公开(公告)号：US08278191B2

公开(公告)日：2012-10-02

申请号：US12751080

申请日：2010-03-31

Applicant: Owen Hildreth ,  Ching Ping Wong ,  Yonghao Xiu

Inventor： Owen Hildreth ,  Ching Ping Wong ,  Yonghao Xiu

IPC: H01L21/00

CPC classification number: H01L21/30604 ,  B81C1/00071 ,  B81C1/00539 ,  B81C1/00904 ,  H01L21/78

Abstract: Disclosed herein are various embodiments related to metal-assisted chemical etching of substrates on the micron, sub-micron and nano scales. In one embodiment, among others, a method for metal-assisted chemical etching includes providing a substrate; depositing a non-spherical metal catalyst on a surface of the substrate; etching the substrate by exposing the non-spherical metal catalyst and the substrate to an etchant solution including a composition of a fluoride etchant and an oxidizing agent; and removing the etched substrate from the etchant solution.

Abstract translation: 本文公开了与微米，亚微米和纳米尺度上的基底的金属辅助化学蚀刻相关的各种实施方案。 在一个实施方案中，除其他之外，金属辅助化学蚀刻的方法包括提供基材; 在基板的表面上沉积非球形金属催化剂; 通过将非球形金属催化剂和衬底暴露于包括氟化物蚀刻剂和氧化剂的组合物的蚀刻剂溶液来蚀刻该衬底; 并从蚀刻液中去除蚀刻的衬底。

公开(公告)号：US08206776B2

公开(公告)日：2012-06-26

申请号：US12753146

申请日：2010-04-02

Applicant: Jun Li ,  Lianhua Fan ,  Ching-Ping Wong ,  Franklin Cook Lambert

Inventor： Jun Li ,  Lianhua Fan ,  Ching-Ping Wong ,  Franklin Cook Lambert

IPC: B05D5/12 ,  H05H1/24

CPC classification number: H01B3/306 ,  H01B3/441 ,  H01B3/445 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T428/294 ,  Y10T428/2976 ,  Y10T428/2978

Abstract: Methods of reducing pollution problems in power lines systems are disclosed herein. In one embodiment, the method comprises applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications. Further disclosed are methods of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability. Other aspects, features, and embodiments are also discussed and claimed.

Abstract translation: 本文公开了减少电力线系统中的污染问题的方法。 在一个实施方案中，该方法包括将Lotus Effect材料应用于外部电绝缘系统应用的（超疏水性）保护涂层。 进一步公开了制备/制备莲花效应涂层的方法。 选择的无机或聚合物材料被施加在绝缘材料表面上，并且可以制造稳定的超疏水涂层。 可以将各种UV稳定剂和UV吸收剂掺入涂料体系中以增强涂料的UV稳定性。 还讨论和要求保护其他方面，特征和实施例。

公开(公告)号：US20100304101A1

公开(公告)日：2010-12-02

申请号：US12800934

申请日：2010-05-26

Applicant: Wei Lin ,  Ching Ping Wong

Inventor： Wei Lin ,  Ching Ping Wong

IPC: B32B7/02 ,  B65C9/25

CPC classification number: C08J5/005 ,  B82Y30/00

Abstract: Embodiments of the present disclosure include structures including a layer of carbon nanotubes, methods of making structures including a layer of carbon nanotubes, and the like.

Abstract translation: 本公开的实施例包括包括碳纳米管层的结构，制造包括碳纳米管层的结构的方法等。

公开(公告)号：US07527749B2

公开(公告)日：2009-05-05

申请号：US11252371

申请日：2005-10-18

Applicant: Yi Li ,  Kyoung-sik Moon ,  Ching Ping Wong

Inventor： Yi Li ,  Kyoung-sik Moon ,  Ching Ping Wong

IPC: H01B1/06 ,  H01B1/00 ,  H01B1/22

CPC classification number: C09J9/00 ,  C08K5/092 ,  C08K5/175 ,  C09J9/02 ,  C09J2463/00 ,  H05K3/321 ,  H05K2203/122

Abstract: Modified electrically conductive adhesives and methods of preparation thereof, are disclosed.

Abstract translation: 公开了改性导电粘合剂及其制备方法。

公开(公告)号：US20080283269A1

公开(公告)日：2008-11-20

申请号：US11454334

申请日：2006-06-16

Applicant: Samuel Graham, JR. ,  William P. King ,  Ching-ping Wong

Inventor： Samuel Graham, JR. ,  William P. King ,  Ching-ping Wong

IPC: H05K1/09 ,  B29C65/70

CPC classification number: G03F7/0002 ,  B81C1/00031 ,  B81C2201/0185 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  Y10S977/707 ,  Y10S977/887

Abstract: Systems and methods of nanomaterial transfer are described. A method of nanomaterial transfer involving fabricating a template and synthesizing nanomaterials on the template. Subsequently, the nanomaterials are transferred to a substrate by pressing the template onto the substrate. In some embodiments, the step of transferring the nanomaterials involves pressing the template onto the substrate such that the nanomaterials are embedded below a surface layer of the substrate. In some embodiments, the temperature of the plurality of nanomaterials is raised to assist the transfer of the nanomaterials to the substrate.

Abstract translation: 描述纳米材料转移的系统和方法。 纳米材料转移的方法涉及制作模板并在模板上合成纳米材料。 随后，通过将模板压在衬底上，将纳米材料转移到衬底。 在一些实施方案中，转移纳米材料的步骤包括将模板压在衬底上，使得纳米材料嵌入在衬底的表面层下面。 在一些实施方案中，提高多个纳米材料的温度以辅助将纳米材料转移到基底。

公开(公告)号：US07189795B2

公开(公告)日：2007-03-13

申请号：US10621022

申请日：2003-07-16

Applicant: William Franklin Burgoyne, Jr. ,  Ching-Ping Wong ,  Silvia Liong

Inventor： William Franklin Burgoyne, Jr. ,  Ching-Ping Wong ,  Silvia Liong

IPC: C08G65/48

CPC classification number: C08G65/40 ,  C08G65/48 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: A poly(arylene ether) polymer includes polymer repeat units of the following structure: —(O—Ar1—O—Ar2)m—(O—Ar3—O—Ar4)n— where Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is 0.05 to 0.95, n is 1-m, and at least one of the aryl radicals is grafted to at least one hydroxyalkyl group, such as 2-undecanol. The polymer is especially useful in electrically conductive adhesives.

Abstract translation: 聚（亚芳基醚）聚合物包括具有以下结构的聚合物重复单元：<？in-line-formula description =“In-line formula”end =“lead”→ - （O-Ar 1 n - <？in-line-formula description =“In-line Formulas”end =“tail”？>其中Ar <1> ，Ar <2> Ar 3 3和Ar 4是相同或不同的芳基，m为0.05至0.95，n为1-m，并且至少一个芳基被接枝到 至少一个羟烷基，如2-十一烷醇。 聚合物特别适用于导电粘合剂。

公开(公告)号：US06740192B1

公开(公告)日：2004-05-25

申请号：US09671963

申请日：2000-09-27

Applicant: Daoqiang Lu ,  Ching-Ping Wong

Inventor： Daoqiang Lu ,  Ching-Ping Wong

IPC: C09J1104

CPC classification number: H01B1/24 ,  C08G18/10 ,  C08G59/28 ,  C08L63/00 ,  C08L75/04 ,  C08L2666/22 ,  C09J5/06 ,  C09J9/02 ,  C09J163/00 ,  C09J175/04 ,  C09J2463/00 ,  C09J2475/00 ,  H01B1/22 ,  H05K3/321 ,  H05K2201/0239 ,  C08G18/2845

Abstract: A method of joining electrically conductive materials comprises: Applying an electrically conductive adhesive to at least one electrically conductive material(s), wherein the electrically conductive adhesive is prepared from an epoxide-modified polyurethane, a cross-linking agent, an adhesion promotor and a conductive filler; and joining the electrically conductive material(s) with the applied adhesive to a substrate and curing the adhesive.

Abstract translation: 一种接合导电材料的方法包括：将导电粘合剂施加到至少一种导电材料上，其中导电粘合剂由环氧化物改性的聚氨酯，交联剂，粘合促进剂和 导电填料; 并将所施加的粘合剂的导电材料连接到基底上并固化粘合剂。

公开(公告)号：US06498260B2

公开(公告)日：2002-12-24

申请号：US09820549

申请日：2001-03-29

Applicant: Lejun Wang ,  Haiying Li ,  Ching-Ping Wong

Inventor： Lejun Wang ,  Haiying Li ,  Ching-Ping Wong

IPC: C07D30302

CPC classification number: C08G59/686 ,  C07D303/16 ,  C07D303/36 ,  C08G59/24 ,  C08G59/28 ,  C08G59/4215 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/799 ,  H01L24/98 ,  H01L2224/73203 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00

Abstract: A reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; and a curing accelerator; wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.

Abstract translation: 提供了一种用于电子封装系统中的可再加工的环氧底层填充物，该电子封装系统包括集成电路，有机印刷线路板以及在它们之间形成的至少一个共晶焊点。 密封剂的示例性实施方案包括：脂环族环氧化物; 有机硬化剂; 和固化促进剂; 其中所述脂环族环氧化物包括碳酸酯或氨基甲酸酯基团。 密封剂还可以包括填料，例如二氧化硅填料。 还提供了一种用于形成上述可再加工环氧底层填料的方法。

公开(公告)号：US06180696B2

公开(公告)日：2001-01-30

申请号：US09025532

申请日：1998-02-18

Applicant: Ching-Ping Wong ,  Song-Hua Shi

Inventor： Ching-Ping Wong ,  Song-Hua Shi

IPC: C08K310

CPC classification number: C08G59/68 ,  C08G59/42 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/73203 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

Abstract: An epoxy material suitable for no-flow underfilling processes with high glass transition temperature can be obtained by curing a solvent free formulation containing an epoxy resin, an organic carboxylic acid anhydride hardener, a curing accelerator, a fluxing agent, a viscosity controlling agent, a coupling agent, and a surfactant.

Abstract translation: 通过固化含有环氧树脂，有机羧酸酐固化剂，固化促进剂，助熔剂，粘度控制剂，固化剂，固化剂等的无溶剂制剂，可以得到适用于高玻璃化转变温度的无流动底填充方法的环氧树脂材料。 偶联剂和表面活性剂。

公开(公告)号：US06172141B2

公开(公告)日：2001-01-09

申请号：US09226876

申请日：1999-01-07

Applicant: Ching-Ping Wong ,  Lejun Wang

Inventor： Ching-Ping Wong ,  Lejun Wang

IPC: C08K520

CPC classification number: C08K3/36 ,  C08K5/0008 ,  C08L63/00

Abstract: A reworkable epoxy underfill encapsulant is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. A preferred embodiment of the encapsulant includes: a cycloaliphatic diepoxide; an organic hardener; a curing accelerator; a silica filler; and an additive, with the additive providing thermal reworkability to the composition. A method is also provided for forming the aforementioned reworkable epoxy underfill encapsulants.

Abstract translation: 提供了一种用于电子封装系统的可再加工的环氧底层填料密封剂，该电子封装系统包括集成电路，有机印刷线路板以及形成在其间的至少一个共晶焊点。 密封剂的优选实施方案包括：脂环族二环氧化物; 有机硬化剂; 固化促进剂; 二氧化硅填料; 和添加剂，其中添加剂为组合物提供热可再加工性。 还提供了一种用于形成上述可再加工环氧底层填料密封剂的方法。