact with a polishing pad, causing relative motion between the substrate and polishing pad, dispensing a polishing liquid onto the polishing pad, holding the substrate in a lateral position with a retaining ring secured to a carrier head, and rotating the carrier head about an axis of rotation. The retaining ring has a plurality of channels extending from an inner diameter surface of the retaining ring to an outer diameter surface of the retaining ring such that rotation cause the polishing liquid to be preferentially expelled from a region below an outer edge of the substrate through the plurality of channels.

公开(公告)号：US20250114897A1

公开(公告)日：2025-04-10

申请号：US18377591

申请日：2023-10-06

Applicant: Applied Materials, Inc.

Inventor： Zhize Zhu ,  Brian J. Brown ,  Christopher Heung-Gyun Lee ,  Huyen Tran ,  Huanbo Zhang ,  Eric Lau ,  Ekaterina A. Mikhaylichenko

IPC: B24B37/04 ,  B24B37/005 ,  B24B37/24 ,  B24B37/26

Abstract: A polishing pad has a polishing layer having a polishing surface that has a circular central region and an annular outer region surrounding the central region. The polishing surface can include slurry distribution grooves formed with uniformity spacing across the central region and the annular outer region, and slurry discharge grooves that start at an outer perimeter of the circular central region and extend radially outward to an edge of the polishing pad so as to preferentially discharge the polishing liquid from the annular outer region. The central region can be formed of a first polishing material and the annular outer region can be formed of a second polishing material that is softer than the first polishing material.

公开(公告)号：US20250114740A1

公开(公告)日：2025-04-10

申请号：US18377138

申请日：2023-10-05

Applicant: Applied Materials, Inc.

Inventor： Ryan T. DOWNEY ,  Shaun W. CRAWFORD

IPC: B01D53/18 ,  B01D53/14 ,  B01D53/32 ,  C23C16/44

Abstract: Disclosed herein are an auxiliary abatement device for abating effluent gases, an abatement system including the auxiliary abatement device, and an abatement method for the abatement system. The auxiliary abatement device includes a first chamber comprising a first inlet configured to receive the effluent gases; and a second chamber configured to treat the effluent gases and comprising a second inlet configured to receive a reagent, a first outlet configured to output treated effluent gases, and a second outlet configured to output a byproduct produced by treating the effluent gases. The first chamber and the second chamber are coupled by a conduit. The abatement system includes a plasma unit and an auxiliary abatement device to partially treat the effluent gases. The abatement system utilizes a primary abatement unit disposed downstream of the plasma unit and the auxiliary abatement device to treat the effluent gases in bulk.