公开(公告)号：US09230959B2

公开(公告)日：2016-01-05

申请号：US13314942

申请日：2011-12-08

Applicant: Cheng-Hung Chang ,  Chen-Hua Yu ,  Chen-Nan Yeh

Inventor： Cheng-Hung Chang ,  Chen-Hua Yu ,  Chen-Nan Yeh

IPC: H01L21/00 ,  H01L27/088 ,  H01L21/8234 ,  H01L27/12 ,  H01L29/78

CPC classification number: H01L29/1083 ,  H01L21/823412 ,  H01L21/823431 ,  H01L21/823481 ,  H01L27/088 ,  H01L27/1203 ,  H01L27/1207 ,  H01L29/0653 ,  H01L29/7843 ,  H01L29/7851

Abstract: A semiconductor structure includes a semiconductor substrate; a planar transistor on a first portion of the semiconductor substrate, wherein the first portion of the semiconductor substrate has a first top surface; and a multiple-gate transistor on a second portion of the semiconductor substrate. The second portion of the semiconductor substrate is recessed from the first top surface to form a fin of the multiple-gate transistor. The fin is electrically isolated from the semiconductor substrate by an insulator.

公开(公告)号：US20150316497A1

公开(公告)日：2015-11-05

申请号：US14266309

申请日：2014-04-30

Applicant: Cheng-Hung CHANG

Inventor： Cheng-Hung CHANG

IPC: G01N27/12 ,  G01N33/24

CPC classification number: G01N33/24 ,  G01N27/121 ,  G01N33/246

Abstract: A wireless subsoil tension meter is disclosed, including an upper housing part, a middle housing part, a lower housing part, and a sensor module. The upper, middle and lower housing parts are assembled to form a sealed space to house a sensor module and liquid. The upper housing part has a tubular body shape. The middle housing part has a funnel body shape, with a larger top and the smaller bottom, the top end of the middle housing part is slightly smaller than the inside the bottom end of the outer tube of the upper housing part for easy assembly and tight fit. The lower housing part is has an elongated dome shape. When assembled, the sensor module is housed inside the assembly, which can further be applied to an extendable wireless soil measurement apparatus.

Abstract translation: 公开了一种无线底土张力计，包括上壳体部分，中部壳体部分，下壳体部分和传感器模块。 上部，中部和下部壳体部件被组装以形成密封空间以容纳传感器模块和液体。 上部壳体部分具有管状体形状。 中间壳体部分具有漏斗体形状，具有较大的顶部和较小的底部，中间壳体部分的顶端略小于上壳体部分的外管的底端的内侧，以便于组装和紧固 适合。 下壳体部分具有细长的圆顶形状。 组装后，传感器模块收纳在组件的内部，可进一步应用于可扩展的无线土壤测量装置。

公开(公告)号：US20150168594A1

公开(公告)日：2015-06-18

申请号：US14105799

申请日：2013-12-13

Applicant: Cheng-Hung CHANG

Inventor： Cheng-Hung CHANG

IPC: G01V9/00

CPC classification number: G01V9/00 ,  A01C21/007 ,  A01G25/167 ,  G01N2033/245

Abstract: A two-tier wireless soil measurement apparatus is disclosed, including a top head and a plurality of sensors, wherein the top head being placed on or above the ground and the plurality of sensors being buried under the soil for sensing soil conditions, generating soil data representing the sensed soil conditions, and transmitting generated soil conditions to the top head; the plurality of sensors able to be assembled into a pole and each of the plurality of sensors including a sensor unit for sensing a soil condition; a circuit module connected to the sensor unit for transmitting sensed soil condition to the top head, a sensor housing for housing the sensor unit and the circuit module; and an engaging element for engaging two sensors in a head-to-tail manner for form a pole.

Abstract translation: 公开了一种双层无线土壤测量装置，其包括顶部头部和多个传感器，其中顶部头部放置在地面上或上方，并且多个传感器被埋在土壤下以便感测土壤条件，产生土壤数据 代表感测到的土壤条件，并将产生的土壤条件发送到顶部头部; 所述多个传感器能够被组装成一个极，并且所述多个传感器中的每一个包括用于感测土壤条件的传感器单元; 连接到传感器单元的电路模块，用于将感测到的土壤状况传送到顶部头部;传感器壳体，用于容纳传感器单元和电路模块; 以及用于以头对尾方式接合两个传感器以形成杆的接合元件。

公开(公告)号：US08519792B2

公开(公告)日：2013-08-27

申请号：US12784646

申请日：2010-05-21

Applicant: Wen Ying Chang ,  Cheng Hung Chang ,  Ying Ju Chen

Inventor： Wen Ying Chang ,  Cheng Hung Chang ,  Ying Ju Chen

IPC: H03F3/45

CPC classification number: H03F3/45475 ,  A61B5/0402 ,  A61B5/0476 ,  A61B5/0488 ,  A61B5/0496 ,  A61N1/08 ,  A61N1/3702 ,  A61N1/3712 ,  A61N1/3925 ,  A61N1/3937 ,  H03F3/4595 ,  H03F2200/261 ,  H03F2200/411 ,  H03F2203/45544 ,  H03F2203/45591 ,  H03F2203/45594 ,  H03G1/0035

Abstract: A differential voltage sensing method for achieving input impedance matching comprises the steps of: providing a first bio-potential signal to a first variable resistor for generating a first signal; providing a second bio-potential signal to a second variable resistor for generating a second signal; differentially amplifying first and second signals for generating a third signal; selecting an operation band of the third signal for generating first and second logic signals; and dynamically adjusting one of the impedances of the first and second variable resistors according to the first and second logic signals, wherein each of the first and second bio-potential signals has a common signal voltage level and a differential signal voltage level.

Abstract translation: 用于实现输入阻抗匹配的差分电压感测方法包括以下步骤：向第一可变电阻器提供第一生物电位信号以产生第一信号; 向第二可变电阻器提供第二生物电位信号以产生第二信号; 差分放大用于产生第三信号的第一和第二信号; 选择用于产生第一和第二逻辑信号的第三信号的操作频带; 以及根据第一和第二逻辑信号动态调整第一和第二可变电阻器的阻抗之一，其中第一和第二生物电位信号中的每一个具有公共信号电压电平和差分信号电压电平。

公开(公告)号：US08487410B2

公开(公告)日：2013-07-16

申请号：US13085668

申请日：2011-04-13

Applicant: Chen-Hua Yu ,  Cheng-Hung Chang ,  Ebin Liao ,  Chia-Lin Yu ,  Hsiang-Yi Wang ,  Chun Hua Chang ,  Li-Hsien Huang ,  Darryl Kuo ,  Tsang-Jiuh Wu ,  Wen-Chih Chiou

Inventor： Chen-Hua Yu ,  Cheng-Hung Chang ,  Ebin Liao ,  Chia-Lin Yu ,  Hsiang-Yi Wang ,  Chun Hua Chang ,  Li-Hsien Huang ,  Darryl Kuo ,  Tsang-Jiuh Wu ,  Wen-Chih Chiou

IPC: H01L29/40

CPC classification number: H01L21/76898 ,  H01L21/02271 ,  H01L21/02274 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76831 ,  H01L21/76832 ,  H01L21/76844 ,  H01L21/76846 ,  H01L23/481 ,  H01L23/49827 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor component includes a semiconductor substrate having a top surface. An opening extends from the top surface into the semiconductor substrate. The opening includes an interior surface. A first dielectric liner having a first compressive stress is disposed on the interior surface of the opening. A second dielectric liner having a tensile stress is disposed on the first dielectric liner. A third dielectric liner having a second compressive stress disposed on the second dielectric liner. A metal barrier layer is disposed on the third dielectric liner. A conductive material is disposed on the metal barrier layer and fills the opening.

公开(公告)号：US20130165813A1

公开(公告)日：2013-06-27

申请号：US13448297

申请日：2012-04-16

Applicant: Cheng-Hung Chang ,  Kuan-Jen Fang ,  Chun-Hsiang Huang ,  Chueh-Shan Liu ,  Yii-Tay Chiou ,  Yung-Ching Huang

Inventor： Cheng-Hung Chang ,  Kuan-Jen Fang ,  Chun-Hsiang Huang ,  Chueh-Shan Liu ,  Yii-Tay Chiou ,  Yung-Ching Huang

IPC: A61B5/0488 ,  A61B5/11

CPC classification number: A61B5/0492 ,  A61B5/1107 ,  A61B5/4519 ,  A61B2562/0219

Abstract: A sensor for acquiring EMG and MMG signals is provided, including a substrate, an inertial sensing element received in a hole of the substrate, a circuit element disposed on the substrate, a plurality of electrical connecting members connecting the inertial sensing element with the substrate, and a sensing ring disposed on the substrate and surrounding the hole. The electrical connecting members are flexible, and the circuit element and the sensing ring are disposed on opposite sides of the substrate.

Abstract translation: 提供一种用于获取EMG和MMG信号的传感器，包括基板，接收在基板的孔中的惯性感测元件，设置在基板上的电路元件，连接惯性感测元件与基板的多个电连接构件， 以及设置在基板上并围绕孔的感测环。 电连接构件是柔性的，并且电路元件和感测环设置在基板的相对侧上。

公开(公告)号：US08306597B2

公开(公告)日：2012-11-06

申请号：US12721513

申请日：2010-03-10

Applicant: Wen-Ying Chang ,  Cheng-Hung Chang

Inventor： Wen-Ying Chang ,  Cheng-Hung Chang

IPC: A61B5/1455 ,  A61B6/00

CPC classification number: A61B5/02427 ,  A61B5/02438 ,  A61B5/14532 ,  A61B5/14552 ,  A61B2562/0233 ,  A61B2562/043 ,  A61B2562/046 ,  A61B2562/146 ,  A61B2562/164 ,  A61B2562/223 ,  G01N21/474 ,  G01N21/49 ,  G01N2021/3144

Abstract: A physiological signal sensing device for examination of human is provided. The physiological signal sensing device includes a light emitting fiber and a light receiving fiber. The light emitting fiber includes a plurality of light emitting portions, wherein the light emitting fiber provides a plurality of sensing beams, and the sensing beams are respectively emitted through the light emitting portions. The light receiving fiber includes a plurality of light receiving portions. The light receiving fiber corresponds to the light emitting fiber. The sensing beams are emitted through the light emitting portions, reflected or refracted by the human. And then the sensing beams are received by the light receiving portions.

Abstract translation: 提供了一种用于人体检查的生理信号感测装置。 生理信号感测装置包括发光光纤和光接收光纤。 发光光纤包括多个发光部分，其中发光光纤提供多个感测光束，并且感测光束分别通过发光部分发射。 光接收光纤包括多个光接收部分。 光接收光纤对应于发光光纤。 感测光束通过发光部分发射，被人体反射或折射。 然后感光束被光接收部分接收。

公开(公告)号：US20110118574A1

公开(公告)日：2011-05-19

申请号：US12721513

申请日：2010-03-10

Applicant: Wen-Ying Chang ,  Cheng-Hung Chang

Inventor： Wen-Ying Chang ,  Cheng-Hung Chang

IPC: A61B5/1455 ,  A61B6/00

CPC classification number: A61B5/02427 ,  A61B5/02438 ,  A61B5/14532 ,  A61B5/14552 ,  A61B2562/0233 ,  A61B2562/043 ,  A61B2562/046 ,  A61B2562/146 ,  A61B2562/164 ,  A61B2562/223 ,  G01N21/474 ,  G01N21/49 ,  G01N2021/3144

Abstract: A physiological signal sensing device for examination of human is provided. The physiological signal sensing device includes a light emitting fiber and a light receiving fiber. The light emitting fiber includes a plurality of light emitting portions, wherein the light emitting fiber provides a plurality of sensing beams, and the sensing beams are respectively emitted through the light emitting portions. The light receiving fiber includes a plurality of light receiving portions. The light receiving fiber corresponds to the light emitting fiber. The sensing beams are emitted through the light emitting portions, reflected or refracted by the human. And then the sensing beams are received by the light receiving portions.

Abstract translation: 提供了一种用于人体检查的生理信号感测装置。 生理信号感测装置包括发光光纤和光接收光纤。 发光光纤包括多个发光部分，其中发光光纤提供多个感测光束，并且感测光束分别通过发光部分发射。 光接收光纤包括多个光接收部分。 光接收光纤对应于发光光纤。 感测光束通过发光部分发射，被人体反射或折射。 然后感光束被光接收部分接收。

公开(公告)号：US20090095980A1

公开(公告)日：2009-04-16

申请号：US11873156

申请日：2007-10-16

Applicant: Chen-Hua Yu ,  Yu-Rung Hsu ,  Chen-Nan Yeh ,  Cheng-Hung Chang

Inventor： Chen-Hua Yu ,  Yu-Rung Hsu ,  Chen-Nan Yeh ,  Cheng-Hung Chang

IPC: H01L29/778 ,  H01L29/786

CPC classification number: H01L29/1033 ,  H01L27/0886 ,  H01L27/1211 ,  H01L29/66795 ,  H01L29/785

Abstract: A semiconductor structure includes a semiconductor fin on a top surface of a substrate, wherein the semiconductor fin includes a middle section having a first width; and a first and a second end section connected to opposite ends of the middle section, wherein the first and the second end sections each comprises at least a top portion having a second width greater than the first width. The semiconductor structure further includes a gate dielectric layer on a top surface and sidewalls of the middle section of the semiconductor fin; and a gate electrode on the gate dielectric layer.

Abstract translation: 半导体结构包括在基板的顶面上的半导体翅片，其中半导体鳍片包括具有第一宽度的中间部分; 以及连接到中间部分的相对端部的第一和第二端部分，其中第一和第二端部部分至少包括具有大于第一宽度的第二宽度的顶部部分。 半导体结构还包括在半导体鳍片的顶表面和中间部分的侧壁上的栅介质层; 以及栅极电介质层上的栅电极。

公开(公告)号：US20090035909A1

公开(公告)日：2009-02-05

申请号：US11831098

申请日：2007-07-31

Applicant: Cheng-Hung Chang ,  Chen-Hua Yu ,  Chen-Nan Yeh ,  Chu-Yun Fu ,  Yu-Rung Hsu ,  Ding-Yuan Chen

Inventor： Cheng-Hung Chang ,  Chen-Hua Yu ,  Chen-Nan Yeh ,  Chu-Yun Fu ,  Yu-Rung Hsu ,  Ding-Yuan Chen

IPC: H01L21/8238

CPC classification number: H01L21/823828 ,  H01L21/823807 ,  H01L21/823821 ,  H01L21/823857 ,  H01L29/66795 ,  H01L29/785

Abstract: The present disclosure provides a method of fabricating a FinFET element including providing a substrate including a first fin and a second fin. A first layer is formed on the first fin. The first layer comprises a dopant of a first type. A dopant of a second type is provided to the second fin. High temperature processing of the substrate is performed on the substrate including the formed first layer and the dopant of the second type.

Abstract translation: 本公开提供了一种制造FinFET元件的方法，包括提供包括第一鳍片和第二鳍片的衬底。 在第一散热片上形成第一层。 第一层包括第一类型的掺杂剂。 第二类型的掺杂剂被提供到第二鳍。 在包括所形成的第一层和第二类型的掺杂剂的衬底上进行衬底的高温处理。